C&T Solution CT-AIB01 Bedienungsanleitung

USER'S MANUAL

Intel Q77 Express Chipset

Based

M/B for LGA 1155 Quad Core Ready

Intel Core Processor

No. G03-NAF93-F

Rev: 1.0

Release date: May 11, 2012

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii

ENVIRONMENTAL PROTECTION ANNOUCEMENT..............................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION.......................................................................................iv

ITEM CHECKLIST.....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 SPECIFICATION.........................................................................................................1

1-2 LAYOUT DIAGRAM....................................................................................................2

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING.....................................................................................................5

2-2 CONNECTORS AND HEADERS................................................................................10

2-2-1 REAR I/O BACK PANEL CONNECTORS....................................................10

2-2-2 MOTHERBOARD INTERNAL CONNECTORS............................................11

2-2-3 HEADER PIN DEFINITION ...........................................................................14

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERNING SETUP...................................................................................................20

3-2 BIOS MENU SCREEN ................................................................................................20

3-3 FUNCTION KEYS .......................................................................................................21

3-4 GETTING HELP ..........................................................................................................21

3-5 MENU BARS...............................................................................................................22

3-6 MAIN MENU................................................................................................................22

3-7 ADVANCED MENU.....................................................................................................23

3-8 CHIPSET MENU..........................................................................................................29

3-9 BOOT MENU...............................................................................................................32

3-10 SECURITY MENU.......................................................................................................33

3-11 SAVE & EXIT MENU...................................................................................................34

TABLE OF CONTENT

iii

Environmental Safety Instruction

zAvoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z0 to 40 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

zGenerally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from

the welding spots’ that connect components and PCB. Computer should go

through an adaptive phase before it boots when it is moved from a cold

environment to a warmer one to avoid condensation phenomenon. These water

drops attached on PCB or the surface of the components can bring about

phenomena as minor as computer instability resulted from corrosion and oxidation

from components and PCB or as major as short circuit that can burn the

components. Suggest starting the computer until the temperature goes up.

zThe increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher

temperature in the inner of the case.

zAttention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

USER’S NOTICE

INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED

OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN

PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE

DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME

WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY

KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL

DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,

INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE

REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE

USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT

INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition May 11, 2012

Item Checklist

5Motherboard

5User’s Manual

5DVD for motherboard utilities

5Cable(s)

5I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Specification

Spec Description

Design zATX form factor; PCB size: 30.0 x24.4 cm

Chipset zIntel Q77 Express Chipset

LGA1155

CPU Socket

zSupports 3rd and 2nd Generation Intel®Core™ i7, Core™ i5,

Core™ i3 series processor in LAG1155 Package

* for detailed CPU support information please visit our website

Memory Slot

zDDRIII RAM module slot x 4

zSupporting four DDRIII 1600/1333/1066MHz RAM Module

expandable to 32 GB (Maximum)

zSupport dual-channel function

Expansion Slots

z1 pcs* PCI-Express x16 slot

z1 pcs* PCI-Express x4 slot

z1 pcs* PCI-Express x1 slot

z4 pcs *32-bit PCI slot

z1 pcs* Full-size Mini-PCIE slot/MSATA slot

z1 pcs*Half-size Mini-PCIE slot

Storage zSupport four SATAII ports

zSupport two SATAIII ports

Dual LAN Chip

zIntegrated Intel 82574L and 82579LM Gigabit Ethernet LAN chip

that supports Fast Ethernet LAN function of providing

10/100/1000Mbps Ethernet data transfer rate

HD Audio Chip zRealtek ALC662 6-channel Audio Codec integrated

zAudio driver and utility included

BIOS z64MB DIP Flash ROM

Multi I/O

zUSB 3.0 port connector x2

zHDMI port connector x1

zSerial port connector x2

zDVI-D port connector x1/VGA port connector x1

zUSB 2.0 port connector x4

zRJ-45 LAN connector x2

zAudio connector x3 (Line-in, Line-out, MIC)

zFront panel audio header x1

zHDMI-SPDIF header x1

zCDIN header x1

zParallel header x1

zTPM 1.2 header x1

zGPIO header x1

zUSB 2.0 header x2

zUSB 3.0 header x1

zFront panel header x1

zPOWER LED header x1

zSpeaker header x1

zCIR header x1

zLANLED header x2

zSM_BUS header x1

zTX-RX COM header x 1

zCOM port header x 8

1-2 Layout Diagram

Rear IO Diagram

Motherboard Internal Diagram

RJ-45 LAN Ports

USB 3.0 Ports Line-IN/

Optical SPDIF OUT

Line-OUT

MIC-IN

USB 2.0 Ports

Serial Port 1

VGA Port

ATX 12V

Power Connector

ATX Powe

Connector

LGA1155

CPU Socket

DVI-D Port

HDMI Port Serial Port 2

Audio Connectors

USB 3.0 PortS over

HDMI port

Serial Port s

(COM1 over COM2)

