HP Veer Montageanleitung

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Handheld Devices

Marketing Name / Model

[List multiple models if applicable.]

HP Veer

Broadway

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

1 EA

(26.48 sq

cm)

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Cross screw Driver

PH 0X50

Plastic tweezers

Anti-magnetic metal tweezers

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Take off front housing cover and uninstall LCM from the hinge.

2. Remove battery cover and battery.

3. Disassemble battery strap.

4. Disassemble speaker box from PCBA.

5. Remove antenna and microphone boot.

6. Remove screws X2.

7. Separate SIM door cover and PCBA from phone chasse.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

ALL COMPONENTS-MATERIALS

PCBA

Hinge Assembly

Metal LCM

Plastic Battery

Andere Handbücher für Veer

Inhaltsverzeichnis

Andere HP Handheld Handbücher

HP iPAQ hx4700 Bedienungsanleitung

HP Jornada 540 Series Bedienungsanleitung

HP iPAQ Bedienungsanleitung

HP iPAQ hw6500 Bedienungsanleitung

HP iPAQ h1910 Bedienungsanleitung

HP iPAQ Pocket PC h5400 Series Bedienungsanleitung

HP iPAQ 510 Bedienungsanleitung

HP iPAQ h5450 Bedienungsanleitung

HP iPAQ H1900 series Bedienungsanleitung

HP iPAQ Pocket PC h5400 Series Montage- und Bedienungsanleitung

HP iPAQ rx3000 series Bedienungsanleitung

HP iPAQ Business Navigator Bedienungsanleitung

HP iPAQ 4700 Montageanleitung

HP iPAQ hx2790c Gebrauchsanweisung

HP iPAQ hx4700 Bedienungsanleitung

HP iPAQ hx2000 Series Bedienungsanleitung

HP iPAQ rx3000 series Gebrauchsanweisung

HP iPAQ h2200 Series Bedienungsanleitung

HP IPAQ H5100 Bedienungsanleitung

HP iPAQ h4100 Bedienungsanleitung

HP 820 Bedienungsanleitung

HP iPAQ Bedienungsanleitung

HP iPAQ h5500 Series Bedienungs- und Sicherheitshinweise

HP iPAQ h6300 Montageanleitung

Beliebte Handheld Handbücher anderer Marken

Honeywell

Honeywell Dolphin 9900 Bedienungsanleitung

Honeywell

Honeywell CN75 Bedienungsanleitung

MiTAC

MiTAC Mio 168 Bedienungsanleitung

Wasp

Wasp WDT92 Bedienungsanleitung

Texas Instruments

Texas Instruments TI-Nspire Bedienungsanleitung

AXEM Technology

AXEM Technology MBS Bedienungsanleitung

Armstrong

Armstrong Brain Wave Montageanleitung

Unitech

Unitech TB128 Bedienungsanleitung

Symbol

Symbol MC9000-G Installations- und Betriebshandbuch

Unitech

Unitech HT1 1D Batch Bedienungsanleitung

Ingenico

Ingenico IWL220 GPRS Bedienungsanleitung

Intermec

Intermec CK61 Bedienungsanleitung

Symbol

Symbol c2000 Bedienungsanleitung

Symbol

Symbol MC18 Installations- und Betriebshandbuch

Acer

Acer n20 Bedienungsanleitung

Intermec

Intermec CK61 Bedienungsanleitung

Docomo

Docomo F-04H Bedienungsanleitung

Toshiba

Toshiba e350 Series Bedienungsanleitung