HP Compaq W2052a Montageanleitung
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
Compaq W2052a 20-inch LED Backlit LCD Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity of items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with
gas discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
1
External electrical cables and cords
W2052a/W2072a:3
LV2011/LV2011q:2
Gas Discharge Lamps
0
Plastics containing Brominated Flame
Retardants weighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
toner
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
200mm
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
200mm
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the screws of stand，get down the stand
2. Dismantle the cover of monitor
3. Dismantle the button，pull out the pin of KEPC board ,get down the KEPC board
4. Dismantle mainframe
5. Dismantle BEZEL
6. Dismantle the screws of PANEL
7. Pull out the PIN of lamp
8. Pull out the PIN of LVDS cable，separate the mainframe and PANEL
9. Dismantle the power board screws
10. Dismantle the VGA screws
11. First: Tear off the adhesive tape;
12. Second: Pull out the connector PIN which connect PWPC and main board;
13. Third: Take off both boards
14. Pull out the pin of KEPC cable
15.
16.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Pls. refer the attached:
1
HP-W2072a/W2052a/LV2011/LV2011q
DisassemblyProcess
From:Clean.Zhang
Date:Sep.-26-11
1.RemoveCableFrom DisplayHead. 2.Dissecting to Complete.
ExternalElectricCables Dissecting Process
PowerCable
D-SUB&DVICable
3
41
2
RemoveStand Base FromDisplay
1.Take Screw(*5)from RearCover. 2. Demount Stand & RemoveStand Base FormDisplay.
5
RemoveRear Cover From DisplayHead
1.Both Hands UpwardlyPull Up.
3. Towardthe arrowhead, take the Rear
Coverfrom the Front Cover. 4. RemoveRearCover.
3
1
2
2.TurnoverDisplayHead.
RemoveKEPCboard FromFrontCover
1.Take the KEPCassemblyfrom theFront
Cover. 2.RemoveConnectoroff from KEPCboard
and disassemble KEPCassembly.
RemoveMainframe&Panel
1. RemoveConnectoroff from Power
board& Panel. 2.RemovetheConductive Tapefrom
theMainframe.
3.RemoveMainframe&Panel. 4.Removetheconnecting wire&Remove
InsulatorSheetoff frompanel.
RemoveFrontCover &Panel
1.TurnoverPanel, and removethe Front
Coveroff from Panel. 2. Dissecting to complete.
1.Take Screw(*4or2)from Mainframe. 2. Take Screw(*6)from PowerBd&MainBd .
Take ScrewoffFrom MainframeAssembly
Dieses Handbuch passt für folgende Modelle
5
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