Fujitsu QFP-100P Bedienungsanleitung

FUJITSU SEMICONDUCTOR

SUPPORT SYSTEM SS01-26010-1E

F2MC-8FX Family

QFP-100P (0.65 mm pitch) HEADER BOARD

MB2146-251

OPERATION MANUAL

PREFACE Thank you for purchasing the QFP-100P (0.65 mm pitch) *1header board (Model number :

MB2146-251) for the F2MC *2-8FX family.

MB2146-251 is a header board used to connect the MCU board (Model number : MB2146-301,

MB2146-303) which mounted F2MC-8FX family evaluation MCU to a user system.

This manual explains the handling of the MB2146-251 for the F2MC-8FX family. Before using

MB2146-251, be sure to read this manual.

Consult the Sales representatives or the Support representatives of Fujitsu Limited for mass-pro-

duced MCUs and evaluation MCUs which correspond on MB2146-251.

*1 : The lead pitch of package (FPT-100P-M06) is 0.65 mm and the body size is 14 mm ×20 mm.

*2 : F2MC is the abbreviation used for FUJITSU Flexible Microcontroller.

■Caution of the products described in this document

The following precautions apply to the product described in this manual.

CAUTION The wrong use of a device will give an injury and may cause malfunction on cus-

tomers system.

Cuts This product has parts with sharp points that are exposed.

Do not touch edge of the product with your bare hands.

Damage When connect the header board to the user system, correctly position the index

mark (▲) on the NQPACK mounted on the user system with the 1 pin direction(1)

on the header board, otherwise the MCU board and user system might be dam-

aged.

Damage When mounting a mass production MCU, correctly position pin 1, otherwise the

mass production MCU and user system might be damaged.

•The contents of this document are subject to change without notice.

Customers are advised to consult with FUJITSU sales representatives before ordering.

•The information, such as descriptions of function and application circuit examples, in this document are presented sole-

ly for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU

does not warrant proper operation of the device with respect to use based on such information. When you develop

equipment incorporating the device based on such information, you must assume any responsibility arising out of such

use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the infor-

mation.

•Any information in this document, including descriptions of function and schematic diagrams, shall not be construed

as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right

of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property

right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual

property rights or other rights of third parties which would result from the use of information contained herein.

•The products described in this document are designed, developed and manufactured as contemplated for general use,

including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not

designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless

extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal

injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air

traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)

for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).

Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in

connection with above-mentioned uses of the products.

•Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from

such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire pro-

tection, and prevention of over-current levels and other abnormal operating conditions.

•If any products described in this document represent goods or technologies subject to certain restrictions on export un-

der the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be

required for export of those products from Japan.

1. Product Outline

■Product outline

This product is a header board (referred to as header board) used to connect the MCU board (Model

number : MB2146-301, MB2146-303) which mounted an evaluation MCU in the F2MC-8FX family

of Fujitsu 8-bit microcontrollers to a user system. To build an F2MC-8FX evaluation environment,

combine three products as shown in Figure 1: the header board, MCU board, and BGM adapter

(Model number : MB2146-09).

Figure 1 System configuration

■Product configuration

Table 1 lists the product configuration in the header board, and Table 2 lists options.

Table 1 Product cofiguration

Table 2 Option

* : Several types of evaluation MCUs are available depending on their applications. Purchase the one that satisfies the

service conditions.

Name Description Remarks

F2MC-8FX

QFP-100P (0.65 mm pitch)

header board

[Model number : MB2146-251]

Connector/QFP100pin

(0.65 mm pitch) Package conversion -

[Model number : YQPACK100RB]

(Tokyo Eletech Corporation) I/F between header board and NQPACK Accessory

(Finishing connection)

[Model number : NQPACK100RB179]

(Tokyo Eletech Corporation) User system mounting Accessory

[Model number : HQPACK100RB179]

(Tokyo Eletech Corporation) It is used at the time of mass production

MCU mounting to NQPACK. Accessory

Name Description Remarks

BGM adapter

[Model number : MB2146-09] ICE unit for F2MC-8FX -

MCU board

[Model number : MB2146-301, MB2146-303] Built-inMB95FV100B-101,

MB95FV100B-103 Built-in F2MC-8FX evaluation MCU *

㪤㪙㪉㪈㪋㪍㪄㪇㪐

MCU board

BGM adapter

Header board

2. Checking the Delivered Product

Before using the MB2146-251, confirm that the following components are included

in the box:

•QFP-100P (0.65 mm pitch) Header board *1: 1

•Screws for securing Header board (M2 ×10 mm, 0.4 mm pitch) : 4

•NQPACK100RB179 *2: 1

•HQPACK100RB179 *3: 1

•Operation manual (English version, this manual) : 1

*1 : Referred to as “header board”. Header board is mounted on YQPACK100RB (Tokyo Eletech

Corporation) , referred to as “YQPACK”.

*2 : IC socket manufactured by Tokyo Eletech Corporation, referred to as “NQPACK”, and sup-

plied with a special screwdriver and 2 guide pins. A socket offering higher reliability,

NQPACK100RB179-SL (Tokyo Eletech Corporation, sold separately) , can be used by mak-

ing an IC socket mounting hole on the user system board. For more information, contact Tokyo

Eletech Corporation.

*3 : IC socket cover manufactured by Tokyo Eletech Corporation, referred to as “HQPACK”, with

4 screws for securing HQPACK (M2 ×6 mm, 0.4 mm pitch) .

