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HP-00007-01, Appendix 3 13-Oct-2004

HP Restricted

Page 1

Appendix 3 Product End-of-Life Disassembly instructions

Product Identification:

Marketing Name / Model Description

Compaq V2000 Series Notebook PC Notebook PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the

basic instructions for the disassembly of HP products to remove components and materials requiring

selective treatment.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in

the right column, as applicable.

Item Description Notes Quantity of

items included

in product.

Printed Circuit Boards (PCB) or Printed

Circuit Assemblies (PCA) With a surface greater than 10

square cm 5

Batteries All types including standard

alkaline and lithium coin or button

style batteries

2

Mercury containing components For example, mercury in lamps,

display backlights, scanner lamps,

switches, batteries

1

Liquid Crystal Displays (LCD) with a

surface greater than 100 square cm Includes background illuminated

displays with gas discharge lamps 1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing

PCB / PCT) 0

Electrolytic Capacitors / Condensers

measuring greater than 2.5 cm in

diameter or height

0

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame

Retardants 0

Components and parts containing toner

and ink, including liquids, semi-liquids

(gel/paste) and toner

Include the cartridges, print

heads, tubes, vent chambers, and

service stations.

0

Components and waste containing

asbestos 0

Components, parts and materials 0

HP-00007-01, Appendix 3 13-Oct-2004

HP Restricted

Page 2

containing refractory ceramic fibers

Components, parts and materials

containing radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a

point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Screwdriver Type-cross #1 (JIS B 4633-1987)

Screwdriver Type-cross #2 (JIS B 4633-1987)

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials

requiring selective treatment:

1 Remove 6 cell battery.

2 Remove two M2.5*5L screws on HDD door, then take out HDD (contains PCA)

3 Remove one M2.5*7.5L screw on BASE cover, then take out ODD (contains PCA)

4 Remove three M2.5*5L screws on BASE cover, then take out RAM door and MINIPCI

door.

5 Remove fourteen M2.5*7.5L and nine M2*3L screws on BASE cover, then reverse it.

6 Remove keyboard cover assy., then take out keyboard and draw out LCD assy.

7 Reverse it and remove BASE case assy.

8 Remove two M2.5*4L screws, then remove daughter board PCA.

9 Remove four M2.5*4L screws on top cover assy., then remove AV board PCA.

10 Remove four M2.5*4L screws, then take out MB PCA.

11 Remove six M2.5*5L screws, then take out LCD bezel

12 Remove one M2*2.5L and six M2.5*5L screws, then take out inverter board and LCD

panel.

13 Disassemble LCD panel and remove mercury backlight for selective treatment

14 Remove three MS2*1.8L screws on top cover assy., then take out LED board.

15 Divide motherboard from connecter and take out RTC coin cell battery for selective

treatment

3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic

depicting the locations of items contained within the product which require selective

treatment (with descriptions and arrows identifying locations) can be inserted below:

HP-00007-01, Appendix 3 13-Oct-2004

HP Restricted

Page 3