Fujitsu MB2147-541 Bedienungsanleitung

FUJITSU SEMICONDUCTOR

SUPPORT SYSTEM SS01-71051-2E

F2MC-16 Family EMULATOR

LQFP-64P PROBE HEADER

MB2147-541

OPERATION MANUAL

PREFACE

Thank you for purchasing the LQFP-64P *1probe header (MB2147-541) for the F2MC-16 family

emulator.

The LQFP-64P probe header is a header board *2 used to connect the F2MC-16L/16LX emulator

(MB2147-01) *3 and the F2MC-16L/16LX emulator PGA-299P adapter board (MB2147-20) *4to a

user system. that uses Fujitsu micro controller F2MC-16LX family MB90F983 (LQFP-64P).

This manual explains the handling of the LQFP-64P probe header for the F2MC-16 family emulator.

Before using the MB2147-541, be sure to read this manual.

Consult the Sales representatives or the Support representatives of Fujitsu Limited for mass-pro-

duced MCUs and evaluation MCUs.

*1 : The lead pitch of package (FPT-64P-M03) is 0.5 mm and the body size is 10 mm ×10 mm.

*2 : referred to as “header board”

*3 : referred to as "emulator"

*4 : referred to as "adapter board"

■Handling and use

The handling and use of this product and notes regarding safety use are included in the hardware

manual of the F2MC-16 family emulator.

•F2MC-16L/16LX EMULATOR

MB2147-01 HARDWARE MANUAL

•F2MC-16L/16LX EMULATOR PGA-299 ADAPTER BOARD

MB2147-20 HARDWARE MANUAL

■Caution of the products described in this document

The following precautions apply to the product described in this manual.

CAUTION The wrong use of a device will give an injury and may cause malfunction on cus-

tomers system.

Cuts This product has parts with sharp points that are exposed.

Do not touch edge of the product with your bare hands.

Damage

When connect the header board to the user system, correctly position the index

mark (▲) on the NQPACK mounted on the user system with the index mark (▲)

on the header board, otherwise the emulator system and user system might be

damaged.

Damage When mounting a mass production MCU, correctly position pin 1, otherwise the

mass production MCU and user system might be damaged.

•The contents of this document are subject to change without notice.

Customers are advised to consult with FUJITSU sales representatives before ordering.

•The information, such as descriptions of function and application circuit examples, in this document are presented sole-

ly for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU

does not warrant proper operation of the device with respect to use based on such information. When you develop

equipment incorporating the device based on such information, you must assume any responsibility arising out of such

use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the infor-

mation.

•Any information in this document, including descriptions of function and schematic diagrams, shall not be construed

as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right

of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property

right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual

property rights or other rights of third parties which would result from the use of information contained herein.

•The products described in this document are designed, developed and manufactured as contemplated for general use,

including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not

designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless

extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal

injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air

traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)

for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).

Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in

connection with above-mentioned uses of the products.

•Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from

such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire pro-

tection, and prevention of over-current levels and other abnormal operating conditions.

•If any products described in this document represent goods or technologies subject to certain restrictions on export un-

der the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be

required for export of those products from Japan.

1. Checking the Delivered Product

Before using the LQFP-64P probe header, confirm that the following components are included in the

box:

•LQFP-64P Header Board *1: 1

•Screws for securing header board (M2 ×10 mm, 0.4 mm pitch) : 4

•Washer : 4

•NQPACK064SD-ND *2: 1

•HQPACK064SD *3: 1

•Operation manual (Japanese version) : 1

•Operation manual (English version, this manual) : 1

*1 : Header board is mounted on the YQPACK064SD (Tokyo Eletech Corporation), referred to as

“YQPACK”.

*2 : IC socket manufactured by Tokyo Eletech Corporation, referred to as “NQPACK”, and sup-

plied with a special screwdriver and 3 guide pins. A socket offering higher reliability,

NQPACK064SD-ND-SL (Tokyo Eletech Corporation, sold separately), can be used by mak-

ing an IC socket mounting hole on the user system board. For more information, contact Tokyo

Eletech Corporation.

*3 : IC socket cover manufactured by Tokyo Eletech Corporation, referred to as “HQPACK”, with

4 screws for securing HQPACK (M2 ×6 mm, 0.4 mm pitch).

This product is used as an emulator system by combining with an optional emulator and adapter

board.

Consult the Sales representatives or the Support representatives of Fujitsu Limited for the adapter

board or the emulator of this product.

2. Handling Precautions

The header board is precision-manufactured to improve dimensional accuracy and to ensure reliable

contact. The header is therefore sensitive to mechanical shock. To ensure correct use of the header

in the proper environment, observe the following points regarding its insertion and removal:

•To avoid placing stress on the NQPACK mounted on the user system during connecting the

header board.

3. Notes on Designing

■Notes on designing PC board for the user system

Once the header board is connected to the user system, the heights of parts mounted around the

header board are restricted.

When the PC board of the user system is designed, consider the height of the parts not to interfere

between components mounted to the user system and the header board within range of the header

board as shown in Figure 1.

