EPOX EP-BX3 Bedienungsanleitung
TRADEMARK
All products and company names are trademarks or registered
trademarks of their respective holders.
These specifications are subject to change without notice.
Manual Revision 3.2
July 23, 1999
EP-BX3EP-BX3
EP-BX3EP-BX3
EP-BX3
A PA P
A PA P
A Pentiumentium
entiumentium
entium®®
®®
®II or PII or P
II or PII or P
II or Pentiumentium
entiumentium
entium®®
®®
®IIIIII
IIIIII
III
Slot1 Processor based AGPSlot1 Processor based AGP
Slot1 Processor based AGPSlot1 Processor based AGP
Slot1 Processor based AGP
mainboard (100/66MHz)mainboard (100/66MHz)
mainboard (100/66MHz)mainboard (100/66MHz)
mainboard (100/66MHz)
EP-BX3
EP-BX3
Technical Support Services
If you need additional information, help during installation or normal use of this
product, please contact your retailer. Your retailer will have the most current informa-
tion about your configuration. If your retailer cannot help, you may visit our online
technical support website and/or contact our support technicians at the locations listed
below.
Record your serial number before installing your EP-BX3 mainboard. (The serial
number is located near the ISA slots at the edge of the board.)
EP-BX3 serial number: _________________________________
Contacting Technical Support
EPoX technical support is working hard to answer all of your questions online. From
our website you can find answers to many common questions, drivers, BIOS updates,
tech notes, and important technical bulletins. If you are still unable to locate the
solution you are seeking, you always have the option to contact our support technicians
directly.
North American website (English language)
http://www.epox.com
European website (Multi-language)
http://www.epox.nl
Taiwan website (Chinese language)
http://www.epox.com.tw
Thank you for using EPoX mainboards!
Copyright 1999 EPoX Computer Company. All rights reserved.
EP-BX3
User Notice
No part of this product, including the product and software may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language in
any form without the express written permission of EPoX Computer Company
(hereinafter referred to as EPoX) except for documentation kept by the purchaser for
backup purposes.
We provide this manual “as is” without warranty of any kind, either expressed or
implied, including but not limited to the implied warranties or conditions of merchant-
ability or fitness for a particular purpose. In no event shall EPoX be liable for any loss
of profits, loss of business, loss of use or data, interruption of business or for indirect,
special incidental, or consequential damages of any kind, even if EPoX has been
advised of the possibility of such damages arising from any defect or error in the
manual or product. EPoX may revise this manual from time to time without notice.
For updated BIOS, drivers, or product release information you may visit our websites
at http://www.epox.com or http://www.epox.com.tw.
Products mentioned in this manual are mentioned for identification purposes only.
Product names appearing in this manual may or may not be registered trademarks or
copyrights of their respective companies. The product name and revision number
are both printed on the mainboard itself.
Handling Procedures
Static electricity can severely damage your equipment. Handle the EP-BX3 and any
other device in your system with extreme care and avoid unnecessary contact with
system components on the mainboard. Always work on an antistatic surface to avoid
possible damage to the mainboard from static discharge. Always have the power
supply unplugged and powered off when inserting and removing devices within the
computer chassis. EPoX assumes no responsibility for any damage to the EP-BX3
mainboard that results from failure to follow instruction or failure to observe safety
precautions.
CAUTION
The EP-BX3 mainboard is subject to
damage by static electricity. Always
observe the handling procedures.
EP-BX3
Table of Contents
Section 1 Introduction
Components Checklist ................................... 1-1
Overview
Pentium®II/III Processor............................... 1-2
S.E.C.CartridgeTerminology ......................... 1-3
AcceleratedGraphicsPort .............................. 1-4
HardwareMonitoring ..................................... 1-4
EP-BX3 Form-Factor .................................... 1-6
I/OShieldConnector...................................... 1-7
Power-On/Off(Remote)................................. 1-7
SystemBlockDiagram ................................... 1-8
Section 2 Features
EP-BX3 Features ........................................... 2-1
Section 3 Installation
EP-BX3DetailedLayout ................................ 3-2
Easy Installation Procedure
ConfigureJumpers .......................................... 3-3
SystemMemoryConfiguration ........................ 3-5
Installing a Pentium®II/III Processor ............ 3-9
DeviceConnectors ......................................... 3-10
ExternalModem Ring-inPower ONand
Keyboard Power ON Function (KBPO) ........ 3-12
Section 4 Award BIOS Setup
BIOSInstructions ........................................... 4-1
Standard CMOS Setup .................................. 4-2
BIOS Features Setup ..................................... 4-3
ChipsetFeatures Setup ................................... 4-8
EP-BX3
Power Management Setup ............................. 4-13
PNP/PCI Configuration ................................. 4-17
Load Setup Defaults ...................................... 4-19
Integrated Peripherals ................................... 4-19
Change Supervisor or User Password........... 4-24
IDE HDD Auto Detection.............................. 4-25
Save & Exit Setup ......................................... 4-27
Exit Without Saving....................................... 4-27
Appendix
Appendix A
MemoryMap ................................................. A-1
I/O Map......................................................... A-1
