Analog Devices LTC2949 Bedienungsanleitung

LTC2949

Rev A

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TYPICAL APPLICATION

FEATURES DESCRIPTION

Current, Voltage, and Charge Monitor for

High Voltage Battery Packs

The LTC

2949 is a high precision current, voltage, tem-

perature,chargeandenergymeterforelectricaland hybrid

vehicles and other isolated current sense applications. It

infers charge and energy flowing in and out of the battery

pack by monitoring simultaneously the voltage drop over

up to two sense resistors and the battery pack voltage.

Low offset ΔΣADCs ensure accurate measurement of

voltage and current with insignificant power loss. Con-

tinuous integration of current and power ensures lossless

tracking of charge and energy delivered or received by

the battery pack.

The built-in serial interface can be configured to support

isolated isoSPI communication to the host or as SPI

interface.

The LTC2949 features 12 internally buffered high imped-

ance inputs (V1 to V12) for measuring voltages from

external sensors or resistor dividers allowing to measure

temperatures, HV-Link voltages, chassis isolation and

supervise contactor states. LTC2949 has up to five pro-

grammable digital outputs which can be set to ground,

supply or toggling at 400kHz.

Programmable threshold and tracking registers reduce

digital traffic to the host.

Electric Vehicle Battery Meter

APPLICATIONS

n Electric and Hybrid Vehicles

n Isolated Current Sensing

n Backup Battery Systems

n High Power Portable Equipment

All registered trademarks and trademarks are the property of their respective owners.

n Measures Battery Stack Voltage, Current and Power

n Indicates Accumulated Battery Charge and Energy

n 20-Bit Current Measurement with <1μV Offset

n Built-In Isolated isoSPI™ or SPI Interface

n LTC68xx/ADBMS68xx Compatible, Supports

Synchronous Measurements with Cell Monitors

n Up to 12 Buffered Voltage Measurement Inputs

n Up to 5 GPIOs, Configurable to Drive Ground, Supply

or Toggling at 400kHz

n High or Low Side Current Sense

n 0.3% Current and Voltage Accuracy

n 1% Energy and Charge Accuracy

n True Average ADCs

n I2C EEPROM Interface to Store Board Calibration Factors

n Threshold Registers for all Measured Quantities

n Engineered for ISO26262 Compliant Systems

n Open Wire Detection on Input Pins

n Available in 48-Lead LQFP Package

n AEC-Q100 Qualified for Automotive Applications

2949 TA01

6.5M

30k

50µΩ

6.5M

30k

100k

3.3M

22k

6.5M

100k

1µF

STD4NK100Z

30k

MASTER

GND

LTC2949

BATP

I1P

I2P

isoSPI

LINK+

LINK–

VREF

BATM

I1M

I2M

GND

SPI

CHASSIS-GND

GPIO1

BAT–

BAT+

800V

CELL

MONITORS

isoSPI A

LTC681x

isoSPI B

isoSPI A

LTC681x

isoSPI B

STACK

VOLTAGE

TEMPERATURE

LINK VOLTAGE

LTC6820

AVCC

DVCC

CURRENT

CHARGE

POWER

ENERGY

SPI

isoSPI

GND

ISOLATION

RESISTANCE

ISOLATED COMMUNICATION

LT830x

• • •

LTC2949

Rev A

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TABLE OF CONTENTS

Features............................................................................................................................ 1

Applications ....................................................................................................................... 1

Typical Application ............................................................................................................... 1

Description......................................................................................................................... 1

Absolute Maximum Ratings..................................................................................................... 3

Order Information................................................................................................................. 3

Pin Configuration ................................................................................................................. 3

Electrical Characteristics ........................................................................................................ 4

Typical Performance Characteristics .........................................................................................10

Pin Functions .....................................................................................................................11

Pin Functions .....................................................................................................................12

Block Diagram....................................................................................................................13

Operation..........................................................................................................................14

Overview............................................................................................................................................................... 14

Modes of Operation .............................................................................................................................................. 15

Data Acquisition Channels .................................................................................................................................... 16

Power Measurement............................................................................................................................................. 19

Charge, Energy and Time...................................................................................................................................... 20

Overcurrent Comparators ..................................................................................................................................... 21

SERIAL INTERFACES ............................................................................................................22

Serial Interfaces Overview .................................................................................................................................... 22