DVI –D Port over

VGA Port

RJ-45 LAN Ports

Over USB 2.0 Ports

RJ-45 LAN Ports

Over USB 2.0 Ports USB 3.0 Header

PCI Express x16 Slot (PE1) *

PCI Express 2.0 x 4 Slot

CI E

ress 2.0 x1 Slo

32-bit

CI Slo

Front Panel

Audio Heade

CDIN Header

Parallel Header TPM Header

TX-RX COM Heade

Intel Q77

Chipset

USB 2.0 Headers

Front Panel Header

DDRIII

DIMM Slot x 4

Full-size Mini-PCIE

/MSATA Slot*

Half-size

Mini-PCIE Slot

DP Connector*

SYS FAN2 Header

GPIO Header

SYS FAN1

Header

KBMS Header CPUFAN Header

SM_BUS Header

CIR Header

Serial Ports (COM3/5/7/9)

SATAIII Ports

SATAII Ports

Serial Ports (COM4/6/8/10)

HDMI S/PDIF Header

LAN1LED Header

LAN2LED Header

PWR LED Header

Speaker Header

*Note:

1.PE1 slot supports PCI-Express 2.0 x16 specification when using Intel®Sandy Bridge CPU and

supports PCI-Express 3.0 x16 specification when using Intel®Ivy Bridge CPU; 2. mSATA slot is

selectable with full size MINI PCI-E and share with SATA6; 3. EDP connector is only optional for customize

model.

Motherboard Jumper Position

Jumper

Jumper Name Description

JBAT CMOS RAM Clear Function Setting 3-pin Block

JP2 Mini PCI-E Power VCC3.3V/3.3VSB Select 3-pin Block

JP3 (Optional) EDP Panel Power 5V/3.3V Select 3-pin Block

JP1 COM1 Ports Pin9 Function Select 6-pin Block

JP4 COM3 Header Pin9 Function Select 6-pin Block

JP5 COM5 Header Pin9 Function Select 6-pin Block

JP6 COM7 Header Pin9 Function Select 6-pin Block

JP7 COM9 Header Pin9 Function Select 6-pin Block

JP2

CASE_OPEN

JP3

JP12

JP8 COM4 Header Pin9 Function Select 6-pin Block

JP9 COM6 Header Pin9 Function Select 6-pin Block

JP10 COM8 Header Pin9 Function Select 6-pin Block

JP11 COM10 Header Pin9 Function Select 6-pin Block

JP12 COM4 Header RS232/485/422 Function Select 6-pin Block

Case_open Case Open Message Display Function Select 2-pin Block

Connectors

Connector Name

ATXPWR ATX Power Connector

ATX12V1 ATX 12V Power Connector

USB4 USB 3.0 Connector X2

HDMI High-Definition Multimedia Interface

VGA Video Graphic Attach Connector

DVI DVI-D Port Connector

COM1(Top)/COM2(Bottom) Serial Port COM Connector X2

UL1(Middle & Bottom)/UL2(Middle & Bottom) USB 2.0 Port Connector X4

UL1(Top)/UL2(Top) RJ-45 LAN Connector X2

AUDIO1 Audio Connector X3

SATA1_2 SATAIII Connector X2

SATA3_4/SATA5/SATA6 SATAII Connectors X4

EDP (Optional) EDP connector

Headers

Header Name Description

FP_AUDIO Front panel audio Header 10-pin block

CDIN1 CD Audio-In Header 4-pin Block

HDMI_SPDIF HDMI_SPDIF Out Header 2-pin Block

KBMS PS/2 Keyboard & Mouse Header 6-pin Block

SPEAK Speaker Header 4-pin Block

PWRLED Power LED 3-pin Block

JW_FP

(Front Panel Header) PWR LED/ HD LED/ /Power Button

/Reset 10-pin Block

CIR CIR Header 8-pin Block

USB1 USB 3.0 Header 20-pin Block

USB2/USB3 USB 2.0 Header 10-pin Block

COM 3/4/5/6/7/8/9/10 Serial Port Header 10-pin Block

TX-RXCOM RS 422/485 port headers 4-pin block

GPIO_CON GPIO Header 10-pin Block

TPM TPM Header 20-pin Block

PARALLEL Parallel Port Header 26-pin Block

LAN1LED/LAN2LED LANLED 2-pin Block

SM_BUS SMBUS Header 4-pin Block

SYSFAN1 SYSFAN1 Header 3-pin Block

SYSFAN2/CPUFAN1 FAN Header 4-pin Block

Chapter 2

Hardware Installation

2-1 Jumper Setting

(1) JBAT (3-pin): Clear CMOS

2-3 Short：Clear CMOS

JBAT JBAT

1-2 closed : Normal

;

CMOS Clear Setting

(2)JP2 (3-pin): Mini PCI-E Power VCC 3.3V/3.3 VSB Select

2-3 closed ：MINI PCI-E VCC= 3.3VSB

JP2

1-2 closed ：MINI PCI-E VCC= 3.3V;

(3)JP3 (3-pin): EDP Panel Power 5V/3.3 V Select

2-3 closed ：EDP Panel Power=3.3V;

JP3

1-2 closed ：EDP Panel Power=5V;

*Note:

JP3 is optional for customize model with EDP connector.

(4) JP1 (6-pin): COM1 Port Pin9 Function Select

3-4 closed : +12V;

JP1

1-2 closed: RS232;

5-6 closed : +5V

(5) JP4 (6-pin): COM3 Port Pin9 Function Select

3-4 closed : +12V;

JP4

1-2 closed: RS232;

5-6 closed : +5V

(6) JP5(6-pin): COM5 Port Pin9 Function Select

3-4 closed : +12V;

JP5

1-2 closed: RS232;

5-6 closed : +5V

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