HP Classmate Montageanleitung

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP Classmate Notebook PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

PCBA, IO Board, RAM, HDD, TOUCHPAD

Batteries

All types including standard alkaline and lithium coin

or button style batteries Li-ion polymer

Battery,lithium coin batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps LCD

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Adapter Cable, Power Core

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

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Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove Base Rubber and Dis-fastent Screws *8

2. Remove Keyboard and Pull out The KB's FFC Cable.

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3. Dis-fastn TOP Screw*6

4. Dis-fasten the Base Screws*8 and Open Base Case with Top Cover

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5. Remove The Battery's Black Tape and Dis-fasten Battery's Screws *2

6. Remove the Battery

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7. Dis-fasten the HDD’s Screws *4, Pull Out HDD’s FPC Cable and Remove HDD.

8. Dis-fasten The HDD Bracket Screw*4

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9. Remove the HDD Bracket

10. Remove the HDD Rubber and FPC Cable

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11. Remove the DDR’s Acetate Tape and the HDD

12. Remove the Wlan Card’s Acetate Tape and Dis-fasten the Wlan Card’s Screw *1

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13. Pull Out the WLan Cable and Remove the WLan Card

14. Separate WLan Cable

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15. Dis-Fasten the Thermal Model’s Screws*3

16. Remove the Thermal Model.

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17. Dis-fasten the LVDS Cable’s Screws*1 and Pull out the LVDS Cable.

18. Pull out the MIC cable

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

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