HP Pavilion Notebook PC 17 Montageanleitung

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP Pavilion Notebook PC 17

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries battery cell , RTC battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

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refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove battery

2. Remove BASE screw*14

3. Disassemble Base

4. Pull out antenna, LCD cable, speaker-R, and FFC*5 (HDD, Touchpad, Keyboard Membrane, Keyboard BLK, DB board

5. Dis-fasten CPU, GPU, Fan screw*9 and remove fan, thermal module

6. Pull out DC-in cable and speaker -L cable

7. Dis-fasten MB screw*1, speaker screw*4, DB board screw*2, and remove HDD, speaker L&R

8. Remove MB and DB board

9. Dis-fasten midle cap screw*2 and hinge screw*3

10. Disassemble Top assy and LCD assy

11. Dis assemble LCD bezel

12. Dis-fasten panel screw*4, hinge screw*6

13. Remove panel, hinge

14. Dis-fasten inner cap screw*4

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Remove battery

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

2. Disassemble Base case

3. Dis-fasten CPU, GPU, Fan screw*9 and remove fan, thermal module

4. Dis-fasten middle cap screw*2 and hinge screw*3,

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

5. Dis-assemble LCD ASSY

6. Total part disassembly

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

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