4-Wire Serial Peripheral Interface (SPI) Physical Layer........................................................................................ 22

2-Wire Isolated Interface (isoSPI) Physical Layer................................................................................................. 23

Data Link Layer..................................................................................................................................................... 28

Network Layer....................................................................................................................................................... 28

REGISTER MAP...................................................................................................................41

REGISTER Description ..........................................................................................................42

MEMORY MAP AND Paging Mechanism............................................................................................................... 42

Register Map PAGE0............................................................................................................................................. 44

Register Map PAGE1 ............................................................................................................................................ 62

Application Information.........................................................................................................68

Temperature Measurement .................................................................................................................................. 68

Sense Resistor Temperature Compensation ......................................................................................................... 69

Current and Voltage Input Filtering ....................................................................................................................... 74

Powering the LTC2949 ......................................................................................................................................... 75

Package Description ............................................................................................................78

Revision History .................................................................................................................79

Typical Application ..............................................................................................................80

Related Parts .....................................................................................................................80

LTC2949

Rev A

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PIN CONFIGURATIONABSOLUTE MAXIMUM RATINGS

(Notes 1, 2)

DNC

V10

V11

V12

SCL

SDA

BYP1

DGND

AGND

AVCC

DVCC

DNC

VBATP

VBATM

DNC

I1P

CF1P

CF1M

I1M

I2M

CF2M

CF2P

I2P

DNC

VREF

CLKO

CLKI

DNC

CSB (IM)

SCK (IP)

SDO (IBIAS

)

SDI (ICMP)

IOVCC

BYP2

TOP VIEW

LXE PACKAGE

48-LEAD (7mm ×7mm) PLASTIC LQFP

DNC: DO NOT CONNECT

TJMAX = 150°C, θJA = 20.46°C/W, θJC = 3.68°C/W

EXPOSED PAD (PIN 49), CONNECT TO AGND

GND

ORDER INFORMATION

AUTOMOTIVE PRODUCTS**

TRAY (250PC) TAPE AND REEL (2000PC) PART MARKING* PACKAGE DESCRIPTION MSL RATING TEMPERATURE RANGE

LTC2949ILXE#3ZZPBF LTC2949ILXE#3ZZTRPBF LTC2949LXE 48-LEAD PLASTIC eLQFP 3 –40°C to 85°C

LTC2949HLXE#3ZZPBF LTC2949HLXE#3ZZTRPBF LTC2949LXE 48-LEAD PLASTIC eLQFP 3 –40°C to 125°C

Contact the factory for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.

Tape and reel specifications. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.

**Versions of this part are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. These

models are designated with a #3ZZ suffix. Only the automotive grade products shown are available for use in automotive applications. Contact your local

Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models.

Supply Pins

AVCC to AGND ........................................ –0.3V to 14.5V

DVCC to DGND........................................ –0.3V to 14.5V

AVCC to DVCC........................................... –0.1V to 0.1V

DGND to AGND......................................... –0.1V to 0.1V

Analog Pins

I1P, I1M, I2P, I2M ......................... –0.3V to VAVCC + 0.3V

I1P to I1M, I2P to I2M ..............................................±1V

VBATP, VBATM ............................. –0.3V to VAVCC + 0.3V

V1-V12......................................... –0.3V to VAVCC + 0.3V

CLKO, DNC.........................................................(Note 3)

Digital Input/Output Pins

IOVCC, CLKI, CSB(IM), SCK(IP)................... –0.3V to 5V

SDI (ICMP), SDO (IBIAS)............................. –0.3V to 5V

SDA, SCL ................................................ –0.3V to 2.75V

Current In/Out of Pins

IP, IM ....................................................................±30mA

SDO (IBIAS) .............................................. –1mA to 9mA

V8-V12 ...................................................................±2mA

VREF (Note 4) .......................................................±2mA

BYP1 (Note 4)......................................... –10mA to 0mA

BYP2 (Note 4)......................................... –10mA to 0mA

Operating Ambient Temperature Range

LTC2949I.................................................–40°C to 85°C

LTC2949H.............................................. –40°C to 125°C

Storage Temperature Range…............... –65°C to 150°C

LTC2949

Rev A

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ELECTRICAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

