Atmel AT91SAM9G45 Montage- und Bedienungsanleitung

Implementation of DDR2 on AT91SAM9G45

Devices

1. Scope

The AT91SAM9G45 microprocessor features:

• One multi-port DDR2 controller that supports 16-bit DDR2 or 16-bit LP-DDR

memories only

• One single-port DDR2 controller that supports 16-bit DDR2, 16-bit LP-DDR, 16- or

32-bit SDR or LP-SDR memories through the EBI

The purpose of this document is to help the developer in the design of a system utiliz-

ing DDR2. Each DDR2 controller is described separately.

AT91 ARM

Thumb-based

Microcontrollers

Application Note

6492A–ATARM–22-Sep-09

Application Note

2. Multi-Port DDR2 Controller Overview

The DDR2 controller (DDR2C) extends the memory capabilities of a chip by providing the interface to an external 16-bit

DDR2 device. The page size supports ranges from 2048 to 16384, and a number of columns from 256 to 4096. It supports

byte (8-bit) and half-word (16-bit) accesses.

The DDR2 controller supports a read or write burst length of four locations thanks to the 4-port architecture. It keeps track

of the active row in each bank, thus maximizing the DDR2 performance, e.g., the application may be placed in one bank

and data in the other banks. So as to optimize performance, it is advisable to avoid accessing different rows in the same

bank (Open Bank Policy).

The DDR2 controller only supports a CAS latency of 3; it optimizes the read access according to the operating frequency.

Self-refresh, power down and deep power down mode features allow to minimize the consumption of SDRAM device.

The multi-port DDR2 controller I/Os are powered by VDDIOM0. For DDR2, VDDIOM0 is set to 1.8V nominal.

6492A–ATARM–22-Sep-09

Application Note

3. Multi-Port DDR2 Controller Signals Definition

The DDR2 controller is capable of managing 4-bank DDR2 devices. The signals generated by

the controller are defined below.

Table 3-1. DDR2 Controller Signals

Where:

DDR_D0 - DDR_D15 are DDR2 controller data lines, respectively bounded to

[DDR_D15:DDR_D0] on the microcontroller.

DDR_A0 - DDR_A13 are DDR2 controller address lines, respectively bounded to [A0:A13] on

the microcontroller.

DDR_CLK - #DDR_CLK are the differential clock signals that feed the DDR2 device. All other

signals take those two signals as a reference.

To reach the 133 MHz speed on these pins loaded with a 10 pF equivalent capacitor, a dedi-

cated high speed pin is necessary; it cannot be multiplexed on a PIO line (lower frequency).

DDR_CKE acts as an inhibit signal to the DDR device. DDR_CKE remains high during valid

DDR2 access (Read, Write, Prech). This signal goes low when the device is in power down

mode or in self-refresh mode; a self-refresh command can be issued by the controller (refer to

the DDR2 controller self-refresh mode).

DDR_CS: When the Chip Select (DDR_CS) is low, the command input is valid. When it is high,

the commands are ignored but the operation continues.

DDR_RAS - DDR_CAS, DDR_WE: The Row Address Strobe (DDR_RAS) and the Column

Address Strobe (DDR_CAS) will assert to indicate that the corresponding address is present on

DDR_D0 - DDR_D15 Data Bus I/O VDDIOM0 Pulled-up input at reset

DDR_A0 - DDR_A13 Address Bus Output VDDIOM0 0 at reset

DDR_CLK - #DDR_CLK DDR2 Differential Clock

Input Output VDDIOM0

DDR_CKE DDR2 Clock Enable Output High VDDIOM0

DDR_CS DDR2 Chip Select Output Low VDDIOM0

DDR_WE DDR2 Write Enable Output Low VDDIOM0

DDR_RAS - DDR_CAS Row and Column Signal Output Low VDDIOM0

DDR_DQM[0..1] Write Data Mask Output VDDIOM0

DDR_DQS[0..1] Data Strobe Output VDDIOM0

DDR_BA0 - DDR_BA1 Bank Select Output VDDIOM0

DDR_VREF Reference Voltage Input VDDIOM0

6492A–ATARM–22-Sep-09

Application Note

the bus. The conjunction with Write Enable (DDR_WE) and chip select (SDCS), at the rising

edge of the clock (DDR_CK) or the falling edge of the #clock (#DDR_CK), determines the DDR2

operation.

