HP Compaq Presario CQ72 Montageanleitung

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP Presario CQ72 Notebook PC

Name / Model #2

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Mother board, Touch pad

Batteries

All types including standard alkaline and lithium coin

or button style batteries Battery pack, Coin cell

battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps (LCD panel)

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

(EPS)

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Screwdriver

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Disassemble main battery

2. Disassemble ram door & hdd door

3. Dis-fasten BASE screw*25(M2.5*3,M2.5*5,M2.5*6.5)

4. Pull out hdd cable

5. Dis-fasten hdd screw*3(M2.5*5)

6. Disassemble HDD ASSY

7. Dis-fasten hdd bracket screw*4(M3*3.5)

8. Remove HDD

9. Pull out WLAN cables

10. Dis-fasten WLAN module screw*1(M2*3)

11. Remove WLAN module

12. Remove RAM module from Mainboard

13. Remove ODD ASSY

14. Remove ODD from ODD ASSY

15. Pull out Keyboard membrane

16. Remove Keyboard

17. Dis-fasten TOP screw*1(M2.5*5)

18. Pull out speaker cable

19. Pull out power FFC, Touchpad FFC & TP button FFC

20. Disassemble TOP ASSY

21. Dis-fasten speaker screw*2(M2.5*3)

22. Disassemble speaker

23. Pull out LCD cable, MIC cable, CCD cable, Bluetooth cable, ODD cable, Modem cable,DC cable & USB FFC

24. Dis-fasten Modem screw*2(M2*3)

25. Remove Modem module

26. Dis-fasten LCD ASSY screw*4(M2.5*6.5)

27. Disassemble LCD ASSY

28. Dis-fasten Mainboard & FAN module screw*3(M2.5*4)

29. Disassemble Mainboard

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

30. Dis-fasten fan screw*6

31. Remove FAN module

32. Disassemble CPU

33. Remove screw mylar*2

34. Dis-fasten LCD BEZEL screw*2(M2.5*4)

35. Disassemble LCD BEZEL

36. Dis-fasten hinge cover screw*2(M2.5*4)

37. Remove hinge cover*2

38. Dis-fasten hinge screw*8(M2.5*4)

39. Disassemble panel with hinge bracket

40. Dis-fasten hinge bracket screw*4(M2*3)

41. Remove hinge bracket

42. Pull out LCD cable

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

LCD panel disassembly process

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