HP ProLiant DL585 G7 Montageanleitung

Product End-of-Life Disassembly Instructions

Marketing Name /

Model

[List multiple models if

applicable.]

Product Category

HP ProLiant DL585 G7 Server

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities.

It provides the basic instructions for the

disassembly of HP products to remove components

and materials requiring selective treatment.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective

treatment in the right column, as applicable.

Item Description Notes

Quantity

of items

included

product

Printed Circuit Boards (PCB) or

Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq

Batteries

All types including standard

alkaline and lithium coin or button

style batteries

Mercury-containing components

For example, mercury in lamps,

display backlights, scanner lamps,

switches, batteries

Liquid Crystal Displays (LCD) with a

surface greater than 100 sq cm

Includes background illuminated

displays with gas discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers

(Containing PCB / PCT)

Electrolytic Capacitors /

Condensers measuring greater than

2.5 cm in diameter or height

Depending on Power Supply model

number

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated

Flame Retardants

Components and parts containing

toner and ink, including liquids,

semi-liquids (gel/paste) and toner

Include the cartridges, print heads,

tubes, vent chambers, and service

stations.

Components and waste containing

asbestos

Components, parts and materials

containing refractory ceramic fibers

Components, parts and materials

containing radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product

to a point where components and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if applicable)

Torx screw driver

T15

Flat head screw driver Medium

Philips Driver # 2

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and

materials requiring selective treatment:

1. System Board Battery - Remove the top cover and locate the battery on the

system board. Use a medium flat head screwdriver or fingers to remove the

battery and dispose of properly

2. BBWC Battery –

With a medium flat head screw driver remove the BBWC battery and

dispose of properly.

3. Capacitors=>2.5CM - Remove the power supply from the system using a T-15 driver.

With #2 Philips screw driver, remove the screws securing the top cover, then locate

the capacitors and pry from the PCB with a medium flat head screw driver and di

pose

of properly.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration

below to identify the items contained in the product that require selective treatment (with

descriptions and arrows identifying locations).

Attachment 1 – System Battery Location

Attachment 2- Location of BBWC Battery

Attachment 3,4,5- Capacitor location by model number of supply

Attachment 1

Attachment 2

Attachment 3

Attachment 4

Attachment 5

Andere Handbücher für ProLiant DL585 G7

Inhaltsverzeichnis

Andere HP Server Handbücher

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HP Integrity BL860c Bedienungsanleitung

HP T5720 - Compaq Thin Client Kurzanleitung

HP ProLiant ML310 G3 1TB Bedienungsanleitung

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