DDR_DQM[0..1]: Data is accessed in 8 or 16 bits by means of DDR_DQM[1..0], which are

respectively the highest to lowest mask bit for the DDR2 data on the bus.

DDR_DQS[0..1]: Data strobe. The data is sampled on DDR_DQS edges.

DDR_BA0 - DDR_BA1 select the bank to address when a command is input. Read/write or pre-

charge is applied to the bank selected by DDR_BA0 and DDR_BA1.

DDR_VREF is used by the input buffers of the DDR2 memories as well as the DDR2 controller

to determine logic levels. VREF is specified to be ½ the power supply voltage and is created

using a voltage divider constructed from two 1K Ω, 1% tolerance resistors.

6492A–ATARM–22-Sep-09

Application Note

4. EBI DDR2 Controller Overview

The EBI embeds a single-port DDR2 controller (DDR2SDRC) that extends the memory capabil-

ities of a chip by providing the interface to 16-bit DDR2, 16-bit LP-DDR, 16-bit or 32-bit SDR or

LD-SDR external devices. The page size supports ranges from 2048 to 16384, and a number of

columns from 256 to 4096. It supports byte (8-bit), half-word (16-bit) and word (32-bit) accesses.

The DDR2 controller supports a read or write burst length of one location. It keeps track of the

active row in each bank, thus maximizing DDR2 performance, e.g., the application may be

placed in one bank and data in the other banks. So as to optimize performance, it is advisable to

avoid accessing different rows in the same bank (Open Bank Policy).

The DDR2 controller supports a CAS latency of 3 for DDR2, and 2 or 3 for SDR. It permits to

optimize the read access according to the frequency.

Self-refresh, power down and deep power down mode features allow to minimize the consump-

tion of the SDRAM device.

The DDR2 controller I/Os are powered by VDDIOM1. For DDR2, VDDIOM1 is to be set to 1.8V

nominal.

6492A–ATARM–22-Sep-09

Application Note

5. EBI DDR2 Controller Signals Definition

The DDR2 controller is capable of managing four-bank DDR2 devices. The signals generated by

the controller are defined below (refer to the EBI Section on the product Datasheet).

Table 5-1. EBI Controller Signals

Where:

D0 - D31 are DDR2 controller data lines, respectively bounded to [D31:D0] on the

microcontroller.

A0 - A12 are DDR/SDR controller address lines, respectively bounded to [A2:A14] of the micro-

controller except for A10 (SDA10) which is not bounded to A12.

A[12:0] lines allow to address up to 11 columns and 13 rows. A[25:13] lines are not used.

SDCK - #SDCK are the Differential Clock signals that feed the DDR2 device. All other signals

take those two signals as a reference. All SDRAM input signals are sampled on the positive

edge of SDCK.

SDCKE acts as an inhibit signal to the SDRAM device. SDCKE remains high during a valid

SDRAM access (Read, Write, Prech). This signal goes low when the device is in power down

mode or in self-refresh mode; a self-refresh command can be issued by the controller (refer to

the SDRAM controller self-refresh mode).

SDCS: When the chip select SDCS is low, the command input is valid. When it is high, the com-

mands are ignored but the operation continues.

BA0 - BA1 selects the bank to address when a command is input. Read/write or precharge is

applied to the bank selected by BA0 and BA1.

D0 - D31 Data Bus I/O VDDIOM1 Pulled-up input at reset

A0 - A25 Address Bus Output VDDIOM1 0 at reset

SDCK - #SDCK DDR2/SDRAM Differential Clock Output VDDIOM1

SDCKE DDR2/SDRAM Clock Enable Output High VDDIOM1

SDCS DDR2/SDRAM Controller Chip Select Output Low VDDIOM1

BA0 - BA1 Bank Select Output VDDIOM1

SDWE DDR2/SDRAM Write Enable Output Low VDDIOM1

RAS - CAS Row and Column Signal Output Low VDDIOM1

SDA10 SDRAM Address 10 Line Output VDDIOM1

DQS[0..1] Data Strobe Output VDDIOM1

DQM[0..3] Write Data Mask Output VDDIOM1

6492A–ATARM–22-Sep-09

Application Note

RAS - CAS, SDWE: The row address strobe (RAS), column address strobe (CAS) will assert to

indicate that the corresponding address is present on the bus. The conjunction with write Enable

(SDWE) and chip select (SDCS) at the rising edge of the clock (SDCK) determines the SDRAM

operation.

