HP 240 G2 Montageanleitung
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category:
Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP 240 G2 Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0
Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm
Mother board 1
Batteries All types including standard alkaline and lithium coin
or button style batteries Battery Pack,RTC 2
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas
discharge lamps LCD 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent
chambers, and service stations. 0
Components and waste containing asbestos
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Automatic Screw Driver Philip #1
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disassembly and remove Service Door
2. Remove battery module
3. Disassemble Motherboard and thermal module
4. Diassemble Keyboard and touchpad
5. Diassemble C cover
6. Disassemble LCD module
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Total part disassembly
3.22 Remove battery module
3.23 Remove service door
3.24 LCD module set disassembly
3.25 Top case disassembly
3.26 Thermal module and mother board disassembly
3.27 Bottom case disassembly
Tabulator: Nathan Ho
EL-MF877-00 Page 3
Template Revi ion B
PSG in truction for thi template are available at EL-MF877-01
Work Instructs
Document No. :Disassembly WI Step : 1
Name :Get Battery
Date : 2013-11-13
Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty
Philip #1 1
Point for attention: If finding some defects, notice the gaffer and assess.
Step:
1. Remove Batter pack.
2. Loosen screws in D cover,
Tabulator: Nathan Ho
EL-MF877-00 Page 4
Template Revi ion B
PSG in truction for thi template are available at EL-MF877-01
Work Instructs
Document No. :Disassembly WI Step : 2
Name :Disassemble C cover
Date : 2013-11-13
Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty
Philip #1 1
Point for attention: If finding some defects, notice the gaffer and assess.
Step:
1. Remove service door, get
memory card, WLAN card.
2. Open t e notebook.
Disassemble t e C cover.
Tabulator: Nathan Ho
EL-MF877-00 Page 5
Template Revi ion B
PSG in truction for thi template are available at EL-MF877-01
Work Instructs
Document No. :Disassembly WI Step : 3
Name :Disassemble C cover
Date : 2013-11-13
Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty
Philip #1 1
Point for attention: If finding some defects, notice the gaffer and assess.
Step:
1. Remove C cover.
2. Disassemble power button,
Touc pad board, and
keyboard.
Tabulator: Nathan Ho
EL-MF877-00 Page 6
Template Revi ion B
PSG in truction for thi template are available at EL-MF877-01
Work Instructs
Document No. :Disassembly WI Step : 4
Name :Disassemble MB
Date : 2013-11-13
Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty
Philip #1 1
Point for attention: If finding some defects, notice the gaffer and assess.
·
Step:
1. Loosen screws on MB.
2. Get mot er board.
Tabulator: Nathan Ho
EL-MF877-00 Page 7
Template Revi ion B
PSG in truction for thi template are available at EL-MF877-01
Work Instructs
Document No. :Disassembly WI Step :5
Name :Disassemble MB
Date : 2013-11-13
Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty
Cross Head of Screws Driver 1
Point for attention: If finding some defects, notice the gaffer and assess.
Step:
1. Get t e HDD, ODD and USB board
from C cover.
2. Disassemble t ermal module.
Tabulator: Nathan Ho
EL-MF877-00 Page 8
Template Revi ion B
PSG in truction for thi template are available at EL-MF877-01
Work Instructs
Document No. :Disassembly WI Step :6
Name :Disassemble MB Date : 2013-11-13
Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty
Philip #1 1
Point for attention: If finding some defects, notice the gaffer and assess.
Step:
1. Get t e t ermal module and
mot er board.
Tabulator: Nathan Ho
EL-MF877-00 Page 9
Template Revi ion B
PSG in truction for thi template are available at EL-MF877-01
Work Instructs
Document No. :Disassembly WI Step : 7
Name :Disassemble D cover
Date : 2013-11-13
Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty
Philip #1 1
Point for attention: If finding some defects, notice the gaffer and assess.
Step:
1. Tear down DC in cable,
speaker.
2. Disassemble LCD panel and
Touc screen.
Tabulator: Nathan Ho
EL-MF877-00 Page 10
Template Revi ion B
PSG in truction for thi template are available at EL-MF877-01
Work Instructs
Document No. :Disassembly WI Step : 8
Name :Disassemble LCD Module
Date : 2013-11-13
Fixture list(Fixture standard) Qty Fixture list(Fixture standard) Qty
Philip #1 1
Point for attention: If finding some defects, notice the gaffer and assess.
Step:
Disassemble LCD module,
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