HP Omen X Montageanleitung

Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

OMEN X by HP 35-inch Curved Display

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Screw driver of "+" type

Description #2 Hexagonal nut screw driver for DVI and D-SUB connector

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Lay the monitor on a curve foam, soft and clean surface.

2. Remove the Stand and Base ASSY.

3. Remove Rear Cover

4. Remove Connectors on main board

5. Remove the hinge

6. Remove tape around main frame

7. Remove the Ambient light board

8. Remove the the screws and the Light bar connector

9. Remove screws and deco..

10. remove screws around middle bezel and middle bezle

11. Remove the mainboard connect pin to panel

12. Remove screws and get out main board from main frame

13. Take off pins and shielding case

14. remove those PCBA on rear cover

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

11. Mechanical Instructions

Step Figure Description

Remove

the Stand

-Base

ASSY.

The model using the

curved surface

screen; There must

be put soft mat

above of the work

station and don't

push hard on the

machine to avoid

cause screen to

crack. Loose the

screws to remove the

stand-base assy.

Remove

the Rear

Cover

Use disassembly tool

to open all the

latches along the

edge of the Rear

Cover

Remove

the pins

Remove the pins

Remove

the screws

to remove

the hinge

Remove the screws

to remove the hinge

Remove

the Pin and

tapes

Remove the pin and

tapes.

Remove

the

Ambient

Light board

and the

tapes

Remove the screws

to remove the

Ambient Light board

and remove the

tapes

Remove

the pins

and the

screw

Remove the pins and

the screw

Remove

the screws

to remove

the DECO

& Middle

frame

Remove the screws

to remove the DECO

& Middle frame

Remove

the pin

Remove the pin

The panel

Remove

the board

Take off the mylar

and remove the

screws.

The pins

Take off the pins

Remove

the shield

Remove the shield

The Rear

cover

Remove the key

board and the

headphone jack

board

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