Dell AW2521Hb Bedienungsanleitung
1
D
ELL
AW
2
5
21H
B
1. Disassembly Procedures
S1 Turn off power
S2 Place the monitor on a soft cloth or
cushion
Carefully slide and remove the I/O
cover from the monitor.
S3 Disconnect the cables from the monitor
and slide them out through the cable-
management slot on the stand riser
S4 Press and hold the stand release button
S5 Lift the stand up and away from the
monitor.
S6 Unlock 4 screws on rear cover
Use hands or scraper bar to
disassemble Rear Cover from the
monitor.
Notice the disassembly order:
Left Side=> Top Side=>Right
Side=>Bottom Side
(Screw Torque: 8-10 kgf)
S7 Remove USB FFC and Audio FFC from
I/F BD
S8 Disconnect LED Driver BD wire and
CTRL FFC cable from I/F BD
Take off Rear Cover
2
D
ELL
AW
2
5
2
1H
B
S9 Tear off a tape from CTRL FFC cable
on Rear Cover
S10
Remove all cables from LED Driver BD
Unlock 1 screw and disassemble LED
Driver BD from Rear Cover
(Screw Torque: 4.5±0.5 kgf)
S11
Tear off an adhesive tape from LED BD
wire on Rear Cover
S12
Tear off “MYLAR HEAD LOGO” from
cover LOGO LENS
S13
Disconnect LED BD wire from LED BD
Disassemble LED BD from Rear Cover
S14
Remove a conductive foam from
conductive cloth
S15
Remove a conductive cloth from the
right USB screw and Rear Cover
S16
Unlock 2 screws to disassemble USB
BD from Rear Cover
(Screw Torque: 4.5±0.5 kgf)
3
D
ELL
AW
2
5
21H
B
S17
Disconnect USB FFC and Audio FFC
from USB BD
S18
Remove FFC cable from Rear Cover,
CTRL BD and CTRL+KEY BD
Unlock 6 screws to disassemble CTRL
BD and CTRL+KEY BD from Rear
Cover
(Screw Torque: 2.0±0.5 kgf)
S19
Tear off 6 tapes on Backlight Wire
Disconnect Backlight Wire from I/F BD
S20
Disconnect “CTRL+LENS BD FFC”
from I/F BD and remove it from Panel
and Main SHD
S21
Disconnect Light Sensor BD FFC from
I/F BD and remove it from Panel and
Main SHD
4
D
ELL
AW
2
5
2
1H
B
S22
Unlock MF screw*16 to disassemble
the Middle Frame from Panel (Yellow
Mark)
Unlock 4 screws to disassemble Main
SHD from Panel (Blue Mark)
(Screw Torque-MF: 4.5±0.5 kgf)
(Screw Torque-Main SHD: 4.0±0.5 kgf)
S23
Tear off an acetate tape and a tensile
tape from EDP cable
S24
Disconnect EDP cable from Panel
Take off Main SHD from Panel
S25
Tear off the adhesive tape from the
connector of Backlight wire
Disconnect Backlight Wire from Panel
S26
Disassemble Light Sensor BD from
Middle Frame
S27
Unlock 2 screws to disassemble Power
Button module from Middle Frame
(Screw Torque:1.1±0.1kgf)
S28
Disconnect FFC cable from
“CTRL+LENS BD” (Power CTRL BD)
S29
Tear off “MYLAR PWR-LENS“ from
“CTRL+LENS BD” (Power CTRL BD)
S30
Unlock 2 screws to disassemble
“CTRL+LENS BD” (Power CTRL BD)
from Power Button
(Screw Torque: 2±0.5kgf)
5
D
ELL
AW
2
5
21H
B
S31
Unlock 1 screw to disassemble Docking
BD from Main SHD
Disassemble wire from Docking BD
(Screw Torque: 8.5±1.0kgf)
S32
Disassemble Safety mylar from Main
SHD
S33
Tear off an adhesive tape from EDP
cable on I/F BD
Disconnect EDP cable from I/F BD
Unlock 9 PCBA screws to disassemble
I/F BD and SPS BD
(Screw Torque: 8.5±1kgf)
S34
Disassemble I/F BD and SPS BD from
Main SHD
S35
Disconnect I/F BD to Docking BD wire
from I/F BD
Disconnect wire from I/F BD and SPS
BD
S36
Disconnect Fan Cable from I/F BD
S37
Unlock 4 screws to disassemble G-
SYNC+Heatsink Module from I/F BD
(Screw Torque: 4.0±0.5 kgf)
6
D
ELL
AW
2
5
2
1H
B
S38
Remove electrolyte capacitors (red mark) from printed circuit boards
S38-1 Cut the glue between bulk cap. and PCB with a knife
S38-2 Ensure cutting path within the glue, don’t touch bulk cap. or PCB
7
D
ELL
AW
2
5
21H
B
S38-3 Take out bulk cap. pin solder with soldering iron and absorber
S39-4 Lift the bulk cap. up and away from the PCB
8
D
ELL
AW
2
5
2
1H
B
2. Product material information
The following substances, preparations, or components should be disposed of or
recovered separately from other WEEE in compliance with Article 4 of EU Council
Directive 75/442/EEC.
Capacitors / condensers (containing
PCB/PCT)
No used
Mercury containing components
No used
Batteries
No used
Printed circuit boards (with a surface greater
than 10 square cm)
Product has printed circuit boards
(with a surface greater than 10 square
cm)
Component contain toner, ink and liquids
No used
Plastic containing BFR
No used
Component and waste contain asbestos
No used
CRT
No used
Component contain CFC, HCFC, HFC and
HC
No used
Gas discharge lamps
No used
LCD display > 100 cm2 Product has an LCD greater than 100
cm2
External electric cable
Product has external cables
Component contain refractory ceramic fibers
No used
Component contain radio
-
active substances
No used
Electrolyte capacitors (height
> 25mm, diameter > 25mm)
Product has electrolyte capacitors
(height >25mm, diameter > 25mm)
3. Tools Required
List the type and size of the tools that would typically can be used to disassemble the
product to a point where components and materials requiring selective treatment can be
removed.
Tool Description:
- Screwdriver
- Scraper Bar
- Penknife
- Soldering iron and absorber
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