HP Apollo r2800 Montageanleitung

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HP Apollo r2800 Chassis

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Depending on power supply model

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Torx Driver

T10

Torx Driver

T15

Torx Driver

T20

Phillips Driver

No.1

Phillips Driver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. System Megacell -- Remove the top cover and locate the megacell on the system board. Remove the megacell and

dispose properly.

2. Capacitors> 2.5CM -- Remove the power supplys from the system. With #2 Phillips driver remove the screws securing

the top cover and the heatsinks in the power sullpy then locate the capacitors and pry from the PCB and dispose of

properly.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Attachment #1

Attachment #1 Location of Megacell

Attachment #2 ~#8 Capacitor location by model number of power supply

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Attachment #2

Attachment #3

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Attachment #4

Attachment #5

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Attachment #6

Attachment #7

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Attachment #8

Inhaltsverzeichnis

Andere HP Computerhardware Handbücher

HP 64767 Bedienungsanleitung

HP Model 744 - VME Workstation Bedienungsanleitung

HP StoreOnce 2700 Bedienerhandbuch

HP AB479A Bedienungsanleitung

HP 3000 Series Handbuch

HP 4440B Bedienungsanleitung

HP UNDP-1H Bedienungsanleitung

HP F1381A Bedienungsanleitung

HP A3550A - High Availability Disk Arrays Model 20 Storage... Bedienungsanleitung

HP Z400 - Workstation Bedienungsanleitung

HP MPIO Installations- und Betriebsanleitung

HP JG587A Bedienungsanleitung

HP Xw4600 - Workstation - 2 GB RAM Merkblatt

HP Smart Array P400 Gebrauchsanweisung

HP Nx9420 - Compaq Business Notebook Handbuch

HP Xw4600 - Workstation - 2 GB RAM Bedienungsanleitung

HP AF079A Installationsanleitung

HP A4800A Leitfaden

HP Z Turbo Drive Quad Pro Bedienungsanleitung

HP NC364T Bedienungsanleitung

HP 405132-B21 Bedienungsanleitung

HP OmniBook 3100 Bedienungsanleitung

HP HP 27113A Handbuch

Beliebte Computerhardware Handbücher anderer Marken

EMC2

EMC2 VNX Series Betriebsanleitung

Panasonic

Panasonic DV0PM20105 Bedienungsanleitung

Mitsubishi Electric

Mitsubishi Electric Q81BD-J61BT11 Bedienungsanleitung

Gigabyte

Gigabyte B660M DS3H AX DDR4 Bedienungsanleitung

Raidon

Raidon iT2300 Bedienungsanleitung

National Instruments

National Instruments PXI-8186 Bedienungsanleitung

Hauppauge

Hauppauge WinTV-HVR-2250 Bedienungsanleitung

Kontron

Kontron CP6002 Bedienungsanleitung

Manhattan

Manhattan 702843 Bedienungsanleitung

Aphex

Aphex 230 Bedienungsanleitung

AMD

AMD Phenom II Betriebshandbuch

Intel

Intel NUC 12 Pro Bedienungsanleitung

dbx

dbx Zone Pro 1260 Bedienungsanleitung

Galaxy

Galaxy GHDX2-2430S-24F4D Bedienungsanleitung

Intel

Intel AXXRMFBU4 Bedienungsanleitung

Kontron

Kontron DIMM-PC/MD Bedienungsanleitung

ST X-NUCLEO-SAFEA1B Betriebsanleitung

STEINWAY LYNGDORF

STEINWAY LYNGDORF SP-1 Bedienungsanleitung