HP Notebook Montageanleitung
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Notebook, HP Notebook 17
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE)
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
5
Batteries
All types including standard alkaline and lithium coin
or button style batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screwdriver
#1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove battery module
2. Remove base rubber foot -L & -R
3. Dis-fasten Base Cap -L & -R screw*2
4. Remove Base Cap foot -L & -R
5. Dis-fasten ODD screw*1
6. Remove ODD
7. Dis-fasten BASE screw*20
8. Pull out FFC*3 (Power, Touchpad, keyboard membrane)
9. Dis-fasten daughter boards screw*4 (Power, Touchpad)
10. Remove daughter boards*2 (Power, Touchpad )
11. Pull out wire cable *5(LCD, DC cable, HDD, ODD, speaker) Pull out FFC(USB, Battery)
12. Pull out Antenna cables
13. Dis-fasten Wireless screw*1
14. Remove Wireless card
15. Remove HDD
16. Dis-fasten USB boards screw*2
17. Remove USB boards
18. Dis-fasten motherboard screw*7
19. Remove motherboard
20. Remove Memory
21. Pull out fan cable
22. Dis-fasten Fan screws*1
23. Remove Fan
24. Dis-fasten thermal module screw*4
25. Remove thermal module
26. Remove ODD cable
27. Dis-fasten Battery boards screw*2
28. Remove Battery boards
29. Dis-fasten speaker screw*2
30. Remove speaker -L & -R
31. Dis-fasten Hinge screw*10
32. Remove DC cable
33. Remove LCD bezel
34. Pull out LCD cable & camera cable
35. Dis-fasten LCD Bezel screws*6
36. Remove LCD module
37. Remove Camera module
38. Dis-fasten LCD BKT -L & -R screws*4
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
39. Remove LCD module
40. Dis-fasten Hinge screw*8
41. Remove Hinge -L & -R
42. Remove Antenna cables -L & -R
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Total
3.22 Remove battery module and Base Cap -L & -R
3.23 Remove ODD module.
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Andere Handbücher für Notebook
8
Dieses Handbuch passt für folgende Modelle
1
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