Hewlett Packard Enterprise Integrity Superdome X BL920s Gen9 Montageanleitung

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HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HPE Integrity Superdome X BL920s Gen9

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU

directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

AT068-2001G(AT068A) A0R69-60101(A0S01A)

743824-001, IVB-EX E7-2890v2 2.8GHz/15

Core/37.5M 731932-001, IVB-EX E7-8891 v2 10-

core/3.2GHz/155W/37.5M 729443-001, IVB-EX E7-

4830 v2 10-core/2.2GHz/105W/20M 743825-001,

IVB-EX E7-2880 v2 15-core/2.5GHz/130W/37.5M

731932-002, IVB-EX E7- 8893v2 12

core/3.4GHz/155W/37.5M 712384-081

DIMM,32GB PC3-14900L 752371-081 DIMM,16GB

PC4-2133P-L 655639-B21 BLOM 10Gb NIC

700741-B21 BLOM 10Gb 2P 534FLB 655637-001

BLOM PCIeG2x8 2p 10Gb KR 665244-001 PCA

MEZZ PCIeG2x8 2p 10GE 665246-B21 HP

Ethernet 10Gb 2P 560M Adptr 710608-B21 HP

QMH2672 16Gb FC HBA AH337-60502, Upper

Midplane 013585-001, Lower Signal Midplane

AH337-60405, DVD Module AH337-60604, GPSM

408439-502, Assy Fan PCA 012913-502, PCA,

PWR MOD 012958-502, PCA, LCD Blindmate

Paddle 012955-601, PCA, LCD Pass Thru Crd-

Edge 407295-502, Assy, Management Sleeve

AH341-60401, XFM AH389-60003, Onboard

Administrator C8S47-63001 Interconnect 538113-

B21 Interconnect 711307-B21 Interconnect

658247-B21 Interconnect HP 6125G Blade Switch

310

(Maximum)

MF877-00 Page 2

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HPE instructions for this template are available at MF877-01

Item Description Notes

Quantity

of items

included

in product

Batteries

All types including standard alkaline and lithium

coin or button style batteries

1420-0524 (NVRAM) Blade

M4T28-BR12SH1TR OA

(Maximum)

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Per Power Supply

2 or 4

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Torx Screw driver

T6 & T10

Torx Screw driver

T15 & T25

Flat blade screwdriver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Compute enclosure front components (See Figure 1)

2. Compute Enclosure Rear Components (See Figure 2)

3. Remove power supplies

•Press the release button

•Pull down the handle

MF877-00 Page 3

Template Revision A

HPE instructions for this template are available at MF877-01

•Remove the power supply (quantity 12) (SEE Figure 3)

4. Removing DVD Module

•Remove USB cables from DVD to OA

•Remove the DVD module bezel

•Press the button on the front of the DVD module to release handle

•Pull the handle and slide the DVD module out enclosure (SEE Figure 4)

5. Remove the Server Blades(s)

•CAUTION: After you press the release buttons, the server blade is unlocked from the enclosure. Use both hands to

support the server blade when you remove it from the enclosure. The Server Blade weighs approximately 15.4 kg

(34 lb) (SEE Figure 5)

•Lay Server Blade on flat surface

•Remove the access panel by lifting it straight up and off the server Blade (SEE Figure 6)

•Locate the two processors.

oRemove the processor heat sink: (SEE Figure 7)

Lift the load bail (1).

Lift the load bar (2).

If necessary, break thermal interface between the heat sink base and processor. If necessary use a

small screw driver (3).

Lift the heat sink (4).

oRemove the processor: (SEE Figure 7)

Open the load bar (1).

Open the load bails (2).

Lift the load plates (3).

oRemove the DIMMs, maximum quantity 32 (SEE Figure 8)

oRemove the one battery using a nonconductive tool small enough to fit into the battery slot as leverage and

lift the battery from the front of the holder. (SEE Figure 9).

6. Remove the active cool fans, quantity 15.

•Turn the handle counterclockwise

•Remove the fan.

7. Remove the interconnect switch (maximum quantity 8)

•Disconnect all cables from component

•Press the release tab

•Open the handle

•Remove the interconnect switch (See figure 2 for location)

8. Remove Onboard Administrator modules (quantity)

MF877-00 Page 4

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HPE instructions for this template are available at MF877-01

•Disconnect all cables

•Press the release tab and open handle and remove onboard administrator; quantity 2 (See Figure 2 for

location)

•On the Onboard Administrator Modules that were removed, depress the button in the center and remove the

top panel.

oRemove the PCB and look for the Yellow battery. This battery can be removed from its corresponding

IC by using your fingers. (See Figure 10)

•Press the release handle on the onboard administrator tray and open handle. Note: This is the assembly that

the onboard administrator installs into (See Figure 11).

9. Remove the GPSMs

•Disconnect all cables

•Press the button on the front of the GPSM to release handle

•Pull the handle and slide the GPSM out of the enclosure

10. Remove the XFM; quantity of 4

•Disconnect all X-Bar Flex-connect cables

•Press buttons on the front of the XFM to release the handles

•Pull the handles and slide the XFM out of the enclosure

11. Remove the ac input modules

•Completely unscrew the three thumbscrews that secure the ac input module. The screws remain captive after

they are unscrewed

•Remove the ac input modules (See Figure 2 for location; See Figure 12 for component removal)

12. Remove the I/O chassis (Enclosure tear down)

•Unscrew the ten thumbscrews and open the hinges completely

•Use the handles to extend the I/O chassis until the release levers engage on both sides of the I/O Chassis

•Grasp the handholds below the release levers

•Disengage the release levers on both sides of the rear chassis

oCAUTION: When removing and lifting the I/O chassis, always grasp the handholds as far forward as

possible. The frontend of the I/O chassis is heavy and the handholds provide a more balanced location

to distribute the weight.

•Use the handholds to extend and remove the I/O Chassis from the enclosure (See figure 13).

13. Remove the midplane brick assembly.

•WARNING: At least two people are required to safely move the midplane to avoid personal injury

•Pull the plunger pins in each corner and rotate ¼ turn to lock them in position

•Use the handles to extend and remove the midplane assembly from the enclosure (See figure 14)

•Place midplane brick flat on table to allow disassembly.

14. Disassembly midplane brick

•Remove status panel PCA (See Figure 15)

MF877-00 Page 5

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HPE instructions for this template are available at MF877-01

•Remove Air Valve assemblies

oRemove 3 screws from each side. Lift out the air valve assemblies (See Figure 16)

•Remove Fan PCAs

oDisconnect cables to the 3 Fan PCA’s. Remove 3 screws from each fan PCA.

oRemove PCAs (See Figure 17)

•Unlatch DVD Cable (See Figure 18)

•Remove Airframe screws (See Figure 19)

•Remove Airframes and midplanes (See Figure 20)

•Remove the busbar assemblies (Figure 21)

•Remove power PCAs from busbar assemblies (Figure 22)

15. Remove power Supply covers

•Locate Capacitors greater than 2.5cm (Figure 23)

•Using a flat blade screwdriver pry capacitors from the supply; there will either be 2 or 4 per supply

•Note: There are two types of supplies and three vendors, Figure 23 will have examples of all

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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HPE instructions for this template are available at MF877-01

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HPE instructions for this template are available at MF877-01

MF877-00 Page 8

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Attachment 4:

MF877-00 Page 9

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HPE instructions for this template are available at MF877-01

Attachment 6:

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HPE instructions for this template are available at MF877-01

Attachment 8:

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