CIS DCC-HD1 Kurzanleitung

DCC-HD1 Rev.900-785-30-00

FULL HD

Color MOS

Assembly Unit

DCC-HD1

Product Specification

& Operational Manual

CIS Corporation

lish

DCC-HD1 Rev.900-785-30-00

Table of Contents

PAGE

1. Scope of Application............................................................................................................................................... 2

2. Handling Precautions.............................................................................................................................................. 2

3. Product Outline...................................................................................................................................................... 3

4. Bundled Items ....................................................................................................................................................... 3

4.1. Standard Bundled Items ............................................................................................................................. 3

4.2. Packaging .................................................................................................................................................. 3

5. Specifications......................................................................................................................................................... 4

5.1. General Specifications................................................................................................................................. 4

6. Part Names and Functions ...................................................................................................................................... 6

7. External Connector.................................................................................................................................................. 7

7.1. PD-VC01 CN1 (10 pins)............................................................................................................................... 7

7.2 PD-VC01 CN2 (BNC) ................................................................................................................................... 7

7.3 PD-VC01 CN4 (4 pins)................................................................................................................................. 7

7.4 PD-VC01 CN4 (4 pins)................................................................................................................................. 7

8. Guideline for Thermal design .................................................................................................................................. 8

8.1. Operating temperature of main parts........................................................................................................... 8

8.2. Temperature measurement of the surface of the device................................................................................ 8

8.3. Reference> surface temperature of each device in a CIS chassis(29mm×29mm×77mm)................................ 8

9. Factory Settings ..................................................................................................................................................... 9

10. Dimensions...................................................................................................................................................... 10

11. Case for Indemnity (Limited Warranty).............................................................................................................. 11

12. MOS Pixel Defect.............................................................................................................................................. 11

13. Product Support............................................................................................................................................... 11

DCC-HD1 Rev.900-785-30-00

1. Scope of Application

This is to describe DCC-HD1, an assembly unit for camera modules. All specifications

contained herein are subject to change without prior notice. Reproduction in whole or in part

is prohibited.

2. Handling Precautions

The assembly unit must not be used for any nuclear equipments or aerospace equipments with

which mechanical failure or malfunction could result in serious bodily injury or loss of human life.

Our warranty does not apply to damages or defects caused by irregular and/or abnormal use of

the product.

Please observe all warnings and cautions stated below.

Our warranty does not apply to damages or malfunctions caused by neglecting these

precautions.

zDo not use or store the assembly unit in the dusty or humid places.

zDo not apply excessive force or static electricity that could damage the assembly unit.

zDo not shoot direct images that are extremely bright (e.g., light source, sun, etc).

zFollow the instructions in Chapter 7, “External Connector Pin Assignment” for connecting

the camera module. Improper connection may cause damages not only to the camera

module but also to the connected devices.

zConfirm the mutual ground potential carefully and then connect the camera module to

monitors or computers. AC leaks from the connected devices may cause damages or

destroy the camera module.

zDo not apply excessive voltage. (Use only the specified voltage.) Unstable or improper

power supply voltage may cause damages or malfunction of the camera assembly.

zDCC-HD1 is an assembly unit for camera modules. It is designed based on the premise of

embedding in a camera. Therefore, the appropriate heat dissipation needs to be

considered when embedding the board unit.

Operating the assembly unit without appropriate heat dissipation considered may cause

damages or malfunction.

DCC-HD1 Rev.900-785-30-00

3. Product Outline

DCC-HD1 is provided as an assembly unit that is a part of CIS full HD color camera module,

VCC-HD1, utilizing a 1/3 type MOS image sensor.

1080 60p/59.94p/50p (3G-SDI), 1080 60i/59.94i/50i (HD-SDI), 720 60p/59.94p/50p

(HD-SDI) is corresponded.

Key Features

□ Features CIS original ISP, state-of-the-art “ClairvuTM” engine for superb imaging

quality.

□ Sensor board 25.4mm×25.4mm, Main board 25.4mm×38mm, Driver board 25.4mm

×38mm.

□ Cameras are controllable with RS-232C and USB communications.

*This model uses μT-Kernel source code based on μT-License of T-Engine Forum

(www.t-engine.org).

