HP ProBook 6545b - Notebook PC Montageanleitung

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Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

6545b/Tag 15.6''

Name / Model #2

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Mother board

Batteries

All types including standard alkaline and lithium coin

or button style batteries battery and RTC battery

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps LCD

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 screw driver

philip #1 /

TORX T8

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove Battery module

2. Remove Mini card door

3. Remove Ram door.

4. Remove Blue tooth door.

5. Remove HDD door.

6. Remove HDD module

7. Remove ODD assembly

8. Remove Keyboard

9. Remove strip cover (with power button PCB & caps lock PCB)

10. Remove LCD cable and antenna connector

11. Divide LCD assembly from base assembly

12. Remove palm rest sub-assembly

13. Remove TP module & RTC battery

14. Divide logic-up assembly(w/buttons) from base assembly

15. Divide small PCB from base assembly

16. Remove speaker

17. Remove fan module

18. Divide MB from base assembly

19. Divide RS232 PCB & RJ11 from lower sub-assy

20. Divide thermal module & ODD trans PCB

21. Divide LCD cover & LCD bezel.

22. Divide LCD panel and Hinge Bracket.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Step1.Remove Battery module Step2.Remove Mini card door.

Step3. Remove Ram door. Step4.Remove Blue tooth door.

Step5.Remove HDD door. Step6.Remove HDD module

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Step7.Remove ODD assembly Step8.Remove Keyboard

Step9.Remove strip cover Step10-11. Remove LCD cable and antenna

connector .Divide LCD

assembly from base assembly

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Step12. Remove palm rest sub-assembly Step13. Remove TP module & RTC battery

Step14.Divide logic-up assembly(w/buttons) Step15. Divide small PCB from base assembly

from base assembly

Step16.Remove speaker.Step17. Remove fan module

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Step18.Divide MB (w/thermal module) from base assembly Step19. Divide RS232 PCB & RJ11 from lower sub-assy

Step20.Divide thermal module & ODD trans PCB Step21-22.Divide LCD cover & LCD bezel.Divide LCD

panel and Hinge Bracket.

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