SDA10 acts as a DDR/SDR address line but is also used as the auto-precharge command bit.

An AT91 product outputs a dedicated SDA10 signal.

DQS[0..1]: Data strobe. The data is sampled on DDR_DQS edges.

DQM[0..3]: Data is accessed in 8 or 16 bit by means of DDR_DQM[1:0] which are respectively

the highest to lowest mask bit for the DDR2 data on the bus. DQM[3:2] are used in case of an

SDR implementation.

6492A–ATARM–22-Sep-09

Application Note

6. DDR2 Connexion on AT91SAM9 Multi-Port Controller

The AT91SAM9G45 microprocessor supports 16-bit DDR2 devices on DDR/LPDDR Chip Select

area (0x70000000 memory zone). The user interface to configure the DDR2 controller is

mapped at address 0xFFFF E600.

Each DDR2 device must use sufficient decoupling to provide an efficient filtering on the power

supply rails.

6.1 16-bit Using 2 x 8-bit DDR2 Implementation

6.1.1 Hardware Configuration

6.1.2 Software Configuration

The DDR2 initialization sequence is described in Section 11.1 “DDR2-SDRAM Initialization” on

page 13.

RAS

CAS

NWE

CKE

DDR_D7

DDR_D3

DDR_D2

DDR_D4

DDR_D0

DDR_D1

DDR_D5

DDR_D6

BA0

BA1

DDR_A0

DDR_A1

DDR_A2

DDR_A3

DDR_A4

DDR_A5

DDR_A6

DDR_A7

DDR_A8

DDR_A9

DDR_A10

DDR_A11

DDR_A12

DDR_A13

NCK

CS VREF VREF

NCK

BA0

BA1

RAS

CAS

NWE

CKE

DDR_D15

DDR_D11

DDR_D10

DDR_D12

DDR_D8

DDR_D9

DDR_D13

DDR_D14

DDR_A0

DDR_A1

DDR_A2

DDR_A3

DDR_A4

DDR_A5

DDR_A6

DDR_A7

DDR_A8

DDR_A9

DDR_A10

DDR_A11

DDR_A12

DDR_A13

DDR_RAS

DDR_CAS

DDR_WE

DDR_CKE

DDR_BA1

DDR_BA0

DDR_NCLK

DDR_CLK

DDR_CS

DDR_D[0..15]

DDR_A[0..13]