4. Bundled Items

4.1. Standard Bundled Items

□ Sensor board (BI-VC01PA), Main board (MB-VC01), Driver board (PD-VC01)

*Boards are connected with FPC (51 pins) at the time of delivery.

□ 10 pins connector (power, USB, I/F)

□ 4 pins connector (DC IRIS)

□ 3 pins connector (RS-232C)

4.2. Packaging

□ Individual carton

□ Master carton (10pcs/carton)

*Master carton may change depends on the quantity to be shipped per delivery.

DCC-HD1 Rev.900-785-30-00

5. Specifications

5.1. General Specifications

Note: The specification below is based on a chassis typed camera of CIS VCC-HD1.

(1) Pick up device

Device Type 1/3 type MOS sensor (color)

Effective Pixel Numbers 1944(H) ×1092(V)

Unit Cell Size 2.75μm(H) ×2.75μm(V)

Chip Size 5.346mm(H) ×3.003mm(V) (Effective Pixels)

(2) Resolution 1080p,1080i :

1920(H) × 1080(V)

720p : 1280(H) ×720(V)

(3) Aspect Ratio 16 : 9

(4) Video Output Format 1920 x 1080p @60fps(Level A) 3G-SDI

1920 x 1080p @60fps(Level B) 3G-SDI

1920 x 1080p @59.94fps(Level A) 3G-SDI

1920 x 1080p @59.94fps(Level B) 3G-SDI

1920 x 1080p @50fps(Level A) 3G-SDI

1920 x 1080p @50fps(Level B) 3G-SDI

1920 x 1080i @60fps HD-SDI

1920 x 1080i @59.94fps HD-SDI

1920 x 1080i @50fps HD-SDI

1280 x 720p @60fps HD-SDI

1280 x 720p @59.94fps HD-SDI

1280 x 720p @50fps HD-SDI

(5) Sync. System Internal Sync.

(6) Video Output Standard 3G-SDI/HD-SDI : Y/Pb/Pr(4:2:2 10bit) BNC 75Ωterminal

(7) Sensitivity F5.6 2000lx

(8) Minimum illumination F1.4 1.2lx

Conditions : VIDEO 50%, AGC 30dB, Electric Shutter OFF

(9) Dust or stains in optical

systems No dust or stain shall be detected on the testing screen with setting the camera aperture at F16.

(10) Power Requirements(*1) DC+9～+15V

(11) Power Consumption(*1) 4.0W at DC+12V IN

(12) Dimensions Refer to overall dimension drawing.

(13) Weight Approx. 12g (Sensor board, Main board)

(14) Lens Mount OLPF and a filter on a sensor board at the time of delivery

(15) Gain Setting AGC (Max. Gain : 0dB～30dB)

MANUAL : 0dB～30dB

(16) Shutter Speed Variable

Range OFF : 1/60(60fps, 59.94fps), 1/50(50fps)

MANUAL : 1/8k, 1/4k, 1/2k, 1/1k, 1/500, 1/250, 1/120, 1/100, 1/60, Open

AUTO : 1/8k s～Open (Upper limit and lower limit can be set.)

(17) White Balance Adjustment

Range

AUTO, AUTO(Outdoor), Preset 7 different kinds, User Preset 1～5, One Push

Preset:

Daylight(5500K), Cloudy(6500K), Shade(8000K), Tungsten(3200K), Fluorescent(White),

Fluorescent(Neutral White), Fluorescent(Daylight) 6500K

(18) DC IRIS output(*1) Auto/Open Selectable. Can be used with electric shutter (With priority to electric shutter).

(19) Auto Exposure Detection Average/Center-Weight/Spot(1/256)/Backlight Compensation

(20) Flicker Cancelling OFF/ON

(21) Edge Enhancement OFF, 1, 2, 3, 4, 5 (typ.3)

(22) Color Saturation Adjustment 0%(B/W)～100%(typ.)～200%

(23) Gamma Compensation Auto Gamma Compensation OFF(γ≒0.45) , ON, ON[Strong]

(24) Contrast Adjustment -2, -1, 0, 1, 2 Selectable (typ.0)

(25) Color Balance Blue/Red：-100～0～100(typ.0) , Green/Magenta：-100～0～100(typ.0)

DCC-HD1 Rev.900-785-30-00

(26) Black Level Adjustment Level:0～127(typ.0)

(27) Pixel Defect (White spot)

Correction Corrected at factory setting.

