Cree XB-D Series Bedienungsanleitung

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

www.cree.com/xlamp

CLD-AP90 REV 3

SOLDERING & HANDLING

Cree®XLamp®XB-D LEDs

WWW.CREE.COM/XLAMP

TABLE OF CONTENTS

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

INTRODUCTION

This application note applies to XLamp XB-D LEDs

which have order codes in the following format.

XBDxxx-xx-xxxx-xxxxxxxxx

This application note explains how XLamp XB-D LEDs

and assemblies containing these LEDs should be

handled during manufacturing. Please read the entire

document to understand how to properly handle

XLamp XB-D LEDs.

Handling XLamp XB-D LEDs .................................2

Circuit Board Preparation & Layouts ......................4

Case Temperature (Ts) Measurement Point .............4

Notes on Soldering XLamp XB-D LEDs ...................5

Moisture Sensitivity ............................................6

XLamp XB-D LED Reow Soldering Characteristics ..7

Chemicals & Conformal Coatings ..........................8

Assembly Storage & Handling...............................9

Tape and Reel - XB-D LEDs ................................ 10

Packaging & Labels ........................................... 11

Cree logo and XLamp®are registered trademarks of Cree, Inc. This document is provided for informational purposes only and is not

a warranty or a specication. For product specications, please see the data sheets available at www.cree.com.

xlamp xB-D leD solDering & hanDling

of Cree, Inc.

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at

www.cree.com.

HANDLING XLAMP XB-D LEDS

Manual Handling

Use tweezers to grab XLamp XB-D LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with

ngers. Do not push on the lens.

Do not apply more than 1000 g of shear force onto the lens. Excessive force on the lens could damage the LED.

Cree recommends the following at all times when handling XLamp XB-D LEDs or assemblies containing these LEDs:

• Avoid putting excessive mechanical stress on the LED lens.

• Never touch the optical surface with ngers or sharp objects. The LED lens surface could be soiled or damaged,

which would affect the optical performance of the LED.

Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp XB-D LEDs from the factory tape

& reel packaging.

WRONG

CORRECT

xlamp xB-D leD solDering & hanDling

of Cree, Inc.

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at

www.cree.com.

Pick & Place Nozzle

For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles be

constructed of non-metallic materials. Cree and several of Cree’s customers have had good success using nozzles

fabricated from Teon or from 90d urethane. The following pick & place tool is specic to the XB Family LEDs.

All dimensions in mm.

SIZE

TITLE

REV.

SHEET

DRAWING NO.

DATE

CHECK

FINAL PROTECTIVE FINISH

MATERIAL

APPROVED

DRAWN BY

THIRD ANGLE PROJECTION

SCALE

123456

6 5 4 3 2 1

Phone (919) 313-5300

Fax (919) 313-5558

4600 Silicon Drive

Durham, N.C 27703

UNAUTHORIZED PERSON WITHOUT

THE WRITTEN CONSENT

MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY

CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT

CONTAINED WITHIN ARE THE PROPRIETARY AND

CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION

OF CREE INC.

NOTICE

X° ± .5 °

.XXX ± .25

.XX ± .75

.X ± 1.5

FOR SHEET METAL PARTS ONLY

.XX ± .25

.XXX ± .125

X° ± .5 °

UNLESS OTHERWISE SPECIFIED

DIMENSIONS ARE IN

MILLIMETERS AND AFTER FINISH.

TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH:

1.6

4.500

1.125

4x 15.0°

2.500

+.100/-.000

2.500

+.100/-.000

± .050 thru2.300

4x R.200

+.050/-.000

x 90°

2.400

5.500

1/113.000

12002494

Tool, Pickup-XB-D

Delrin

1/5/12Don Hirsh

1/5/12D. Seibel

REVISONS

REV DESCRIPTION BY DATE APP'D

A Initial Release DDS 1/5/12 D. H.

Add features as required

to interface with customer's tool

xlamp xB-D leD solDering & hanDling

of Cree, Inc.

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at

www.cree.com.

CIRCUIT BOARD PREPARATION & LAYOUTS

Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specications before

placing or soldering XLamp XB-D LEDs onto the PCB.

The diagram below shows the recommended PCB solder pad layout for XLamp XB-D LEDs.

CASE TEMPERATURE (TS) MEASUREMENT POINT

XLamp XB-D LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as

possible. This measurement point is shown in the picture below.

It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XB-D LED itself. In testing,

Cree has found such a solder pad to have insignicant impact on the resulting Tsmeasurement.

SIZE

TITLE

REV.

SHEET

DRAWING NO.

DATE

CHECK

FINAL PROTECTIVE FINISH

MATERIAL

APPROVED

DRAWN BY

THIRD ANGLE PROJECTION

SCALE

123456

6 5 4 3 2 1

Phone (919) 313-5300

Fax (919) 313-5558

4600 Silicon Drive

Durham, N.C 27703

UNAUTHORIZED PERSON WITHOUT

THE WRITTEN CONSENT

MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY

CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT

CONTAINED WITHIN ARE THE PROPRIETARY AND

CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION

OF CREE INC.