Power Supply

VAVCC Analog Supply Voltage l4.5 14 V

VDVCC Digital Supply Voltage l4.5 14 V

VUVLO Supply Undervoltage Lockout Threshold VAVCC, VDVCC Falling l4.5 V

ICC Average Supply Current into AVCC and DVCC Core State: STANDBY or MEASURE l16 20 mA

Core State: SLEEP 9 15 µA

Core State: SLEEP l150 µA

Additional DVCC Supply Current if isoSPI in

READY/ACTIVE States

Note:ACTIVE State Current Assumes tCLK = 1μs,

(Note 5)

RB1 + RB2 = 2k READY l4.8 5.8 mA

ACTIVE l6.1 7.8 mA

RB1 + RB2 = 20k READY l2.1 3 mA

ACTIVE l2.5 3.5 mA

VBYP1 BYP1 Regulated Output Voltage l2.25 2.5 2.75 V

BYP1 Load Current l–10 0 mA

BYP1 Load Regulation Error ILOAD = –10mA l–15 0 mV

BYP1 Undervoltage Lockout Threshold l2.25 V

VBYP2 BYP2 Regulation Output Voltage l3 3.25 3.6 V

BYP2 Load Current l–10 0 mA

BYP2 Load Regulation Error ILOAD = –10mA l–60 mV

Thermal Shutdown Temperature 170 °C

Current Sense ADC

Resolution (No Missing Codes) Slow Mode Filtered (Note 7) l20 Bit

Slow Mode (Note 7) l18 Bit

Fast Mode (Note 7) l15 Bit

Full-Scale Differential Input Voltage VI1P-VI1M, VI2P-VI2M ±124 mV

VDIFIDifferential Input Voltage Range VI1P-VI1M, VI2P-VI2M l±110 mV

Pin Voltage of I1P, I1M, I2P, I2M l–0.11 VAVCC+0.11 V

Current Sense Quantization Step Slow Mode Filtered 237.5 nV

Slow Mode 950 nV

Fast Mode 7.60371 µV

CFPx Input Leakage Current at CF1P, CF1M, I1P,

I1M, CF2P, CF2M, I2P, I2M Core State = SLEEP/STANDBY l60 nA

Differential Input Current from CF1P to CF1M,

CF2P to CF2M Core State:MEASURE;Pin Voltages: 0V ≤

VCF1P, VCF1M, VI1P, VI1M, VCF2P, VCF2M,

VI2P, VI2M ≤ VAVCC

VDIFI/100kΩ µA

Noise Slow Mode Filtered 160 nVRMS

Slow Mode 320 nVRMS

Fast Mode 3 µVRMS

Gain Error |VDIFI| ≤ 110mV 0.15 %

l0.3 %

Offset Voltage IADCx, IxP, IxM = 0V

VAVCC = VDVCC = 5V

Slow Mode l0 ±1 µV

Fast Mode l0 ±2 µV

Total Unadjusted Error |VDIFI|≥ 25mV l0.3 %

The ldenotes the specifications which apply over the full operating

temperature range, otherwise specifications are at TA= 25°C.

LTC2949

Rev A

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ELECTRICAL CHARACTERISTICS

The ldenotes the specifications which apply over the full operating

temperature range, otherwise specifications are at TA= 25°C.

