HP pavilion x360 Montageanleitung
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Pavilion x360 Converitble PC 15
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
PCB
1
Batteries
All types including standard alkaline and lithium
coin or button style batteries Battery pack
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries N/A
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps LED
1
Cathode Ray Tubes (CRT)
N/A
0
Capacitors / condensers (Containing PCB/PCT)
N/A
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
N/A
0
External electrical cables and cords
N/A
0
Gas Discharge Lamps
N/A
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
N/A
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. N/A
0
Components and waste containing asbestos
N/A
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
N/A
0
Components, parts and materials containing
radioactive substances
N/A
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1Phillips screwdriver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disassemble U-Case
2. Disassemble Battery and HDD
3. Disassemble MB and Speaker
4. Disassemble LCD Module
5.
6.
7.
8.
9.
10.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Step 1.
a. Loosen 12x screws from the bottom of system
b. Take U-Case Out
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Step 2
a. Loosen 3x screws from Battery
b.Disconnect FFC Cable
c. Take battery out of L-Case
d. Take HDD out of L-Case
Step 3
a. Unplug Dc in Cable
b. Loosen 11x screws for MB and speaker
c. Disconnect FFC Cables
d. Take MB and speaker out of L-Case.
Step 4.
a. Take LCD Module out of Hinge Up
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