Dell AW2721DB Bedienungsanleitung
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1. Disassembly Procedures
S1 Turn off power
S2 Place the monitor on a soft cloth or
cushion
Carefully slide and remove the I/O
cover from the monitor.
S3 Disconnect the cables from the monitor
and slide them out through the cable-
management slot on the stand riser.
S4 Press and hold the stand release button
S5 Lift the stand up and away from the
monitor.
S6 Unlock 4 screws on rear cover
Use hands or scraper bar to
disassemble Rear Cover from the
monitor.
Notice the disassembly order:
Left Side=> Top Side=>Right
Side=>Bottom Side
(Screw Torque: 8-10 kgf)
S7 Remove USB FFC and Audio FFC from
I/F BD
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S8 Remove 1 tape on LED Driver BD wire
from Main SHD and disconnect LED
Driver BD wire from I/F BD
Disconnect CTRL FFC cable from I/F
BD and tear it from Main SHD
Take off Rear Cover
S9 Remove all tapes from cables and Rear
Cover
S10
Remove all cables from LED Driver BD
Unlock 1 screw and disassemble LED
Driver BD from Rear Cover
(Screw Torque: 4.5±0.5 kgf)
S11
Tear off “MYLAR HEAD LOGO” from
cover LOGO LENS
Disconnect LED wire from LED BD
Disassemble LED BD from Rear Cover
S12
Remove 2 tapes on Jack BD from Rear
Cover
Tear off RC Mylar from USB BD and
Jack BD
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S13
Disassemble Jack BD from Rear Cover
Remove 2 wires from Jack BD
Unlock 2 screws to disassemble USB
BD from Rear Cover
(Screw Torque: 4.5±0.5 kgf)
S14
Disconnect USB FFC and Audio FFC
from USB BD
S15
Remove FFC cable from Rear Cover,
CTRL BD and CTRL+KEY BD
Unlock 6 screws to disassemble CTRL
BD and CTRL+KEY BD from Rear
Cover
(Screw Torque
:
2.0±0.5
kg
f
)
S16
Take off 1 gasket from Middle Frame
S17
Remove all tapes from Main SHD and
Middle Frame
S18
Disconnect Backlight Wires from Panel
and SPS+LED BD
S19
Disconnect Sensor BD FFC from I/F BD
and tear off it from panel and Main SHD
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S20
Disconnect Light Sensor BD FFC from
I/F BD and tear off it from Panel and
Main SHD
S21
Disconnect “CTRL+LENS BD FFC”
from I/F BD and tear off it from Panel
and Main SHD
S22
Unlock MF screws*7 and inferior
screws*5 to disassemble Middle Frame
from Panel
(Screw Torque: 4.5±0.5 kgf)
S23
Tear off a yellow tape and an acetate
tape from EDP cable and panel
Disconnect EDP cable from Panel
Take off Main SHD from Panel.
S24
Disassemble Light Sensor BD from
Middle Frame
S25
Unlock 2 screws to disassemble Power
Button module from Middle Frame
(Screw Torque: 1.1±0.1 kgf)
S26
Disconnect FFC cable from
“CTRL+LENS BD” (Power CTRL BD)
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S27
Tear off “MYLAR PWR-LENS“ from
“CTRL+LENS BD” (Power CTRL BD)
S28
Unlock 2 screws to disassemble
“CTRL+LENS BD” (Power CTRL BD)
from Power Button
(Screw Torque: 2±0.5 kgf)
S29
Disassemble Sensor BD from Middle
frame
S30
Unlock 1 screw to disassemble Docking
BD from Main SHD
Disassemble wire from Docking BD
(Screw Torque: 8.5±1.0 kgf)
S31
Disassemble mylar from Main SHD
S32
Tear off an adhesive tape and a yellow
tape from I/F BD and EDP cable
Disconnect EDP cable from I/F BD
S33
Unlock 11 screws on PCBA to
disassemble SPS+LED BD, SPS BD
and I/F BD from Main SHD
(Screw Torque: 8.5±1.0 kgf)
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S34
Disconnect wires from I/F BD, SPS BD
and SPS+LED BD
S35
Unlock 1 ground screw to disassemble
AC Socket from Main SHD
(Screw Torque: 8-10 kgf)
S36
Disconnect Fan Cable from I/F BD
S37
Unlock 4 screws to disassemble G-
SYNC Module from I/F BD
(Screw Torque: 4-4.5 kgf)
S38
Unlock 4 Heat Sink screws and 4
captive screws to disassemble G-Sync
module, Heat Sink Module and SHEET
STIFFENER
Tear off MYLAR from SHEET
STIFFENER
(Screw Torque-Heat Sink: 2-2.5 kgf)
(Screw Torque-Captive screw: 4-4.5
kgf)
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S39
Remove electrolyte capacitors (red mark) from printed circuit boards
S39-1 Cut the glue between bulk cap. and PCB with a knife
S39-2 Ensure cutting path within the glue, don’t touch bulk cap. or PCB
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S39-3 Take out bulk cap. pin solder with soldering iron and absorber
S39-4 Lift the bulk cap. up and away from the PCB
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2. Product material information
The following substances, preparations, or components should be disposed of or
recovered separately from other WEEE in compliance with Article 4 of EU Council
Directive 75/442/EEC.
Capacitors / condensers (containing
PCB/PCT)
No used
Mercury containing components
No used
Batteries
No used
Printed circuit boards (with a surface greater
than 10 square cm)
Product has printed circuit boards
(with a surface greater than 10 square
cm)
Component contain toner, ink and liquids
No used
Plastic containing BFR
No used
Component and waste contain asbestos
No used
CRT
No used
Component contain CFC, HCFC, HFC and
HC
No used
Gas discharge lamps
No used
LCD display > 100 cm2 Product has an LCD greater than 100
cm2
External electric cable
Product has external cables
Component contain refractory ceramic fibers
No used
Component contain radio
-
active substances
No used
Electrolyte capacitors (height
> 25mm, diameter > 25mm)
Product has electrolyte capacitors
(height >25mm, diameter > 25mm)
3. Tools Required
List the type and size of the tools that would typically can be used to disassemble the
product to a point where components and materials requiring selective treatment can be
removed.
Tool Description:
- Screwdriver
- Scraper Bar
- Penknife
- Soldering iron and absorber
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1
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