Figure 1 Header board dimensions

1212

CN1

CN2

CN3

99 100 99 100

PROBE CABLE CN B2

PROBE CABLE CN B1

Approximately

35 mm *

Approximately

13 mm *

* : The height differs slightly depending on how the YQPACK and the NQPACK are engaged.

62 mm

27 mm

33 mm

80 mm

■MCU footprint design notes

Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the PC board

of the user system.

The PC board of the user system must be designed with due consideration given to this footprint as

well as to the mass production MCU.

For more information, contact the Tokyo Eletech Corporation.

Figure 2 Recommended dimensions of the footprint for mounting the NQPACK

0.5 0.25

0.5 ×15=7.5

3.4

10 2.0

2.0

10 2.0

2.0

3.4

0.5 ×15=7.5

φ1.6 *2

2-φ1.0 *1

No.1 pin

*1 : It is a position of hole (φ1.0) for the guide pin to fit position when NQPACK is mounted.

When the guide pin is not used, it is not necessary to puncture the hole.

*2 : It is a fixation of screw hole (φ1.6) for IC socket made when NQPACK064SD-ND-SL

(Tokyo Eletech Corporation, sold separately) is mounted.

When the NQPACK064SD-ND-SL is not used, it is not necessary to puncture the hole.

UNIT : mm

4. Procedure for Connecting to the User System

Before using the LQFP-64P probe header, mount the supplied NQPACK on the user system.

The header board is used combining the adapter board. To connect the header board to the adapter

board, use the 2 lines of the flat cable (standard or long) supplied by the emulator sold separately.

Refer to the hardware manuals of the emulator or adapter board about the way to connect the flat

cable.

■Connecting

1. To connect the header board to the user system, match pin 1 indicated by the index mark (▲) on

the NQPACKmounted on the user system with the index mark (▲) on the header board and then

insert it (See Figure 3) . The pin of YQPACK is thin and easy to bend. Insert NQPACK after con-

firm that the pin of YQPACK is not bent.

2. Insert each screw for securing header board through the washer in each of the four drilled holes

on the header board.

To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten

the four screws in sequence. (See Figure 4)Tightening the screws too tight might result in a de-

fective contact.

Figure 3 Index Position

NQPACK

Index (▲)

Header board Index (▲)

Probe cable connector B2

YQPACK

(It mounts at the back)

Probe cable connector B1

Figure 4 Header board connection

■Disconnection

To disconnect the header board from the user system, remove all four screws, and then pull the

header board straight out of the NQPACK.

Screws for securing

header board

Washer

Header board

User system

YQPACK

NQPACK

5. Mounting Mass Production MCUs

To mount a mass production MCU on the user system, use the supplied HQPACK.

■Mounting

1. To mount a mass production MCU on the user system, match the index mark (▲) on the

NQ-PACK mounted on the user system with the index mark (●) on the mass production MCU.

2. Confirm that the mass production MCU is correctly mounted on the NQPACK. Next, match the

index mark of HQPACK with the index mark of NQPACK and insert it (angle cut linearly at one

place only). (See Figure 4.)

The pin of HQPACK is thin and easy to bend. Insert NQPACK after confirm that the pin of

HQPACK is not bent.

3. Insert each screw for securing HQPACK in each of the four drilled holes on the HQPACK and

tighten the screw diagonally.

To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten

the four screws in sequence. Tightening the screws too tight might result in a defective contact.

Figure 5 Mounting a mass production MCU

■Disconnection

To remove the HQPACK, remove all four screws, and pull out the HQPACK from NQPACK

vertically.

Screws for securing HQPACK

Mass production MCU

User system

HQPACK

NQPACK

6. Connector Pin Assignment

The signal of evaluation MCU with which it was carried on the adapter board is connected to

YQPACK(the same assignments as production MCU) via the probe cable connector(B1, B2) on a

header board.

An adapter board and a header board are connected to an emulator main part by the 2 lines of the

attached flat cable connector (standard or long).

Please check the hardware manual of an emulator or an adapter board about reference of the connec-

tion method.

For details of a mass production MCU pin, refer to the data sheet or hardware manual of each MCU.

■Pin Assignment

Tables 1 and 2 list the pin assignments among the probe cable connector(B1, B2), the evaluation

MCU on the adapter board, and the production MCU.

For details on the names of signal conductors of the evaluation MCU, refer to the hardware manual

for the adapter board.

Comments in the tables are given below.

*1 : Connected to the power supply (VCC) of the evaluation MCU.

*2 : Connected to the power supply (VCC3) of the production MCU. The connection pin number

is 32.

*3 : Connected to the power supply (VCC5 (VCC)) of the evaluation MCU.

*4 : Connected to the power supply (VCC5) of the production MCU. The connection pin number

is 16.

*5 : Connected to the ground of the evaluation MCU.

*6 : Connected to the ground (VSS) of the production MCU. The connection pin numbers are 17,

33 and 48.

- : Unconnected pin (left open).

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