(28) Remote Control Operation Cameras can be controlled via RS-232C communications or USB 2.0 Full Speed (12Mbps).

Camera settings can be controlled by control software via PC.

(29) Safety/Quality standards UL: Conform to UL Standard including materials and others.

RoHS: Conform to RoHS

CE and FCC are acquired as VCC-HD1 (chassis typed camera).

(30) Durability (*1)

Vibration Acceleration : 98m/s2 (10G)

Frequency : 20～200 Hz

Direction : X,Y, and Z, 3 directions

Testing time : 120min for each direction

Shock No malfunction shall be occurred with 980m/s2(100G) for ±X,±Y, and ±Z,

6 directions.

(31) Operation environment

(*1) Performance

guaranteed 0 ～+40℃Humidity

20 ～80%RH with no condensation

Operation

guaranteed -5 ～+45℃Humidity

20 ～80%RH with no condensation

※Performance guaranteed: All the specifications specified in this manual is guaranteed under

performance guaranteed temperature.

※Operation guaranteed : All the camera functions operate normally under operation guaranteed

temperature.

(32) Storage Environment (*1) Storage Temperature: -25 ～+60℃, Humidity: 20 ～80%RH with no condensation.

(*1) Applied when embedded in VCC-HD1, chassis typed camera.

<3G-SDI output Level A and Level B>

A difference between Level A and Level B is a way of mapping Y signal and Cb/Cr signal onto 3G-SDI standard signal. The

difference does not affect the resolution of the video signal. Some 3G-SDI receivers correspond to either Level A or B,

whereas other receivers correspond to both Levels, so please set the camera mode to match your 3G-SDI receiver.

DCC-HD1 Rev.900-785-30-00

6. Part Names and Functions

1. Sensor board (BI-VC01PA)

OLPF and filter case are attached to the sensor board.

Protect the OLPF from dusts.

Has the same serial number as the one on a main board

2. Main board (MB-VC01)

Mainly provided with on-board FPGA and CPU.

Has the same serial number as the one on a sensor board.

3. Driver board (PD-VC01)

Mainly provided with on-board 3G-SDI, HD-SDI drive, and power circuit.

Has the same serial number as the one on a sensor board.

4. FPC (51 pins)

FPCs which connect each board

Boards are connected at the time of delivery.

Sensor board and main board are paired up as the correction data of the sensor is saved in the main board.

5. Electric power supply, USB I/F connector (10 pins)

Power input (DC+12V) and USB I/F signal.

Connect to the power input and USB using the attached 10 pins cable.

6. 3G-SDI/HD-SDI output connector (BNC)

3G-SDI/HD-SDI video-out signal

Connect to the 3G-SDI/HD-SDI monitor using BNC cable.

7. DC IRIS LENS connector (4 pins)

Signal for the DC IRIS LENS

Connnect to the DC IRIS LENS using the attached 4 pins cable. No connection is needed when DC IRIS is not

in use.

8. RS-232C I/F connector (3 pins)

Signal for RS-232C

Connect to the RS-232C using the attached 3 pins cable.

No connection is needed when RS-232C is not in use.

BI-VC01 Board

MB-VC01 Board

PD-VC01 Board

OLPF

Filter Case

BNC (3G,HD-SDI OUT)

587

CN1

CN1 CN2

CN3 CN4 CN5 CN1 CN2

DCC-HD1 Rev.900-785-30-00

7. External Connector

7.1. PD-VC01 CN1 (10 pins)

7.2 PD-VC01 CN2 (BNC)

7.3 PD-VC01 CN4 (4 pins)

7.4 PD-VC01 CN4 (4 pins)

型名： BM10B-SRSS-TB (JST)

ピン番号名称

1 Power IN DC+12V

2 GND

3 N.C.

4 N.C.

5 N.C.

6 N.C.

7 USB_VBUS

8 USB_D-

9 USBD+

10 GND

Model Name BCJ-BPLHA (CANARE)

Pin No.

1 3G-SDI/HD-SDI output

2 GND

Model Name：BM4B-SRSS-TB (JST)

Pin No.

