Atten AT-R1816 Bedienungsanleitung
Contents
Introduction……………………………………………………........................3
Main technique parameter……………………………………..........................4
Structure introduction……………………………………….............................5
Function key introduction………………………………………………..….....6
The function of temperature curve………………………………………......6-8
Common alloy solder temperature curve adjustment parameters…………......9
Common alloy solder physical constant and characteristics……………..…..10
Running operation……………………………………………………...…11-19
Back soldering operation………………………………………………….19-20
Faults alarm……………………………………………………………….20-22
Attentions………………………………………………..……………….…..22
Parameters of the fixed curves …………...……..…………………………...23
Introduction
The “IR LEAD-LESS REFLOW OVEN” is equipment that used for
electronics production and the maintainance and repair of SMD components.
The AT-R1816 useses the far-infrared for heating the SMD components and
senses the temperature. Through the precise control of the microcomputer, the
AT-R1816 can make a temperature control curve to match the request of the
SMD production technique completely. The “temperature control curve” of the
AT-R1816 can be adjusted accurately, so it can be used for many kinds of
soldering paste which all have different material properties. It can shut down
automatically when there is a alarm or any faults. The AT-R1816 also can be
used for many other functions, such as soldering, maintenance and drying.
Main technique parameter
1
、
Working voltage: AC220V(AC110V order)
2
、
Working frequency:50-60Hz
3
、
Maximum output power: 600W
4
、
Heating methods: infrared radiation and hot air mix heating
5
、
Operating system: Chinese-English operating system
6
、
Working mode: automatic soldering mode, maintenance mode adjustable
7
、
Temperature curve paragraph: warm-up, heating, soldering, heat
preservation and cooling segment.
8
、
Range of temperature and time on warm-up: 70~150 , 0~5Min
9
、
Range of temperature and time on heating: warm-up temperature to 220 ,
0~5Min
10
、
Range of temperature and time on soldering: heating temperature to
30 0 , 0~30s
11
、
Range of temperature and time on heating preservation: soldering
temperature
－
(0~50 )
12
、
Effective soldering area: 180×120mm
13
、
Size: 300×250×160mm
2. The purpose and role of the heating
Activated the liquid flux of tin pulp; under the role of the liquid flux remove
the oxide of surface components inside the tin pulp; preparation for soldering.
In this section the temperature of the lead alloy solder and precious metal alloy
solder should be set (150 ~180 ). eg: Sn42%-Bi58% Indium tin alloy low
temperature Lead Solder, Sn43%-Pb43%-Bi14% low-temperature lead solder
and so on. Set the Mid-temperature lead solder alloy temperature between
(180~220 )
;
Set the high temperature lead-free solder alloy temperature
between (220~250 ). If you have solder and tin pulp information, the
temperature of the heating can be installed in less than tin pulp melting point
temperature of 10 ° C is the best around.
3. The purpose and role of the soldering
The purpose is to complete the SMT soldering. As this stage is the highest
temperature in the whole soldering process, the components is easy to damage.
This process the solder physical and chemical changes of the largest are also to
the improvement of soldering process. The solder dissolves very easily in the
high temperature oxidation in air. If you have solder and tin pulp information,
you can installed the temperature of the soldering higher than tin pulp melting
point temperature of (30~50° C). We divided the solder into three: low
temperature solder
（
150~180
℃ ）
,mid-temperature solder
（
190-220
）
,
high-temperature solder(230~260). Now commonly used lead-free solder
materials for high-temperature solder, low-temperature solder is generally
precious metals lead-free solder and the special requirements of low-
temperature lead solder
，
General electronic products use rarely, it often use in
specific requirements for electronic equipment. At present, many lead-free
solder are also no substitute for lead solder as the mid-temperature leaded
solder has excellent electrical properties, mechanical properties, impact
resistance properties of hot and cold, the antioxidant properties, therefore, in a
common electronic products also large-scale use.
In this segment you can set the time according to the requirement in the
following. After high temperature melting solder shown as liquid all the
components of SMT floating on the surface of the liquid solder. In the surface
tension effects of the flux and liquid, floating components will be move to the
center of the solder pad have the role of reform automatically. Also in the
humid of the solder flux the solder tin and surface metal of components formed
alloy layer infiltrated into components structural organization, which form the
ideal soldering structural. Setting the time about (10~30s), a large area and the
larger components shade of PCB should be set much longer time. The small
area or less parts PCB set shorter time generally. In order to ensure quality of
back solder in this stage should shorten the time as much as possible to
protecting components.