DDR_DQS1

DDR_DQM1

DDR_DQS0

DDR_DQM0

1V81V8

C58 100NFC58 100NF

C67 100NFC67 100NF

MT47H64M8B6-3

DDR2 SDRAM

MN6

MT47H64M8B6-3

DDR2 SDRAM

MN6

A10

BA0

ODT

DQ0 C8

DQ1 C2

DQ2 D7

DQ3 D3

DQ4 D1

DQ5 D9

DQ6 B1

DQ7 B9

DQS B7

DQS A8

RDQS/DM B3

RDQS/NU A2

VDD H9

VDD L1

VDDL E1

VREF E2

VDDQ C9

VSS A3

VSS E3

VDDQ A9

VDD E9

RFU

CKE

CAS

RAS

VDDQ C1

VDDQ C3

VDDQ C7

VSSQ B2

VSSQ B8

VSSQ D2

VSSQ D8

VDD A1

VSS J1

A11

BA1

A12

A13

VSS K9

VSSDL E7

VSSQ A7

RFU

C68 100NFC68 100NF

C63 100NFC63 100NF

C59 100NFC59 100NF

C57 100NFC57 100NF

C66 100NFC66 100NF

C53 100NFC53 100NF

C64 100NFC64 100NF

C69

100NF

C69

100NF

C56 100NFC56 100NF

C62 100NFC62 100NF

C65 100NFC65 100NF

C70

100NF

C70

100NF

C50 100NFC50 100NFC49 100NFC49 100NF

C54 100NFC54 100NF

C61 100NFC61 100NF

C60 100NFC60 100NF

C52 100NFC52 100NFC51 100NFC51 100NF

C55 100NFC55 100NF

MT47H64M8B6-3

DDR2 SDRAM

MN5

MT47H64M8B6-3

DDR2 SDRAM

MN5

A10

BA0

ODT

DQ0 C8

DQ1 C2

DQ2 D7

DQ3 D3

DQ4 D1

DQ5 D9

DQ6 B1

DQ7 B9

DQS B7

DQS A8

RDQS/DM B3

RDQS/NU A2

VDD H9

VDD L1

VDDL E1

VREF E2

VDDQ C9

VSS A3

VSS E3

VDDQ A9

VDD E9

RFU

CKE

CAS

RAS

VDDQ C1

VDDQ C3

VDDQ C7

VSSQ B2

VSSQ B8

VSSQ D2

VSSQ D8

VDD A1

VSS J1

A11

BA1

A12

A13

VSS K9

VSSDL E7

VSSQ A7

RFU

6492A–ATARM–22-Sep-09

Application Note

7. DDR2 Connexion on AT91SAM9 EBI Controller

The AT91SAM9G45 microcontroller supports 16-bit DDR2 devices on one Chip Select area

(NCS1). The user interface to configure the DDR2 controller is mapped at

address 0xFFFF E400.

The 32-bit interface can be achieved by a single 32-bit SDRAM device or two 16-bit SDRAM

devices.

Each DDR2 device must use sufficient decoupling to provide an efficient filtering on the power

supply rails.

7.1 16-bit Using 2 x 8-bit DDR2 Implementation

7.1.1 Hardware Configuration

7.1.2 Software Configuration

The following configuration has to be performed:

• Assign the EBI CS1 to the DDR2 controller by setting the bit EBI_CS1A in the EBI Chip

Select Assignment Register located in the bus matrix memory space

• Initialize the DDR2 controller accordingly to the DDR2 device and the system bus frequency.

The Data Bus Width is to be programmed to 16 bits.

The DDR2 initialization sequence is described in Section 11.1 “DDR2-SDRAM Initialization” on

page 13.

EBI1_DDR_D15

EBI1_DDR_D11

EBI1_DDR_D10

EBI1_DDR_D12

EBI1_DDR_D8

EBI1_DDR_D9

EBI1_DDR_D13

EBI1_DDR_D14

EBI1_DDR_D7

EBI1_DDR_D3

EBI1_DDR_D2

EBI1_DDR_D4

EBI1_DDR_D0

EBI1_DDR_D1

EBI1_DDR_D5

EBI1_DDR_D6

EBI1_DDR_A2

EBI1_DDR_A3

EBI1_DDR_A4

EBI1_DDR_A5

EBI1_DDR_A6

EBI1_DDR_A7

EBI1_DDR_A8

EBI1_DDR_A9

EBI1_DDR_A10

EBI1_DDR_A11

EBI1_DDR_A12

EBI1_DDR_A13

EBI1_DDR_A15

EBI1_DDR_A14

EBI1_DDR_A2

EBI1_DDR_A3

EBI1_DDR_A4

EBI1_DDR_A5

EBI1_DDR_A6

EBI1_DDR_A7

EBI1_DDR_A8

EBI1_DDR_A9

EBI1_DDR_A10

EBI1_DDR_A11

EBI1_DDR_A12

EBI1_DDR_A13

EBI1_DDR_A15

EBI1_DDR_A14

NCLK_EBI1

CS_EBI1

BA0_EBI1

BA1_EBI1

RAS_EBI1

CAS_EBI1

WE_EBI1

CKE_EBI1

CLK_EBI1

NCLK_EBI1

CS_EBI1

BA0_EBI1

BA1_EBI1

RAS_EBI1

CAS_EBI1

WE_EBI1

CKE_EBI1

VREF1 VREF1

CLK_EBI1

EBI1_DDR_A[2..15]

NCLK_EBI1

CLK_EBI1

CS_EBI1

RAS_EBI1

CAS_EBI1

WE_EBI1

CKE_EBI1

BA1_EBI1

BA0_EBI1

DQS0_EBI1

DQM0_EBI1

DQS1_EBI1

DQM1_EBI1

EBI1_DDR_D[0..15]

