HP OMEN X 15 Montageanleitung

EL-MF877-00 Page 1

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP OMEN X by HP 15 Laptop

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the

disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive

2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the

plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description

Notes

Quantity of

items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries, excluding Li-Ion batteries.

All types including standard alkaline, coin or button style

batteries

Li-Ion batteries. Include all Li-Ion batteries if more than

one is provided with the product (such as a detachable

notebook keyboard battery, RTC coin cell, etc.)

Battery(ies) are attached to the product by (check all

that apply with an “x” inside the “[ ]”):

[x] screws

[ ] snaps

[ ] adhesive

[ ] other. Explain

NOTE: Add detailed removal procedures including

required tools in the sections 3.1 and 3.2.

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater than

100 sq cm

Includes background illuminated displays with gas

discharge lamps 15.6”

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring greater

than 2.5 cm in diameter or height

External electrical cables and cords

DC Cable for External Power Supply

Gas Discharge Lamps

EL-MF877-00 Page 2

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Item Description

Notes

Quantity of

items

included in

product

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing refractory

ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and

materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw Driver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment

including the required steps to remove the external enclosure:

1. Dis-fasten BASE Screw*6

2. Remove BASE and remove Battery connector

3. Dis-fasten SSD screw*2

4. Remove SSD*2 PCS and Ram*2PCS

5. Dis-fasten Battery and speaker screw*7

6. Remove Battery and Speaker

7. Dis-fasten IO BKT and DC BKT screw*4

8. Remove IO BKT and DC BKT

9. Dis-fasten Thermal model Screw*6 and Relase Thermal modle screw*7

10. Remove Thernal module and DC in Cable

11. Dis-fasten PCB screw *7 and 2nd panel DB screw*2

12. Release KB FPC/ 2nd panel DB /Antenna connector /IR FFC / LVDS FPC /Power FFC and Remove MB PCB

13. Dis-fasten Cu plate screw *1/ Power screw*1 and IR DB screw*2

14. Remove Cu Plate and KB FPC

15. Remove 2nd DB with 2nd Panel FPC / IR DB with IR FFC and Power DB

16. TOP remove release, dis-fasten Hinge screw *6 and remove LCD part

17. Remove Bezel , dis-fasten hinge cap screw*2 and remove hing cap*2PCS

18. Dis-fasten Hinge screw*6

19. Remove Panel Easy pull Adhesive

20. Remove Panel and Hinge*2PCS

EL-MF877-00 Page 3

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

21. Dis-fasten hinge bkt screw *6

22. Remove LVDS FPC/ Backlight module / Hinge BKT*2PCS /Camera module

23. Remove Antenna module and Backlight DB

24. END

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the

product that require selective treatment (with descriptions and arrows identifying locations).

3.21 Dis-fasten BASE Screw*6

3.22 Remove BASE and remove Battery connector

3.23 Dis-fasten SSD screw*2

EL-MF877-00 Page 4

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

3.24 Remove SSD*2 PCS and Ram*2PCS

3.25 Dis-fasten Battery and speaker screw*7

3.26 Remove Battery and Speaker

EL-MF877-00 Page 5

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

3.27 Dis-fasten IO BKT and DC BKT screw*4

3.28 Remove IO BKT and DC BKT

3.29 Dis-fasten Thermal model Screw*6 and Relase Thermal modle screw*7

EL-MF877-00 Page 6

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

3.30 Remove Thernal module and DC in Cable

3.31 Dis-fasten PCB screw *7 and 2nd panel DB screw*2

3.32 Release KB FPC/ 2nd panel DB /Antenna connector /IR FFC / LVDS FPC /Power FFC and Remove MB PCB

EL-MF877-00 Page 7

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

3.33 Dis-fasten Cu plate screw *1/ Power screw*1 and IR DB screw*2

3.34 Remove Cu Plate and KB FPC

3.35 Remove 2nd DB with 2nd Panel FPC / IR DB with IR FFC and Power DB

EL-MF877-00 Page 8

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

3.36 TOP remove release, dis-fasten Hinge screw *6 and remove LCD part

3.37 Remove Bezel , dis-fasten hinge cap screw*2 and remove hing cap*2PCS

3.38 Dis-fasten Hinge screw*6

EL-MF877-00 Page 9

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

3.39 Remove Panel Easy pull Adhesive

3.40 Remove Panel and Hinge*2PCS

3.41 Dis-fasten hinge bkt screw *6

EL-MF877-00 Page 10

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

3.42 Remove LVDS FPC/ Backlight module / Hinge BKT*2PCS /Camera module

3.43 Remove Antenna module and Backlight DB

3.44 END

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