4.
The purpose and role of the heat preservation
Let high-temperature liquid solder solidified into solid-state soldering
points. Solidification quality has a direct impact the crystal structure of the
solder and mechanical properties. If the solidification to fast will lead the solder
formation of crystalline rough, solder joint is not bright, mechanical properties
decrease. Under high temperature and mechanical impact, soldering points
easily crack lose mechanical and electrical connections role, lower product
durability. We always use to stop heating methods and heat preservation for
some time. In the temperature slow decline process the solder can solidification
and crystal good. Generally set the temperature point lower than the solder
point 10-20 ° C around. Use of natural cooling when the temperature dropped
to the temperature point it will enter cooling paragraph.
5.
The purpose and role of the cooling paragraph
This cooling segment is simple, usually cooled to the temperature will not
scalding the people. To speed up the process of operation, may also stop the
process when the temperature fell to below 150 . To avoid burns to use tools,
hand belt or heat resistant grove take out the PCB board.
6. Note
General temperature curve set from the low-temperature, after satisfy the
soldering requirements as much as possible to reduce the soldering
temperature. Also can through extend back soldering time to reduce the
temperature, this will be conducive to the protection of low-temperature
components, especially some connectors and plug. Some components can not
satisfy temperature requirement, can be used to after soldering to solve.
Common alloy solder temperature curve
adjustment parameters
Solder Type Proportion Warm-up
/1min
Heating
/1min
Soldering
/30s
Keep
Cool
Low-temperature
,leaded
Sn43-Pb43-
Bi14 100-120 130-150 200-210 170 150
Lead-free low
temperature Sn42-Bi58 100-120 120-130 180-200 150 150
Lead-free low
temperature Sn48-In52 100-120 120-130 180-200 150 150
Lead, mid-
temperature Sn63-Pb37 130-150 170-180 230-240 180 150
Lead, mid-
temperature Sn60-Pb40 130-150 170-180 230-240 180 150
Lead, mid-
temperature
Sn62-Pb46-
Ag2 130-150 170-180 230-240 180 150
Lead-free, mid-
temperature Sn96.5-Ag3.5 130-150 180-190 240-250 240 150
Lead-free, mid-
temperature
Sn87-Ag3-
Cu3-In7 130-150 180-190 240-250 240 150
Lead-free, mid-
temperature Sn91-Zn9 130-150 180-190 240-250 230 150
Lead-free mid-
temperature
Sn95.4-Ag3.
1-Cn1.5 130-150 180-190 250-260 240 150
Lead-free mid-
temperature Sn99.3-Cu0.7 130-150 180-190 270-280 260 150
Lead-free high
temperature
Sn94-Ag3-
Cu3 130-150 190-220 240-250 240 150
Lead-free high
temperature Sn97-Cu3 130-150 190-220 270-280 250 150
Lead-free high
temperature Sn95-Sd5 130-150 190-220 270-280 250 150
Common alloy solder physical constant and
characteristics
Solder Alloy
Melting
temperat
ure
Mechanical properties
conductiv
ity
Sn Pb Ag Sb Bi In Au Cu Zn Liquidus
（
（（
（℃
℃℃
℃）
））
）
Push
Strength
（
（（
（
MPa
）
））
）
Elongati
on
（
（（
（
%
）
））
）
rigidity
（
（（
（
HB
）
））
）
63 37 183 61 45 16.6 11.0
60 40 183 60 43 16.0 11.0
10 90 299 41 45 12.7 8.2
5 95 312 30 46 12.0 7.8
62 36 2 179 64 39 16.5 11.3
1 97.5 2.5 309 31 50 9.5 7.2
96.5 3.5 221 45 55 13 13.4
97.5 2.5 304 30 52 9.0 8.8
95 5 245 40 38 13.3 11.9
43 43 14 163 55 57 14 8.0
42 58 138 77 20-30 19.3 5.0
48 52 117 11 83 5 11.7
15 5 80 157 17 58 5 13.0
20 80 280 28 - 118 75
96.5 3.5 221 20 73 40 14.0
87 3 7 3 221 45 60 14 9.0
91 9 199
95.4 3.1 1.5 217
99.3 0.7 227
95 5 240
Inhaltsverzeichnis
