HP x360 310 G1 PC Montageanleitung
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP x360 310 G1
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Mother board
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries battery and RTC battery
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps LCD
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Power cords,Adapter
2
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw Driver
No.0
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. remove Rubber Foot
2. remove low door
3. remove Battery module
4. remove HDD module
5. remove LCD module
6. remove MB
7. remove speaker module
8. remove K/B module
9. remove T/P module
10. remove I/O board
11. divide Display assy (remove hinge cap TOP)
12. divide Display assy ( remove hinge cap BTN )
13. divide Display assy ( remove LCD cover )
14. divide Display assy (remove Hinge)
15. divide Display assy (remove LVDS Cable)
16. divide Display assy (Antenna cble )
17. divide Display assy ( sensor board )
18. divide Display assy (remove Camera)
19. divide Display assy (remove Panel)
20. divide Display assy ( remove LCD brkt )
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 3
Template Revision A
Step 1 Remove rubber foot Step 2 Remove log low
Step 5 Remove LCD module Step 6 Remove M/B
Step 3 Remove Battery module Step 4 Remove Hdd module
EL-MF877-00 Page 4
Template Revision A
Step 7 Remove speaker module. Step 8 Remove K/B
Step 9 Remove T/P module Step 10 Remove I/O board
Step 11 Remove Hinge cap top Step12 Remove Hinge cap BTN
EL-MF877-00 Page 5
Template Revision A
Step 13 Remove LCD Cover Step14 Remove Hinge
Step 15 Remove LVDS & sensor cable Step16 Remove Antenna cable
Step 17 Remove sensor board Step 18 Remove camera module
EL-MF877-00 Page 6
Template Revision A
Step 19 Remove Panel Step 20 Remove LCD Brkt
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