1V8 1V8

NCS1

(SDA10) (SDA10)

C87 100nFC87 100nF

C85 100nFC85 100nF

C83 100nFC83 100nF

C93 100nFC93 100nF

C96 100nFC96 100nF

C82 100nFC82 100nF

C91 100nFC91 100nF

MT47H64M8CF-3

DDR2 SDRAM

MN8

MT47H64M8CF-3

DDR2 SDRAM

MN8

A10

BA0

ODT

DQ0 C8

DQ1 C2

DQ2 D7

DQ3 D3

DQ4 D1

DQ5 D9

DQ6 B1

DQ7 B9

DQS B7

DQS A8

RDQS/DM B3

RDQS/NU A2

VDD H9

VDD L1

VDDL E1

VREF E2

VDDQ C9

VSS A3

VSS E3

VDDQ A9

VDD E9

RFU1

RFU2

CKE

CAS

RAS

VDDQ C1

VDDQ C3

VDDQ C7

VSSQ B2

VSSQ B8

VSSQ D2

VSSQ D8

VDD A1

VSS J1

A11

BA1

A12

A13

VSS K9

VSSDL E7

VSSQ A7

RFU3

C92 100nFC92 100nF

C101

100nF

C101

100nF

C90 100nFC90 100nF

C102

100nF

C102

100nF

C97 100nFC97 100nF

C99 100nFC99 100nF

C88 100nFC88 100nF

C81 100nFC81 100nF

C84 100nFC84 100nF

C95 100nFC95 100nF

C80 100nFC80 100nF

MT47H64M8CF-3

DDR2 SDRAM

MN9

MT47H64M8CF-3

DDR2 SDRAM

MN9

A10

BA0

ODT

DQ0 C8

DQ1 C2

DQ2 D7

DQ3 D3

DQ4 D1

DQ5 D9

DQ6 B1

DQ7 B9

DQS B7

DQS A8

RDQS/DM B3

RDQS/NU A2

VDD H9

VDD L1

VDDL E1

VREF E2

VDDQ C9

VSS A3

VSS E3

VDDQ A9

VDD E9

RFU1

RFU2

CKE

CAS

RAS

VDDQ C1

VDDQ C3

VDDQ C7

VSSQ B2

VSSQ B8

VSSQ D2

VSSQ D8

VDD A1

VSS J1

A11

BA1

A12

A13

VSS K9

VSSDL E7

VSSQ A7

RFU3

C86 100nFC86 100nF

C98 100nFC98 100nF

C94 100nFC94 100nF

C89 100nFC89 100nF

6492A–ATARM–22-Sep-09

Application Note

8. DDR2 Signal Routing Considerations

The critical high speed signal is associated with the DDR2. The following are general guidelines

for designing a DDR2 interface with AT91SAM9 products with a targeted speed of 133 MHz on

SDCK/#SDCK:

• At first, position the DDR2 devices as close to the processor as possible. A longer trace will

increase the rise time and the fall time of the signals. The setup time of signals generated by

the AT91 Microcontroller will decrease with an increased trace length.

• Keep the DDR2 clocks and control lines as short as possible.

• Keep the DDR2 address and data lines as short as possible.

• For a proper DDR2 operation at 133 MHz, a bus impedance adaptation is necessary. 10 to

30 Ohms series resistors can be placed on all the switching signals to limit the current flow

into each outputs The resistor is to be located near the processor. The need for series

termination resistors and their specific value on the signals are better determined by

simulation, using IBIS models and the specific design PCB layout. On SAM9G45-EKES and

SAM9M10G45-EK, the adaptation is achieved with a 27-Ohm serial resistor.

• To support maximum speeds, reasonable DDR2 loading constraints must be followed. For

high-speed operation, the maximum load cannot exceed 30 pF on address and data buses,

and 10 pF on SDCK and #SDCK. The user must consider all the devices connected on the

different buses to calculate the system load.

• Use sufficient decoupling scheme for memory devices. It is recommended to use low ESR

0.01 µF and 0.1 µF decoupling capacitors in parallel. An additional 0.001 µF decoupling

capacitor is recommended to minimize ground bounce and to filter high frequency noise.

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