HP Compaq Presario M2000 Montageanleitung

HP-00007-01, Appendix 3 13-Oct-2004

Page 1

Appendix 3 Product End-of-Life Disassembly instructions

Product Identification:

Marketing Name / Model Description

Compaq Presario M2000 Series Notebook PC Notebook PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the

basic instructions for the disassembly of HP products to remove components and materials requiring

selective treatment.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in

the right column, as applicable.

Item Description Notes Quantity of

items included

in product.

Printed Circuit Boards (PCB) or Printed

Circuit Assemblies (PCA) With a surface greater than 10

square cm 2

Batteries All types including standard

alkaline and lithium coin or button

style batteries

Mercury containing components For example, mercury in lamps,

display backlights, scanner lamps,

switches, batteries

Liquid Crystal Displays (LCD) with a

surface greater than 100 square cm Includes background illuminated

displays with gas discharge lamps 1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing

PCB / PCT) 0

Electrolytic Capacitors / Condensers

measuring greater than 2.5 cm in

diameter or height

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame

Retardants Declaration limited to case

plastics only. 0

Components and parts containing toner

and ink, including liquids, semi-liquids

(gel/paste) and toner

Include the cartridges, print

heads, tubes, vent chambers, and

service stations.

Components and waste containing

asbestos 0

Components, parts and materials

containing refractory ceramic fibers 0

HP-00007-01, Appendix 3 13-Oct-2004

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Components, parts and materials

containing radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a

point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Screwdriver Type-cross #1 (JIS B 4633-1987)

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials

requiring selective treatment:

1 Remove 6 or 12 cell main battery from system bottom.

2 Remove two M2.5*5L screws on HDD door, then remove HDD.

3 Remove a M2.5*6L screw on BASE cover, then remove ODD.

4 Remove three M2.5*5L screws on BASE cover, then remove RAM door and MINIPCI

door.

5 Remove two M2.5*4L screws to remove the keyboard cover.

6 Remove three M2.5*3L and one M2.5*6L screws to remove the keyboard and release out

the T/P module FFC.

7 Remove two M2.5*6L screws to remove the led board.

8 Remove four M2.5*6L screws, then remove LCD assy.

9 Remove five M2.5*6L, three M2.5*4L screws on top side and seven M2.5*6L, five

M2.5*15L, six M2.5*4L screws on bottom side to remove base cover and speaker box.

10 Remove two M2.5*4L screw and then remove daughter board.

11 Remove two M2.5*4L screws and then remove the battery board.

12 Remove two M2.5*4L screws and then remove the DC board.

13 Remove three M2.5*4L screws and then remove MB

14 Remove four M2.0 spring screw and one M2.5*4L screw and then remove thermal

module.

15 Remove six M2.5*5L screws and then remove LCD bezel.

16 Remove six M2.5*5L and four M2*3L screws to remove LCD panel and inverter board.

17 Divide from connecter and remove RTC coin cell battery on MB for selective treatment

18 Disassemble LCD panel and remove mercury bulb for selective treatment.

HP-00007-01, Appendix 3 13-Oct-2004

Page 3

3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic

depicting the locations of items contained within the product which require selective

treatment (with descriptions and arrows identifying locations) can be inserted below:

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