Haier 28T9G Bedienungsanleitung

COLOUR TELEVISION

SERVICE MANUAL

Models

29T9G

Latin America

 Features

 DIGITAL IC2 BUS CONTROL

 AUTO SEARCH TUNING, 250 PROGRAMS STORED

 FULL INFRARED REMOTE CONTROL

 MULTI-PICTURE MODES SELECTION

 MULTI-FUNCTION TIMER, APPOINTING PROGRAMME

Serial Number: 0010540329 Version:00.00 Edition: 2007-04-23

COLOR TELEVISION Model:29T9G

Product code illumination and series introduction

1. Product code illumination and series introduction

2 9T9G

Appearanceserial

SuperflatCRT

CRTCatercorner29

Features

⊙DIGITAL IC2 BUS CONTROL

⊙AUTO SEARCH TUNING, 250 PROGRAMS STORED

⊙FULL INFRARED REMOTE CONTROL

⊙MULTI-PICTURE MODES SELECTION

⊙MULTI-FUNCTION TIMER, APPOINTING PROGRAMME

TV/AV Select

Sound Volume

Up/Down

Power/Standby

Program Up/Down

Mute

Lock

Call

Direct Access Numeric

Keys

Quick View

ZOOM

Picture Effect

-/--

1 3

4 5 6

7 8 9

0 QV

TIMER SOUND

V+

V-

P+

P-

PIC

TV/AV

Picture MENU

Time MENU

Sound MENU

2. REMOTE CONTROLLER

3. Specifications

Specificatio

NO. FUNCTION

1Main IC TDA9381

2CRT PF

3Color system NTSC

4Audio system M

5NO.of channels 181

6OSD language E/F/A

PIC

Multi-picture modes YES

8AV stereo YES

9Super woofer

10 Surrounding sound

11 Treble/bass boost

12 Left/right balancer

13 NICAM

14 Multi-audio modes YES

15 Tone adjuster

16 MTS/SAP

AUDIO

Auto-volume leveling ＹＥＳ

18 AVinput YES

19 AVoutput YES

20 DVD terminal YES

21 S-video jack YES

22 Headphone socket

JIC

SCART socket

24 Digital curtain

25 Slow fading on & off

26 Semitransparent menu ＹＥＳ

27 Non-flshing channel changing

28 ZOOM YES

29 16:9 mode YES

30 Games

31 Calendar YES

32 Child-lock YES

33 Multi-functional lock ＹＥＳ

34 No-picture listening

35 Background light

36 Auto-timer on YES

37 CCD ＹＥＳ

SOFTWARE

V-CHIP ＹＥＳ

NO. FUNCTION

39 NO. of built-in speakers 2

40 Audio output power(W)4W+4W

41 Total power input W140

42 Voltage range V110-250V

43 Power frequency Hz 50HZ

44 Time ofsleep timer(MINS) 10S

45 Net weight(KG) 40.5Kg

46 Gross weight(KG) ４５．５Kg

47 Net dimension(MM)

48 Packaged dimension(MM)

49 Quantity for 20' container

50 Quantity for 40' container

PARAMETER

Quantiryfor 40' high container

52 Acquired certificate

APPROVAL

Suitable market

SAFETY PRECAUTIONS

4.SAFETY PRECAUTIONS

INPORTANT SAFETY NOTICE

These parts are identified by many electrical and mechanical parts in this chassis have

special safety-related characteristics.

It is essential that these special safety parts should be replaced with the same

components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or

other Hazards.

Do not modify the original design without permission of the manufacturer.

General Guidance

An Isolation Transformer should always be used during the servicing of a receiver

whose chassis is not isolated from the AC power line. Use a transformer of adequate

power rating as this protects the technician from accidents that might result in personal

injury caused by electrical shocks.

It will also protect the receiver and it’s components from being damaged by accidental

shorts of the circuitry that might be inadvertently introduced during the service

operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with a specified

one.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the

resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Due to the high vacuum and large surface area of the picture tube, extreme care

should be taken in handling the Picture Tube. Do not lift the Picture Tube by its Neck.

X-RAY Radiation

Warning:

The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and

the Picture Tube.

For continued X-RAY RADIATION protection, the replacement tube must be of the

same type as specified in the Replacement Parts List.

Before returning the receiver to the customer,

Always perform an AC leakage current check on the exposed metallic parts of the

cabinet, such as antennas, terminals, etc., to make sure that the set is safe to operate

without any danger of electrical shock.

5.Warning and Cautions

1. When you clean the TV set, please pull

out the power plug from AC outlet. Don't

clean the cabinet and the screen with

benzene,petrolandotherchemicals.

4. To prevent the TV set from firing and

electricshock,don't

maketheTVsetrain

ormoisture.

In order to prolong the using life of the

TV set, please place it on a ventilated

place.

5.Don'topenthebackcover,otherwiseitis

possibletodamagethecomponentsinthe

TVsetandharmyou.

Don't place the

TV set in the

sunshine or near

heatsource.

