HP L717g Montageanleitung

HP-00007-01, Appendix 3 13-Oct-2004

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Appendix 3 Product End-of-Life Disassembly instructions

Product Identification:

Marketing Name / Model Description

HP L717g Flat Panel Monitor

HP L919g Flat Panel Monitor

LCD Flat Panel Monitor

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the

basic instructions for the disassembly of HP products to remove components and materials requiring

selective treatment.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in

the right column, as applicable.

Item Description Notes Quantity of

items included

in product.

Printed Circuit Boards (PCB) or Printed

Circuit Assemblies (PCA) With a surface greater than 10

square cm 2

Batteries All types including standard

alkaline and lithium coin or button

style batteries

Mercury containing components For example, mercury in lamps,

display backlights, scanner lamps,

switches, batteries

Liquid Crystal Displays (LCD) with a

surface greater than 100 square cm Includes background illuminated

displays with gas discharge lamps 1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing

PCB / PCT) 0

Electrolytic Capacitors / Condensers

measuring greater than 2.5 cm in

diameter or height

External electrical cables and cords 3

Gas Discharge Lamps 0

Plastics containing Brominated Flame

Retardants Declaration limited to case

plastics only. 0

Components and parts containing toner

and ink, including liquids, semi-liquids

(gel/paste) and toner

Include the cartridges, print

heads, tubes, vent chambers, and

service stations.

Components and waste containing

asbestos 0

HP-00007-01, Appendix 3 13-Oct-2004

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Components, parts and materials

containing refractory ceramic fibers 0

Components, parts and materials

containing radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a

point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Screw driver #2

Hexagonal inserted handle box wrench

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials

requiring selective treatment:

1 Disassembly Hinge Cover.

2 Remove the screws.

3 1. Pull the front cover upward.

2. Then, let the all latches are separated.

3. Put the front face down.

4 Disassemble back cover.

5 Remove the 6 screws from each up of metal frame.

6 Pell off Al-tape from panel.

7 Remove Al-tape from control pcb fix.

8 Remove the 4 screws from each side of metal frame.

9 Remove mercury bulbs for selective treatment.

3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic

depicting the locations of items contained within the product which require selective

treatment (with descriptions and arrows identifying locations) can be inserted below

HP-00007-01, Appendix 3 13-Oct-2004

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HP-00007-01, Appendix 3 13-Oct-2004

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HP-00007-01, Appendix 3 13-Oct-2004

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HP-00007-01, Appendix 3 13-Oct-2004

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HP-00007-01, Appendix 3 13-Oct-2004

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C202

C206

C207

C203

C812 C205

C204

C803

C814

C105

C107

Designation Main BD Power BD

Capacitors C803,C812,C814 C105 , C107

C202 , C206

C207 , C203

C205 , C204

Electrolytic

Capacitors

(larger than 2.5cm)

C101

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