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

Input Voltage Common Mode Rejection at DC l100 dB

Input Sampling Frequency 10.48 MHz

Conversion Time Slow Mode Filtered 400 ms

Slow Mode 100 ms

Fast Mode l0.782 0.8211 ms

Voltage Measurement by Power ADC

Resolution (No Missing Codes) Slow Mode (Note 7) l18 Bit

Fast Mode (Note 7) l15 Bit

VFSVFull-Scale Differential Input Voltage VVBATP – VVBATM ±6.14 V

VDIFVDifferential Input Voltage Range VVBATP – VVBATM l±4.8 V

Pin Voltage of VBATP, VBATM VAVCC ≥ 5V l–0.1 VAVCC+0.1 V

VAVCC < 5V l–0.1 VAVCC-1.5 V

LSBVDifferential Input Voltage Quantization Step Slow Mode 46.875 µV

Fast Mode 375.183 µV

Input Leakage Current Core State: SLEEP/STANDBY l60 nA

Differential Input Resistance Core State: MEASURE; Pin Voltages 0V

≤ VBATP, VBATM ≤ VAVCC

50 MΩ

l20 MΩ

Gain Error l0.3 %

Offset VBATP = VBATM = 0V l0 ±3 LSBV

Voltage Total Unadjusted Error 1V ≤ |VDIFV| ≤ 4.8V l0.4 %

Input Voltage Common Mode Rejection at DC l80 dB

Noise Slow Mode (Note 7) 3 µVRMS

Fast Mode (Note 7) 30 µVRMS

Input Sampling Rate 5.24 MHz

Conversion Time Slow Mode 100 ms

Fast Mode l0.782 0.8211 ms

Power Measurement by Power ADC

Resolution (No Missing Codes) Slow Mode (Note 7) l18 Bit

Fast Mode (Note 7) l11 Bit

FSPFull-Scale Power FSP = VFSV• VFSI/RISENSE/VDIVv±0.76504 [V2/Ω]

LSBPPower Quantization Step LSBP= FSP/217 5.8368 µ[V2/Ω]

POS Power Offset VDIF1= 0 1 LSBP

TUEPPower Total Unadjusted Error 1V ≤ |VDIFV| ≤ 4.8V, 25mV ≤ |VDIFI| ≤

110mV

l0.9 %

RMS Noise Slow Mode;VBATP –VBATM = 4.8V (Note 7) 0.3 LSBP

Slow Mode;VBATP –VBATM = 0V (Note 7) 0.03 LSBP

Input Sampling Frequency 5.24 MHz

Power Modulation Frequency 5.24 MHz

Conversion Time Slow Mode 100 ms

Fast Mode l0.782 0.8211 ms

LTC2949

Rev A

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ELECTRICAL CHARACTERISTICS

The ldenotes the specifications which apply over the full operating

temperature range, otherwise specifications are at TA= 25°C.

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

Energy Measurement

TUEEEnergy Total Unadjusted Error 1V ≤ |VDIFV| ≤ 4.8V, 25mV ≤ |VDIFI| ≤

110mV, Ideal External Clock or 4MHz

Crystal

l0.9 %

1V ≤ |VDIFV| ≤ 4.8V, 25mV ≤ |VDIFI| ≤

110mV, Internal Clock

l1.9 %

Charge Measurement

TUECCharge Total Unadjusted Error 1V ≤ |VDIFV| ≤ 4.8V, 25mV ≤ |VDIFI| ≤

110mV, Ideal External Clock or 4MHz

Crystal

l0.4 %

1V ≤ |VDIFV| ≤ 4.8V, 25mV ≤ |VDIFI| ≤

110mV, Internal Clock

l1.4 %

Voltage Measurement by AUXILIARY ADC

Resolution (No Missing Codes) (Note 7) l15 Bit

VFSAUX Full-Scale Differential Input Voltage VVBATP – VVBATM, VMUXP – VMUXN ±6.14 V

VDIFAUX Differential Input Voltage Range VVBATP – VVBATM, VMUXP – VMUXN l±4.8 V

Pin Voltage of VBATP, VBATM, V1 – V12, CF1P,

CF1M, CF2P, CF2M VAVCC ≥ 5V l–0.1 VAVCC+0.1 V

VAVCC < 5V l–0.1 VAVCC–1.5 V

LSBAUX Differential Voltage Quantization Step Slow Mode 375 µV

Fast Mode 375.183 µV

Input Leakage Current l1 60 nA

Differential Input Resistance l40 MΩ

Gain Error |VDIFAUX| ≤ 4.8V l0.3 %

Offset VBATP = VBATM = 0V l0 ±1 LSBV

Total Unadjusted Error 1V ≤ |VDIFV| ≤ 4.8V l0.4 %

Input Voltage Common Mode Rejection at DC l80 dB

Sampling Rate 5.24 MHz

Conversion Time l0.782 0.8211 ms

On-Die Temperature Measurement by AUXILIARY ADC

Resolution (No Missing Codes) (Note 7) l13 Bit

Full-Scale Temperature 819.2 K

ΔTLSB Temperature Quantization Step 0.2 K

Total Unadjusted Error ±3 K

Conversion Time 13.1 ms

Self-Heating 20 K/W

Supply Voltage Measurement by AUXILIARY ADC

Resolution (No Missing Codes) (Note 7) l14 Bit

Full-Scale Differential Input Voltage 18.43 V

A/DVCC Measurement Quantization Step 2.2583 mV

Total Unadjusted Error l2 ±5 %

Conversion Time 6.55 ms

AUX MUX

Signal Range l–0.1 VAVCC+0.1 V

LTC2949

Rev A

For more information www.analog.com

ELECTRICAL CHARACTERISTICS

The ldenotes the specifications which apply over the full operating

temperature range, otherwise specifications are at TA= 25°C.