3. Handling Precautions

The header board is precision-manufactured to improve dimensional accuracy and to ensure reliable

contact. The header is therefore sensitive to mechanical shock. To ensure correct use of the header

in the proper environment, observe the following points regarding its insertion and removal:

•To avoid placing stress on the NQPACK mounted on the user system board during connecting

the header board.

4. Notes on Designing

■Notes on designing printed circuit board for the user system

When the header board is connected to the user system, the parts mounted around the NQPACK in

the user system may be touched the header board if the height of the parts is tall. To prevent this,

design the printed circuit board for the user system such that the components do not exceed the height

shown in Figure 2. Figure 2 shows dimension figure of the header board.

Figure 2 Header board dimensions

㪈

㪉

㪈㪈㪐

㪈㪉㪇

㪚㪥㪈

㪚㪥㪊

㪈

㪉

㪈㪈㪐

㪈㪉㪇

㪚㪥㪉

㪬㪈

㪈

㪊㪇

㪊㪈

㪌㪇

㪌㪈

㪏㪇

㪏㪈

㪈㪇㪇

13.0 mm

User system

40.0 mm

30.0 mm

18.0 mm

40.0 mm

4.85 mm

1.6 mm

Approximately

15.85 mm *1

NQPACK100RB179

:Tokyo Eletech Corporation

YQSOCKET100RBF

:Tokyo Eletech Corporation

YQPACK100RB

:Tokyo Eletech Corporation

4-R5.0

WR-120SB-VF-N1 : JAE *2

PCW-1-1PW

:MAC EIGHT

WR-120SB-VF-N1 : JAE *2

U1:User system I/F connector

CN3:Incorrect insertion prevention socket

CN1/CN2:MCU board I/F connector

*1 : The height differs slightly depending on how the YQPACK and NQPACK are

engaged.

*2 : Japan Aviation Electronics Industry, Limited

■MCU footprint design notes

Figure 3 shows the recommended footprint dimensions of the NQPACK mounted on the printed cir-

cuit board for the user system.

Take the footprint in Figure 3 into consideration as well as the footprint of the mass production MCU

when designing the printed circuit board for the user system.

To follow updated information, be sure to contact Tokyo Eletech Corporation whenever designing

the PC board.

Figure 3 Recommended footprint dimensions for mounting the NQPACK

13.8 mm

19.8 mm

2.4 mm

No.1 Pin

0.35 mm

0.65 mm

5. Procedure for Connecting to the User System

■Connecting

Please mount the supplied NQPACK on the user system before using the LQFP-100P (0.5 mm pitch)

header board.

1. To connect the header board to the user system, match pin 1 indicated by the index mark (▲) on

the NQPACK mounted on the user system with pin1 indicated by the index mark (angle cut lin-

early at one place only in slik screen) on the header board and then insert it (See Figure 4) .

The pin of YQPACK is thin and easy to bend. Insert NQPACK after confirm that the pin of YQ-

PACK is not bent.

Figure 4 Index Position

2. Insert each screw for securing header board in each of the four drilled holes on the header board,

and then tighten the screws diagonally. The center screw hole is not used.

To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten

the four screws in sequence. Tightening the screws too tight might result in a defective contact.

3. Connect the MCU board to the header board while being careful not to excessively force theNQ-

PACK. The MCU board can be connected to the header board only in the correct orientation as

they have an incorrect insertion header socket to prevent reverse connection. Figure 5 illustrates

how the MCU board, header board, NQPACK, and user system are connected together.

100 81

NQPACK index mark Header board index mark

Figure 5 Connecting MCU board/header board to user system

■Disconnection

1. Remove the MCU board from the header board. Detach the four corners slowly in sequence not

to excessively force the junction with the NQPACK.

2. Remove all of the four screws from the header board. Pull out the header board vertically from

the NQPACK. Remove the header board slowly not to excessively force the junction with the

NQPACK.

YQPACK

Header board

User system

NQPACK

YQSOCKET

MCU board

Connection at the time of

shipment

Screws for securing

Header board

Evaluation

MCU

6. Mounting Mass Production MCUs

■Mounting To mount a mass production MCU on the user system, use the supplied HQPACK (IC socket cover)

(See Figure 6) .

1. To mount a mass production MCU on the user system, match the index mark (▲) on the NQ-

PACK mounted on the user system with the index mark (●) on the mass production MCU.

2. Confirm that the mass production MCU is correctly mounted on the NQPACK. Next, match the

index mark of HQPACK with the index mark of NQPACK and insert it (angle cut linearly at one

place only) .

The pin of HQPACK is thin and easy to bend. Insert NQPACK after confirm that the pin of HQ-

PACK is not bent.

3. Insert each screw for securing HQPACK in each of four drilled holes on the HQPACK, and then

tighten the screws diagonally.

To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten

the four screws in sequence. Tightening the screws too tight might result in a defective contact.

Figure 6 Mounting a mass production MCU

■Disconnection To remove the HQPACK, remove all of the four screws and pull out the HQPACK vertically from

the NQPACK. When you take out the mass production MCU, the mass production MCU is handled

by using a vacum pick-up tool. Do not attempt to remove the mass production MCU forcibly, for

example, using a screwdriver as doing so can bend the pins of the mass production MCU or break

the NQPACK.

Screwsforsecuring HQPACK

HQPACK

Mass production MCU

NQPACK

User system

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