Timer&DMAChannelsMap......................... A-2
InterruptMap ................................................. A-2
RTC & CMOS RAM Map ............................ A-3
Appendix B
POST Codes ................................................. A-5
UnexpectedErrors ......................................... A-8
Appendix C
LoadSetupDefaults ....................................... A-9
Appendix D
CPU Clock Frequency Selection In BIOS Setting
...................................................................... A-10
IntroductionEP-BX3
Page 1-1
Section 1
INTRODUCTION
Components Checklist
üü
üü
üA. (1) EP-BX3 mainboard
üü
üü
üB. (1) EP-BX3 user’s manual
üü
üü
üC. (1) Floppy ribbon cable
üü
üü
üD. (1) Hard drive ribbon cables
üü
üü
üE. (1) Foldable Retention Module
F. (1) Heatsink Support Unit (Optional)
G. (1) PS/2 to AT keyboard connector adapter (optional)
üü
üü
üH. (1) Bus master drivers
(1) USDM
USERS
MANUAL
EP-BX3
B
A
G
C
D
F
Top Half
Bottom Half
E
25 26
H
or
Introduction EP-BX3
Page 1-2
Overview
Pentium®II or Pentium®III Processor
The Pentium®II or Pentium®III Processor (The Pentium®III Processor as 350/
100MHz, 400/100MHz, 450/100MHz and 500/100MHz speed with 512K-L2 cache
Versions.) is the follow-on to the Pentium®Processor. The Pentium®II or Pentium®
III Processor, like the Pentium®Pro processor, implements a Dynamic Execution
micro-architecture -- a unique combination of multiple branch prediction, data flow
analysis, and speculative execution. This enables the Pentium®II Processor to deliver
higher performance than the Pentium®processor, while maintaining binary compatibil-
ity with all previous Intel architecture processors.
A significant feature of the Pentium®II or Pentium®III Processor, from a system
perspective, is the built-in direct multiprocessing support. In order to achieve
multiprocessing, and maintain the memory and I/O bandwidth to support it, new
system designs are needed. For systems with dual processors, it is important to
consider the additional power burdens and signal integrity issues of supporting
multiple loads on a high speed bus. The Pentium®II or Pentium®III Processor card
supports both uni-processor and dual processor implementations.
The Pentium®II or Pentium®III Processor utilizes Single Edge Contact (S.E.C.)
(Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2 cache
to remain tightly coupled to the processor, while maintaining flexibility when imple-
menting high performance processors into OEM systems. The second level cache is
performance optimized and tested at the cartridge level. The S.E.C. cartridge utilizes
surface mounted core components and a printed circuit board with an edge finger
connection. The S.E.C. cartridge package introduced on the Pentium®II Processor
will also be used in future Slot 1 processors.
The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB
with an edge finger connection. The thermal plate allows standardized heatsink
attachment or customized thermal solutions. The thermal plate enables a reusable
heatsink to minimize fit issues for serviceability, upgradeability and replacement. The
full enclosure also protects the surface mount components. The edge finger connec-
tion maintains socketabilty for system configuration. The edge finger connector is
denoted as ‘Slot 1 connector’ in this and other documentation.
The entire enclosed product is called the Pentium®II or Pentium®III Processor. The
IntroductionEP-BX3
Page 1-3
packaging technology and each of the physical elements of the product are referred to
using accurate technical descriptions. This allows clear reference to the products as
just a processor. This is the model used in past packaging technologies like PGA,
TCP, PQFP, DIP, etc.
S.E.C. Cartridge Terminology
• Pentium®II or Pentium®III Processor
The new enclosed card packaging technology is called a “Single Edge
Contact cartridge.” This is similar to previous names for packaging
technology such as PGA or TCP.
• Processor card
The green PCB (with or without components on it)
• Processor core
The silicon on the PLGA package on the PCB
• Cover
The plastic cover on the opposite side from the thermal plate.
• Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium® Pro
processor uses Socket 8.
• Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that holds the cartridge
in place.
• Thermal plate
The heatsink attachment plate.
• Heat sink supports
The support pieces that are mounted on the mainboard to provide added
support for heatsinks.
The L2 cache (TagRAM,
PBSRAM) components keep
standard industry names.
The Pentium®II or Pentium®III
Processor is the first product to
utilize the S.E.C. cartridge technol-
ogy and Slot 1 connector. Unless
otherwise noted, any references to
“Pentium®II Processor,” Figure 1: Pentium®II/III Processor CPU
with S.E.C.C. or S.E.C.C.2 Package
Pentium®II Processor
in an S.E.C.C. Package Pentium®III Processor
in an S.E.C.C.2 Package
Introduction EP-BX3
Page 1-4
“Pentium®II or Pentium®III Processor/Slot 1 processor” will apply to both the
Pentium®II Processor desktop processors.
Accelerated Graphics Port
(AGP or A.G.P.)
Typically, 3D graphics rendering requires a tremendous amount of memory, and
demands ever increasing throughput speed as well. As 3D products for the personal
computer become more and more popular, these demands will only increase. This
will cause a rise in costs for both end users and manufacturers. Lowering these
costs as well as improving performance is the primary motivation behind AGP. By
providing a massive increase in the bandwidth available between the video card and
the processor, it will assist in relieving some of these pressures for quite sometime.
Hardware Monitoring
Hardware monitoring allows you to monitor various aspects of your systems opera-
tions and status. The features include CPU temperature, voltage and RPM of fan.
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