HP EliteDisplay E243 Montageanleitung

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Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

HP EliteDisplay E243 23.8-inch Monitor

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

I/F Board*1, Control Board*1, Power Board*1, USB

Board*1

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps Panel*1

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Power board(C605)

External electrical cables and cords

DP cable*1, VGA cable*1, USB cable*1, Power

cord*1

All are inside monitor carton box

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

EL-MF877-00 Page 2

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Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

Hexagon Screw Driver

Flathead screwdriver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Separate base and column by hand, then use tool to separate monitor head and stand.

2. Use tool to separate screw from rear cover, then separate rear cover from monitor head by hand.

3. Tear the tape from lamp wire and LVDS FFC, then disassemble the lamp wire, LVDS FFC and ctrl-BD FFC from

connector, disassemble the chassis from panel.

4. Disassemble the ctrl-BD from panel and ctrl-BD, then disassemble ctrl-BD from bezel and separate panel and bezel by

hand.

5. Separate safety Mylar from chassis, then use tool to release screws on PCBs, tear gaskets from chassis, and separate

all connector on PCBs.

6. Use tool to separate wall mount plate from rear cover, and separate HP LOGO, button and lens form bezel.

7. Use tool to disassemble column rear cover from column, then release the screws to separate hinge from column, and

release screws to separate hinge top bracket from hinge.

8. Tear the rubber foot from base, then use tool to release screws from base plate, and use tool to separate base plate

and base cover.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Step 1: Push release button to separate head and stand.

Step 2 : Use tool to release screws and disassemble the rear cover by hand..

Step 3 : disassemble cable connector ,LED cable, ctrl FFC and LVDS

EL-MF877-00 Page 4

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Step 4 : Use tool to release screws on PCBs. Then tear down the gaskets on main chassis and separate all connector on PCBs

Step 5: Use tool to release screws on CTRL BD and take Ctrl BD off from assy-BZL.

EL-MF877-00 Page 5

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EL-MF877-00 Page 6

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Step6: Use tool to release screws and separate base

Step7: Use tool to release screws and separate base cover.

EL-MF877-00 Page 7

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Step8: Use tool to release screws and separate VESA from stand

Step 9：Disassemble the front cover by hand

EL-MF877-00 Page 8

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Step10 : Disassemble the back cover by hand

Step11: Use tool to release screws and separate hinge module.

EL-MF877-00 Page 9

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Step12: Use tool to release screws and separate hinge shield

Step13: Use tool to release screws and separate constant force springs from hinge shield.

EL-MF877-00 Page 10

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Step14:Use tool to release screws and separate the site of constant force springs.

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