NOTICE

X° ± .5 °

.XXX ± .25

.XX ± .75

.X ± 1.5

FOR SHEET METAL PARTS ONLY

.XX ± .25

.XXX ± .125

X° ± .5 °

UNLESS OTHERWISE SPECIFIED

DIMENSIONS ARE IN

MILLIMETERS AND AFTER FINISH.

TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH:

1.6

2.45

0.65

0.76

1.84

0.355

2.285

0.923

0.462

0.817

1.633

R1.086

0.82

0.36

0.46

2.340.36

0.28

0.36

0.92

2.34

2.272

1.136

2.272

0.284

0.426

0.852

0.426

0.284

1/130.000

2610-00019

2525 SBC HEW OUTLINE

----

09/19/11D. CRONIN

REVISONS

REV DESCRIPTION BY DATE APP'D

RECOMMENDED PCB SOLDER PAD

RECOMMENDED STENCIL PATTERN

(HATCHED AREA IS OPENING)

Recommended PCB Solder Pad Recommended Stencil Pattern

Pad for thermocouple

Thermocouple site

if no separate pad

All dimensions in mm.

xlamp xB-D leD solDering & hanDling

of Cree, Inc.

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at

www.cree.com.

NOTES ON SOLDERING XLAMP XB-D LEDS

XLamp XB-D LEDs are designed to be reow soldered to a PCB. Reow soldering may be done by a reow oven or by

placing the PCB on a hotplate and following the reow soldering prole listed on the previous page.

Do not wave solder XLamp XB-D LEDs. Do not hand solder XLamp XB-D LEDs.

WRONG

CORRECT

Solder Paste Type

Cree strongly recommends using “no clean” solder paste with XLamp MPL-EZW LEDs

so that cleaning the PCB after reflow soldering is not required. Cree uses the following

solder paste internally:

Indium Corporation of America Part number 82676

Sn62/Pb36/Ag2 composition

Flux: NC-SMQ92J

Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg.

Solder Paste Thickness

The choice of solder and the application method will dictate the specific amount of

solder. For the most consistent results an automated dispensing system or a solder stencil

printer is recommended. Cree has seen positive results using solder thickness that results

in a post reflow 3-mil (75µm) bond line.

Solder Paste Type

Cree strongly recommends using “no clean” solder paste with XLamp XB-D LEDs so that cleaning the PCB after reow

soldering is not required. Cree uses Kester r276 solder paste internally.1

Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).

Solder Paste Thickness

The choice of solder and the application method will dictate the specic amount of solder. For the most consistent

results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results

using solder thickness that results in a 3-mil (75-μm) bond line.

1 kester.com/Portals/0/documents/Electronic-Assembly-Materials.pdf

CORRECT

WRONG

xlamp xB-D leD solDering & hanDling

of Cree, Inc.

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at

www.cree.com.

After Soldering

After soldering, allow XLamp XB-D LEDs to return to room temperature before subsequent handling. Handling of the

device, especially around the lens, before cooling could result in damage to the LED.

Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs

after reow. This can be done by X-ray or by shearing selected devices from the circuit board. The solder should

appear completely re-own (no solder grains evident). The solder areas should show minimum evidence of voids on the

backside of the package and the PCB.

Cleaning PCBs After Soldering

Cree recommends using “no clean” solder paste so that ux cleaning is not necessary after reow soldering. If PCB

cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA).

Do not use ultrasonic cleaning.

MOISTURE SENSITIVITY

In testing, Cree has found XLamp XB-D LEDs to have unlimited oor life in conditions ≤ 30 ºC / 85% relative humidity

(RH). However, Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately

prior to use. Cree also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the

bag immediately after use. Moisture testing included a 168-hour soak at 85 ºC / 85% RH followed by 3 reow cycles,

with visual and electrical inspections at each stage.

xlamp xB-D leD solDering & hanDling

of Cree, Inc.

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at

www.cree.com.

XLAMP XB-D LED REFLOW SOLDERING CHARACTERISTICS

In testing, Cree has found XLamp XB-D LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed

below. As a general guideline, Cree recommends that users follow the recommended soldering prole provided by the

manufacturer of solder paste used.

Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and

congurations of reow soldering equipment.

Prole Feature Lead-Based Solder Lead-Free Solder

Average Ramp-Up Rate (Tsmax to Tp) 3 °C/second max. 3 °C/second max.

Preheat: Temperature Min (Tsmin) 100 °C 150 °C

Preheat: Temperature Max (Tsmax) 150 °C 200 °C

Preheat: Time (tsmin to tsmax) 60-120 seconds 60-180 seconds

Time Maintained Above: Temperature (TL) 183 °C 217 °C

Time Maintained Above: Time (tL) 60-150 seconds 60-150 seconds

Peak/Classication Temperature (Tp) 215 °C 260 °C

Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds

Ramp-Down Rate 6 °C/second max. 6 °C/second max.

Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

xlamp xB-D leD solDering & hanDling

of Cree, Inc.

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at

www.cree.com.

CHEMICALS & CONFORMAL COATINGS

Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a