HP J9405B Montageanleitung

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Product End-of-Life Disassembly Instructions

Product Category:

POWER

SUPPLY

Marketing Name / Model

[List multiple models if applicable.]

MODEL:

J9405B (

HP ProCurve MSM31x and MSM32x PS

)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0

Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

晶體 Epoxy+Alloy+Solder non-recyclable

EMI shield Aluminum

Capacitors Non-recyclable 14

Resistor

Socket

Wire

Case

Heat sink

Tape

Tube

Screw

Label

Paste on case

Inductor

Transformer

PCB Non recyclable

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Template Revision A

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

pliers.

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Take out plastic mat and screw.

2. Take out plastic case.

3. Take out EMI Shielding case.

4. Take out mylar film.

6. Take out mix wire.

7. Take out heatsink.

8. Take out copper.

9. Take out socket.

10. Take out solder.

11. Take out inductors.

12. Take out transformer.

13. Take out big capacitor.

14. Left PCBA.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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