1 IRIS_DUMP+

2 IRIS_DUMP-

3 IRIS_DRIVE-

4 IRIS_DRIVE+

Model Name BM4B-SRSS-TB (JST)

Pin No.

1 RS-232C_TXD

2 RS-232C_RXD

3 GND

1 4

1 3

110

DCC-HD1 Rev.900-785-30-00

8. Guideline for Thermal design

This camera is designed for embedding into a chassis, therefore, operating the board itself without heat release will exceed the

tolerance of the operation temperature. The operation temperature will reach 130℃when operating FPGA without casing.

Do not leave it on without casing as it may cause burns and damages to the camera. Please refer to the guideline below for

designing heat dissipation.

8.1. Operating temperature of main parts

Board (ref) Data sheet value Upper limit temperature of

IC package surface

Image sensor BI-VC01PA(IC1) ta=75℃85℃

FPGA MB-VC01(IC1)

tj=85℃80℃

CPU MB-VC01(IC4)

ta=85℃95℃

SDI IC PD-VC01(IC3) ta=85℃95℃

Upper limit temperature of the package is ta+10℃for parts defined “ta” on a data sheet.

As the data sheet value of FPGA says “tj,” upper limit temperature of FPGA shall be 80℃based on the thermal

conductivity of the package and power consumption.

Please release heat so that surface temperature of the IC package on a board in a chassis does not exceed the upper

limit temperature. Please measure the temperature in the usage environment.

Give first priority to the heat dissipation of the FPGA because it is the main heat source.

8.2. Temperature measurement of the surface of the device.

Measure temperature by fixing a thermocouple to the device surface with tape, making a slit in the heat conduction

sheet, and adhering a heat-sink tightly onto it.

(E.g.：Temperature measurement of the surface of FPGA)

8.3. Reference> surface temperature of each device in a CIS chassis(29mm×29mm×77mm)

Ambient

temperature

25℃ 40℃ 45℃

Image sensor 58 73 78

FPGA 55.7 70.7 75.7

CPU 51.7 66.7 71.7

SDI IC 55.1 70.1 75.1

DCC-HD1 Rev.900-785-30-00

9. Factory Settings

Factory Settings

Video Format Settings 1920 x 1080p @60fps(Level A) 1920 x 1080i @60fps

1920 x 1080p @60fps(Level B)

1920 x 1080p @59.94fps(Level A)

1920 x 1080p @59.94fps(Level B

1920 x 1080p @50fps(Level A)

1920 x 1080p @50fps(Level B)

1920 x 1080i @60fps

1920 x 1080i @59.94fps

1920 x 1080i @50fps

1280 x 720p @60fps

1280 x 720p @59.94fps

1280 x 720p @50fps

Gain Mode Auto, Manual Auto

Manual Gain 0dB～30dB 0dB

Max Gain 0dB～30dB 30dB

Shutter Mode Auto, Manual Auto

Shutter Limit Max Open ～< Shutter Limit Min Open

Shutter Limit Min Shutter Limit Max < ～1/8000 1/8000

Manual Shutter Open～1/8000 Open

Iris Open, Auto Open

Flicker Cancel OFF/ON OFF

AE Mode Average Center-Weight

Center-Weight

Spot

Backlight Compensation

Spot Block X=0～15 , Y=0～15 X=8, Y=8

AE Level 0(%)～100(%) 50(%)

AE Speed 0～100 2

White Balance Settings Auto Auto

Auto(Outdoor)

Daylight(5500K)

Cloudy(6500K)

Shade(8000K)

Tungsten(3200K)

Fluorescent(White)

Fluorescent(Neutral White)

Fluorescent(Daylight)

OnePush

Manual

Preset 1～5

Manual R Gain 0(%)～800(%) 100(%)

Manual B Gain 0(%)～800(%) 100(%)

Noise Reduction OFF, ON OFF

Edge Enhancement OFF, 1, 2, 3, 4, 5 3

Color Saturation 0(%)～200(%) 100(%)

Color Balance Blue/Red -100～100 0

Color Balance Green/Magenta -100～100 0

Pedestal OFF/ON OFF

Pedestal Level 0～127 44

Contrast -2, -1, 0, 1, 2 0

Auto Gamma OFF, ON, ON[Strong] OFF

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