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

Pull-Up Current Source Pin Voltage < VAVCC − 3.0V l–250 –150 µA

Pull-Down Current Source Pin Voltage > 2.5V l200 250 µA

Reference Voltages

VREF Reference Pin Voltage 3 V

VREF Error l±1 %

VREF Temperature Coefficient 7 ppm/K

VREF Long Term Drift 80 ppm/√kHr

VREF Load Regulation Error –0.5mA ≤ ILOAD ≤ 0.5mA l–5 0 mV

VREF2 Internal Redundant Reference Voltage 2.39 V

VREF2 Error l±0.85 %

VREF2 Temperature Coefficient 10 ppm/K

VREF2 Long Term Drift 80 ppm/√kHr

Overcurrent Comparator

Pin Voltages I1P, I1M I2P, I2M l–0.11 VAVCC+0.11 V

Total Unadjusted Error |Vthr| ≤ 103mV l±5 mV

|Vthr| > 103mV l±10 mV

|Vthr| = 310mV l±20 mV

Programmable Deglitch Time Delay Tdegl 20, 80, 320µs lTdegl −10 Tdegl +37 µs

Tdegl 1280µs lTdegl −26 Tdegl +56 µs

Digital Input CLKI

Logic Input Threshold l0.4 2 V

Input Current DC Current l±1 μA

Input Capacitance (Note 7) l10 pF

External Clock Frequency l0.1 25 MHz

General Purpose Outputs GPIOx

Low Level Output Voltage at GPIOx IGPIOx = 0.5mA l0.4 V

High Level Output Voltage at GPIOx IGPIOx = –0.25mA lVDVCC

–0.5 V

GPIOx Toggling Frequency l370 400 430 kHz

SPI Interface DC Specification IOVCC, CSB, SCK, SDI, SDO

VIOVCC SPI Mode IOVCC Operating Voltage l1.8 4.5 V

Pin Voltages CSB, SCK, SDI, SDO lVIOVCC V

Logic Input Threshold (CSB, SCK, SDI) l0.3 •

VIOVCC

0.7 •

VIOVCC

DC Input Current (CSB, SCK, SDI) l±1 µA

Input Capacitance (CSB, SCK, SDI) (Note 7) l10 pF

Low Level Output Voltage at SDO VIOVCC ≥ 3.3V, ISDO = 3mA, 1.8V ≤ VIOVCC

≤ 3.3V, ISDO = 1mA

l0.4 V

SPI Timing Requirements (See Figure 7)

tCLK SCK Period (Note 6) l1 μs

t1SDI Setup Time Before SCK Rising Edge l25 ns

t2SDI Hold Time After SCK Rising Edge l25 ns

LTC2949

Rev A

For more information www.analog.com

ELECTRICAL CHARACTERISTICS

The ldenotes the specifications which apply over the full operating

temperature range, otherwise specifications are at TA= 25°C.

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

t3SCK Low tCLK = t3+ t4≥ 1μs l200 ns

t4SCK High tCLK = t3+ t4≥ 1μs l200 ns

t5CSB Rising Edge to CSB Falling Edge l0.65 μs

t6SCK Rising Edge to CSB Rising Edge (Note 6) l0.8 μs

t7CSB Falling Edge to SCK Rising Edge (Note 6) l1 μs

t8SCK Falling Edge to SDO Valid (Note 9), VIOVCC ≥ 3.3V l60 ns

(Note 9), VIOVCC < 3.3V l150 ns

isoSPI DC Specifications (See Figure 10)

