HP 25f Montageanleitung
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP 25f 25-in Display
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
3
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 SCREW DRIVER(Plum flower head)
Description #2 Screwdriver
PH2
Description #3 Hex nut screwdriver
M5
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Release base stand by pushing a white button then strip screw to separate base and hinge
2. Strip the screws from rear cover so that the rear cover can be removed , then remove deco
3. Remove all material under rear cover contain rear cover supporter
4. Separate main board and shielding
5. Release all materials and put some by ESD
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
24-07-201
HP Restricted
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model
Description
HP 25f Display
HP 25f 25-inch Display
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description
Notes
Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
With a surface greater than 10
square cm
2
Batteries
All types including standard
alkaline and lithium coin or button
style batteries
0
Mercury containing components
For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
0
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Includes background illuminated
displays with gas discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing
PCB / PCT)
0
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords
3
Gas Discharge Lamps
0
Plastics containing Brominated Flame
Retardants
0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos
0
Components, parts and materials
containing refractory ceramic fibers
0
Components, parts and materials
0
24-07-201
HP Restricted
Page 2
containing radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if applicable)
Screwdriver
PH2
Hex nut screwdriver
M5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1
release base stand by pushing a white button then strip screw to separate base and hinge
2
Strip the screws from rear cover so that the rear cover can be removed , then
remove deco
3
Remove all material under rear cover contain rear cover supporter ;
4
Separate main board and shielding
5
Release all materials and put some by ESD;
3.2OPTIONAL: Depending upon the complexity of the disassembly process, a graphic depicting
the locations of items contained within the product which require selective treatment (with
descriptions and arrows identifying locations) can be inserted below:
24-07-201
HP Restricted
Page 3
Step 1 Quick release Base stand
(1).Pull out base and stand
a. Press white button with one hand
b. Pull out stand & base with another hand
(2).Disassy base and stand
Press the white button
Twist out the screw
24-07-201
HP Restricted
Page 4
Step 2: Strip the screws from rear cover, then move rear cover follow the below way ,at last
remove deco
Remove the screws with
Screwdriver
Dismantle the rear cover first
from the two marked position
Remove the 8pin FFC from main
board then remove rear cover
24-07-201
HP Restricted
Page 5
Step 3: To remove the shielding(contain the other material );
(3.1) Dismantle the rear cover supporter
(3.2) Pull out the LVDS/ LED FFCs to separate the base assembly from the unit;
(3.3) Remove the four screws to separate shielding from CB
24-07-201
HP Restricted
Page 6
Step 4: Strip the screws *8pcs
24-07-201
HP Restricted
Page 7
Step 5: Release all materials and put some by ESD;
Can follow the picture as bellow;
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