HP Elite t655 Montageanleitung
EL-MF877-00 Page 1
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Elite t655 Thin Client
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HP Inc. products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking or identification of location of parts or components requiring selective
treatment, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment. An “X” in the list of components and parts indicates the
product contains the component or part requiring selective treatment
Item Description
Components and parts requiring selective
treatments
Quantity of
items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) with a surface greater than 10 sq
cm
☒Main board (MB) PCB
☒Solid state drive (SSD) PCB
☐Wireless WAN module (WWAN) PCB
☐Touch module PCB
☒Power supply PCB
☒External Keyboard (KB)
☒External Mouse
☐Others: _____________
5
Batteries, excluding Li-Ion batteries. This includes
standard alkaline, coin or button style batteries
☒RTC/CMOS battery
☐Others: _____________
1
Li-Ion batteries. Includes all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, etc.)
Li-ion battery(ies) are attached to the product by:
☐screws
☐snaps
☐adhesive
☐other. Explain
0
Mercury-containing components. For example,
mercury in lamps, display backlights, scanner lamps,
switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm. Includes background illuminated
displays with gas discharge lamps
☐Panel LCD
0
EL-MF877-00 Page 2
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Item Description
Components and parts requiring selective
treatments
Quantity of
items
included
in product
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
☐Power Supply capacitor(s) or condenser(s)
0
External electrical cables and cords
☒AC power cord
☐Audio, video or data cables
☐Other: _________
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
(not including external electrical cables and cords,
PCBs or PCAs already listed as a separate item
above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner.
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
Components containing chlorofluorocarbons (CFC),
hydrochlorofluorocarbons (HCFC) or
hydrofluorocarbons (HFC), hydrocarbons (HC)
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
PH0X50 screw
driver
Screwdriver
T15 screw
driver
Heatgun
N/A
Suction cup
N/A
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure.
EL-MF877-00 Page 3
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
1. Remove Rear Cover
2. Remove access panel
3. Remove “+”M2 screws of option kit and option board
4. Remove “+”M2 screws of Rear-brkt
5. Remove T8-SSD screw and module
6. Remove shielding can
7. Remove DIMM
8. Remove speaker conn
9. Unfasten T15-M3 screws and disassembly MB
10. Remove speaker
11. Unfasten “+” M2 screws and internal antenna
12. Unfasten “+” M3 screws and internal antenna
13. Unfasten “+” M2 screws
14. Remove VESA cover by hand
15. Remove Bend cover by hand
NOTE - For disassembly instructions of the external power supply (EPS), external keyboard (KB) external mouse and external
cables and cords, refer to the links below:
•Generic External Power Supply (EPS)
•Generic Keyboard
•Generic Mouse
•Generic cables and cords
3.2 Location of components requiring selective treatment. The photos and/or graphics below identify the location of the parts
or components requiring selective treatment within the main unit. For End-of-Life product disassembly instructions of external
accessories including external power supply (EPS), external keyboard (KB) external mouse and external cables and cords, refer
to the following URL: End-of-Life Product Disassembly Instructions (hp.com)
STEP 1. Remove Rear Cover
STEP 2. Remove access panel
STEP 3. Remove “+”M2 screws of option kit and option
board
STEP 4. Remove “+”M2 screws of Rear-brkt
Releasing latch
1
Pusing latch
2
Disassembly Access Panel
Overall
EL-MF877-00 Page 4
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
STEP 5. Remove T8-SSD screw and module
STEP 6. Remove shielding can
STEP 7. Remove DIMM
STEP 8. Remove speaker conn
STEP 9. Unfasten T15-M3 screws and disassembly MB
STEP 10. Remove speaker
STEP 11. Unfasten “+” M2 screws and internal antenna
STEP 12. Unfasten “+” M3 screws and internal antenna
Overall
Unfasten screw x4
1
Unfasten screw x5
2
Disassembly Rear-brkt
Overall
Overall
1
Unfasten screw
2
Disassembly module
Disassembly Shielding can
Unplug SPK cconn
1
Unfasten screw x4
2
Disassembly MB
1
Unfasten screw x2
2
Disassembly SPK
EL-MF877-00 Page 5
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
STEP 13. Unfasten “+” M2 screws
STEP 14. Remove VESA cover by hand
STEP 15. Remove Bend cover by hand
Overall
Detail
Detail
Overall Detail
Overall
Detail
Detail
Unfasten screw x2
Disassembly VESA-CVR
Disassembly Bend-CVR
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