Voltage at IOVCC to Select isoSPI l0.5 V

VIBIAS Voltage on IBIAS Pin READY/ACTIVE State l1.9 2 2.1 V

IDLE 0 V

IBIsolated Interface Bias Current RBIAS = 2kΩ to 20kΩ l0.1 1 mA

AIB Isolated Interface Current Gain VA≤ 1V, IB= 1mA l18 20 22 mA/mA

IB= 0.1mA l17 20 24.5 mA/mA

VATransmitter Pulse Amplitude VA= |VIP – VIM|l1.4 V

VICMP Threshold-Setting Voltage on ICMP Pin VTCMP = ATCMP • VICMP l0.2 1.5 V

Input Leakage Current on ICMP Pin VICMP = 0V to VBYP2 l±1 µA

Leakage Current on IP and IM Pins IDLE State, VIP or VIM = 0V to VBYP2 l±1 µA

ATCMP Receiver Comparator Threshold Voltage Gain VCM = VBYP2/2 to VBYP2 – 0.2V,

VICMP = 0.2V to 1.5V

l0.4 0.5 0.6 V/V

VCM Receiver Common Mode Bias IP, IM Not Driving VBYP2 –

VICMP/3 –

167mV

Receiver Input Resistance Single-Ended to IP, IM l27 35 43 kΩ

isoSPI IDLE/WAKE-UP Specifications (See Figure 3)

VWAKE Differential Wake-Up Voltage tDWELL = 240ns l200 mV

tDWELL Dwell Time at VWAKE Before Wake Detection VWAKE = 200mV l240 ns

tREADY Start-Up Time After Wake Detection l10 µs

tIDLE Idle Timeout Duration l4.3 6.4 8 ms

isoSPI Pulse Timing Specifications (See Figures 10,11)

tFILT(CS) Chip-Select Signal Filter Receiver l70 90 115 ns

tWNDW(CS) Chip-Select Valid Pulse Window Receiver l220 270 330 ns

t1/2PW(D) Data Half-Pulse Width Transmitter l40 50 60 ns

tFILT(D) Data Signal Filter Receiver l10 25 35 ns

tINV(D) Data Pulse Inversion Delay Transmitter l40 55 69 ns

tWNDW(D) Data Valid Pulses Window Receiver l70 90 110 ns

tRTN Data Return Delay l485 625 ns

I2C Interface DC Specification (SCL, SDA)

Logic Input Threshold (SDA) l0.9 1.6 V

DC Input Current (SDA) l±1 μA

Input Capacitance (SDA) (Note 7) l10 pF

Low Level Output Voltage at SDA, SCL I = 0.5mA l0.4 V

LTC2949

Rev A

For more information www.analog.com

ELECTRICAL CHARACTERISTICS

The ldenotes the specifications which apply over the full operating

temperature range, otherwise specifications are at TA= 25°C.

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

I2C Interface Timing Specification (SCL, SDA)

fSCL(MAX) Maximum SCL Clock Frequency l8 10 kHz

tSCLLO SCL Low Period l80 µs

tSDALO SDA Low Period l80 µs

tBUF(MIN) Bus Free Time Between STOP/START l30 µs

tSU,STA(MIN) Minimum Repeated START Setup Time l30 µs

tHD,STA(MIN) Minimum Hold Time (Repeated) START

Condition

l30 µs

tSU,STO(MIN) Minimum Setup Time for STOP Condition l30 µs

tSU,DAT(MIN) Minimum Data Setup Time Input l30 µs

tHD,DAT(MIN) Minimum Data Hold Time Input l0 ns

tHD,DATO Minimum Data Hold Time Output l30 µs

tOF Data Output Fall Time (Notes 7, 8) l20 + 0.1

• CB

Digital Core Timings (See Figure 3)

tBOOT Core Boot-Up Time from SLEEP or POWER-OFF

to STANDBY AVCC/DVCC Pins at Minimum Operating

Voltage

l100 ms

tIDLE_CORE Core STANDBY Cycle Time (Note 10) l17 20 ms

tCONT Core MEASURE Cycle Time (Note 11) l90 100 110 ms

tMLCK,M Memory Lock Request to Acknowledge Time Core Status MEASURE l130 ms

tMLCK,S Memory Lock Request to Acknowledge Time Core Status STANDBY l40 ms

tACKN Time from Core Entering STANDBY to Return to

SLEEP, When Wake-Up is not Confirmed No Write of 0x0 to Reg. WKUPACK, No

Write of 0x8 to Reg. OPCTRL

l0.6 1.5 s

Time Base

TUETB TUE Time Base Internal Clock 0.5 %

l1 %

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect the device

reliability and lifetime.