6. When the TV set isn't going to be used

for long time or it is in thunder and

lightening,pleasepulloutthe plugfromAC

outlet and theantenna plugfromthe cover

oftheTVset.

Warnin

and Cautions

Figure 1

Explanation on the display tube

Warning and Cautions

Generally, it is not needed to clean the tube surface. However, if necessary, its surface

can be cleaned with a dry cotton cloth after cutting off the power. Don’t use any

cleanser. If using hard cloth, the tube surface will be damaged.

CAUTION: Before servicing receivers covered by this service manual and its

supplements and addenda, read and follow the SAFETY PRECAUTIONS.

NOTE: If unforeseen circumstances create conflict between the following servicing

precautions and any of the safety precautions, always follow the safety precautions.

Remember : Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before:

a. Removing or reinstalling any component, circuit board module or any other

assembly of the receiver.

b. Disconnecting or reconnecting any receiver electrical plug or other electrical

connection.

c. Connecting a test substitute in parallel with an electrolytic capacitor in the

receiver.

CAUTION: A wrong substitution part or incorrect installation polarity of

electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or

other voltage-measuring device (DVM, FETVOM, etc.) equipped with a suitable high

voltage probe. Do not test high voltage by “drawing an arc”.

3. Discharge the picture tube anode only by (a) first connecting one end of an

insulated clip lead to the degaussing or kine aquadag grounding system shield at

the point where the picture tube socket ground lead is connected, and then (b) touch

the other end of the insulated clip lead to the picture tube anode button, using an

insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by

applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick

or comparable nonabrasive applicator; 10% (by volume) Acetone and 90% (by

volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts is not

required.

6.Do not defeat any plug / socket B+ voltage interlocks with which receivers covered

by this service manual might be equipped.

Warning and Cautions

7. Do not apply AC power to this instrument and/or any of its electrical assemblies

unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before

connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this

receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity.

Such components are usually called Electrostatically Sensitive (ES) Devices.

Examples of typical ES devices are integrated circuits and some field effect transistors

and semiconductor “chip” components. The following techniques should be used to

help reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-

equipped assembly, drain off any electrostatic charge on your body by touching a

known earth ground. Alternatively, obtain and wear a commercially available

discharging wrist strap device, which should be removed to prevent potential shock

prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the

assembly on a conductive surface such as aluminum foil, to prevent electrostatic

charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type folder removal device. Some solder removal devices

not classified as “anti-static” can generate electrical charges sufficient to damage

ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges

sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until

immediately before you are ready to install it. (Most replacement ES devices are

packaged with leads electrically shorted together by conductive foam, aluminum foil

or comparable conductive material).

7. Immediately before removing the protective material from the leads of a

replacement ES device, touch the protective material to the chassis or circuit

assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all

Warning and Cautions

other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices.

(Otherwise even some normally harmless motions such as mutual brushing of your

clothes’ fabric or lifting of your foot from a carpeted floor might generate static

electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape

that will maintain tip temperature within the range of 500of to 600of.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40

parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire bristle (0.5 inch, or

1.25cm) brush with a metal handle. Do not use freon-propelled spay-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.(500o F to 600o F)

b. Heating the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-type solder removal

device with solder braid.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.(500o F to 600o F )

b. First, hold the soldering iron tip and solder the strand against the component

lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the component lead and

the printed circuit foil, and hold it there only until the solder flows onto and

around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or splashed solder

with a small wire-bristle brush.

Remove /Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are

inserted and then bent flat against the circuit foil. When holes are of slotted type, the

following technique should be used to remove and replace the IC. When working with

boards using the familiar round hole, use the standard technique as Outlined .

Warning and Cautions

Removal

Desolder and straighten each IC lead in one operation by gently prying up on the lead

with the soldering iron tip as the solder melts.

Draw away the melted solder with an anti-static suction-type solder removal device (or

with solder braid) before removing the IC.

Replacement

Carefully insert the replacement IC in the circuit board.

Carefully bend each IC lead against the circuit foil pad and solder it.

Clean the soldered areas with a small wire-bristle brush.(It is not necessary to reapply

acrylic coating to the areas).

“Small-Signal” Discrete Transistor

Removal/Replacement

Remove the defective transistor by clipping its leads as close as possible to the

component body.

Bend into a “U” shape the end of each of three leads remaining on the circuit board.

Bend into a “U” shape the replacement transistor leads.

Connect the replacement transistor leads to the corresponding leads extending from

the circuit board and crimp the “U” with long nose pliers to insure metal to metal contact

then solder each connection.

Power Output, Transistor Device

Removal/Replacement

Heat and remove all solder from around the transistor leads.

Remove the heat sink mounting screw (if so equipped).

Carefully remove the transistor from the heat sink of the circuit board.

Insert new transistor in the circuit board.

Solder each transistor lead, and clip off excess lead.

Replace heat sink.

Diode Removal/Replacement

Remove defective diode by clipping its leads as close as possible to diode body.

Bend the two remaining leads perpendicularly to the circuit board.

Observing diode polarity, wrap each lead of the new diode round the corresponding

lead on the circuit board.

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