Aries Embedded M100PF Bedienungsanleitung
M100PF Hardware Manual
M100PF Hardware Manual
Version: 2.1
Created on: May 19, 2022
Created by: Diana Korchmar
Page 1 of 24
©ARIES Embedded GmbH. The information contained in this document is strictly confiden-
tial. This document may not be copied, reproduced, translated, changed or distributed
without the written approval of ARIES Embedded GmbH
M100PF Hardware Manual
CONTENTS
1 About this manual 4
1.1 Imprint ................................................ 4
1.2 Disclaimer ............................................... 4
1.3 Copyright ............................................... 5
1.4 Registered Trademarks ........................................ 5
1.5 Care and Maintenance ........................................ 5
1.6 Change Log .............................................. 5
2 Overview 6
2.1 M100PF ................................................ 6
2.2 Feature Set .............................................. 7
2.3 Block Diagram ............................................ 8
2.4 Dimensions .............................................. 9
2.5 Part Overview ............................................ 10
2.6 Handling Recommendations ..................................... 11
3 Resources 12
3.1 Components .............................................. 12
3.1.1 FPGA ............................................. 12
3.1.2 DDR3-RAM ......................................... 12
3.1.3 e.MMC Flash ......................................... 14
3.1.4 SPI NOR Flash ........................................ 14
3.1.5 PMIC ............................................. 14
3.1.6 IO-Expander ......................................... 14
3.1.7 PIC Microcontroller ..................................... 15
3.1.8 RTCC ............................................. 15
3.1.9 SERDES ........................................... 15
3.2 SPI Configuration and Programming ................................ 16
3.3 Clocking ................................................ 16
3.4 I2C ................................................... 16
3.5 JTAG ................................................. 18
3.6 UART ................................................. 18
3.7 Pin Out ................................................ 18
3.7.1 CAN .............................................. 18
3.7.2 Ethernet ............................................ 19
3.7.3 SD Card ............................................ 19
3.7.4 GPIO ............................................. 20
3.7.5 Samtec Connector ...................................... 21
3.7.6 Connector J1 ......................................... 21
3.7.7 Connector J2 ......................................... 23
CONTENTS Page 2 of 24
M100PF Hardware Manual
CHAPTER
ONE
ABOUT THIS MANUAL
1.1 Imprint
Adress:
ARIES Embedded GmbH
Schöngeisinger Str. 84
D-82256 Fürstenfedbruck
Germany
Phone:
+49 (0) 8141/36 367-0
Fax:
+49 (0) 8141/36 367-67
1.2 Disclaimer
ARIES Embedded does not guarantee that the information in this document is up-to-date, correct, complete
or of good quality. Liability claims against ARIES Embedded, referring to material or non-material related
damages caused, due to usage or non-usage of the information given in this document, or due to usage of
erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent
fault of ARIES Embedded. ARIES Embedded explicitly reserves the rights to change or add to the contents
of this Preliminary User’s Manual or parts of it without notification.
Chapter 1. About this manual Page 4 of 24
M100PF Hardware Manual
1.3 Copyright
This document may not be copied, reproduced, translated, changed or distributed, completely or partially
in any form without the written approval of ARIES Embedded GmbH.
1.4 Registered Trademarks
The contents of this document may be subject of intellectual property rights (including but not limited to
copyright, trademark, or patent rights). Any such rights that are not expressly licensed or already owned
by a third party are reserved by ARIES Embedded GmbH.
1.5 Care and Maintenance
•Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain minerals
that will corrode electronic circuits. If your device does get wet, allow it to dry completely.
•Do not use or store the device in dusty, dirty areas. Its moving parts and electronic components can
be damaged.
•Do not store the device in hot areas. High temperatures can shorten the life of electronic devices,
damage batteries, and warp or melt certain plastics.
•Do not store the device in cold areas. When the device returns to its normal temperature, moisture
can form inside the device and damage electronic circuit boards.
•Do not attempt to open the device.
•Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and fine
mechanics.
•Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.
•Do not paint the device. Paint can clog the moving parts and prevent proper operation.
•Unauthorized modifications or attachments could damage the device and may violate regulations gov-
erning radio devices.
1.6 Change Log
Revision Date Revised Comment
1.0 04.06.2019 js Initial creation
1.1 12.01.2022 dk I2C0/I2C1 connections changed
1.2.1 14.10.2022 dk Connector Location added
Chapter 1. About this manual Page 5 of 24
M100PF Hardware Manual
CHAPTER
TWO
OVERVIEW
2.1 M100PF
The M100PF is based on the PolarFire FPGA family by Microchip. The SoM targets demanding industrial
and medical applications and offers the full flexibility of the populated FPGAs. The populated FPGAs
deliver the industry’s lowest power at mid-range densities with exceptional security and reliability. The
FPGA SoM for Embedded Applications spans from 100K logic elements (LEs) to 300K LEs, features 12.7G
transceivers and offers up to 50% lower power than competing mid-range FPGAs.
Chapter 2. Overview Page 6 of 24
M100PF Hardware Manual
2.2 Feature Set
•Microchip PolarFire FPGA
–MPF100T - 109KLE, 336 Math Blocks (18x18MACC)
–MPF200T - 192KLE, 588 Math Blocks (18x18MACC)
–MPF300T - 300KLE, 924 Math Blocks (18x18MACC)
•512 MiB / 1 GiB / 2 GiB DDR3 RAM
•128 MiB configuration SPI NOR Flash
•4 GiB to 64 GiB eMMC memory
•8 SERDES Lanes, 250Mbps to 12.7 Gbps
•2 PCIe Gen2 End Points/Root Ports
•Clock distribution
•single 3,3V supply
•size 74mmx42mm
•2 x Samtec QSH-090-01-F-D-A board-to-board interconnect
•commercial (0°C. . . +70°C) / industrial (-40°C. . . +85°C) temperature range
Chapter 2. Overview Page 7 of 24
M100PF Hardware Manual
2.3 Block Diagram
Chapter 2. Overview Page 8 of 24
M100PF Hardware Manual
2.4 Dimensions
Chapter 2. Overview Page 9 of 24
M100PF Hardware Manual
2.5 Part Overview
Connector Location:
Chapter 2. Overview Page 10 of 24
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