HP ProLiant DL580 G7 Montageanleitung

Andere Handbücher für ProLiant DL580 G7

1

Inhaltsverzeichnis

Andere HP Server Handbücher

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Product End-of-Life Disassembly Instructions

Marketing Name /

Model

[List multiple models if

applicable.]

Product Category

HP ProLiant DL580 G7 Server

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It

provides the basic instructions for the disassembly of HP products to remove components and

materials requiring selective treatment.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in

the right column, as applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed

Circuit Assemblies (PCA)

With a surface greater than 10 sq cm

6

Batteries

All types including standard alkaline

and lithium coin or button style

batteries

2

Mercury-containing components

For example, mercury in lamps,

display backlights, scanner lamps,

switches, batteries

0

Liquid Crystal Displays (LCD) with a

surface greater than 100 sq cm

Includes background illuminated

displays with gas discharge lamps

0

Cathode Ray Tubes (CRT)

0

Capacitors / condensers (Containing

PCB / PCT)

0

Electrolytic Capacitors / Condensers

measuring greater than 2.5 cm in

diameter or height

Depending on Power Supply model

number

2

External electrical cables and cords

0

Gas Discharge Lamps

0

Plastics containing Brominated Flame

Retardants

0

Components and parts containing

toner and ink, including liquids, semi-

liquids (gel/paste) and toner

Include the cartridges, print heads,

tubes, vent chambers, and service

stations.

0

Components and waste containing

asbestos

0

Components, parts and materials

containing refractory ceramic fibers

0

Components, parts and materials

containing radioactive substances

0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a

point where components and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if applicable)

Torx screw driver

T15

Flat head screw driver Medium

Philips Driver # 2

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials

requiring selective treatment:

1. System Board Battery - Remove the top cover and locate the battery on the system

board. Use a medium flat head screwdriver or fingers to remove the battery and

dispose of properly

2. BBWC Battery – With a medium flat head screw driver remove the BBWC battery and

dispose of properly.

3. Capacitors=>2.5CM - Remove the power supply from the system using a T-15 driver. With

#2 Philips screw driver, remove the screws securing the top cover, then locate the capacitors

and pry from the PCB with a medium flat head screw driver and dipose of properly.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below

to identify the items contained in the product that require selective treatment (with descriptions

and arrows identifying locations).

Attachment 1 – System Battery Location

Attachment 2- Location of BBWC Battery

Attachment 3,4,5- Capacitor location by model number of supply

Attachment 1

Attachment 2

Attachment 3

Attachment 4

Attachment 5