Note 2: Positive currents flow into pins, negative currents flow out of pins.

Minimum and maximum values refer to absolute values.

Note 3: Do not apply a voltage or current source to these pins. They must

be unconnected, connected to capacitive loads or connected to a crystal

according to their pin description. Otherwise permanent damage may

occur.

Note 4: Do not apply a voltage source to these pins. Overloading these

pins might disrupt operation.

Note 5: Active supply current (ICC) is dependent on the amount of time

that the output drivers are active on IP and IM. During those times ICC will

increase by the 20 • IBdrive current. For the maximum data rate 1MHz, the

drivers are active approximately 5% of the time.

Note 6: These timing specifications are dependent on the delay through

the cable, and include allowances for 50ns of delay each direction. 50ns

corresponds to 10m of CAT-5 cable (which has a velocity of propagation of

66% the speed of light). Use of longer cables would require derating these

specs by the amount of additional delay.

Note 7: Guaranteed by design and characterization, not subject to

production test.

Note 8: CB= capacitance of one bus line in pf (10pF < CB< 400pF)

Note 9: These specifications do not include rise time of SDO due to pull up

resistance and load capacitance on SDO pin.

Note 10: Cycle time at which STATUS/FAULTS and VREF registers are

updated.

Note 11: Cycle time at which STATUS/ALERT/FAULTS registers and all

slow channel measurement results are updated after the first update. The

first update after enabling any measurement is typically 50ms delayed.

LTC2949

Rev A

For more information www.analog.com

TYPICAL PERFORMANCE CHARACTERISTICS

Current Measurement Gain Error

vs Temperature

Current Measurement Offset

vs Temperature

Current Measurement Offset

Distribution

Current Measurement Noise Filter

Response

Power as Voltage Gain Error vs

Temperature

AUXADC Gain Error vs

Temperature

Auxiliary ADC Measurement

Offset vs Temperature

Time Base Internal Clock TUE vs

Temperature

ADC Conversion Time Error Slow/

Fast vs Temperature

TEMPERATURE (°C)

–50

–25

100

125

–0.20

–0.15

–0.10

–0.05

0.00

0.05

0.10

0.15

0.20

CURRENT MEASUREMENT GAIN ERROR (%)

Gain Error vs Temperature

Current Measurement

2949 G01

TEMPERATURE (°C)

–50

–25

100

125

–3

–2

–1

CURRENT MEASUREMENT OFFSET (µV)

Offset vs Temperature

Current Measurement

2949 G02

12 Randomly Chosen Demo Boards

OFFSET VOLTAGE (µV)

–1

–0.5

0.5

NUMBER OF DEMO BOARDS

Distribution

Current Measurement Offset

2949 G03

Slow Mode Filtered

Slow Mode

Fast Mode

FREQUENCY (Hz)

0.1

100

10k

100k

–80

–60

–40

–20

NOISE REJECTION (dB)

Noise Filter Response

Current Measurement

2949 G04

TEMPERATURE (°C)

–50

–25

100

125

–0.3

–0.2

–0.1

0.0

0.1

0.2

0.3

VOLTAGE MEASUREMENT GAIN ERROR (%)

vs Temperature

Power as Voltage Gain Error

2949 G05

TEMPERATURE (°C)

–50

–25

100

125

–0.3

–0.2

–0.1

0.0

0.1

0.2

0.3

VOLTAGE MEASUREMENT GAIN ERROR (%)

vs Temperature

AUXADC Gain Error

2949 G06

TEMPERATURE (°C)

–50

–25

100

125

–3

–2

–1

AUXILIARY ADC MEASUREMENT OFFSET (LSB)

Offset vs Temperature

AUXILIARY ADC MEASUREMENT

2949 G07

TEMPERATURE (°C)

–50

–25

100

125

–0.3

–0.2

–0.1

0.0

0.1

0.2

0.3

TIME BASE INTERNAL CLOCK TUE (%)

TUE vs Temperature

Time Base Internal Clock

2949 G08

TEMPERATURE (°C)

–50

–25

100

125

–6

–4

–2

ADC CONVERSION TIME SLOW/FAST (%)

Slow/Fast vs Temperature

ADC Conversion Time Error

2949 G09

Inhaltsverzeichnis

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