HP ProLiant ML110 G7 Montageanleitung
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HP ProLiant ML110 G7
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm
4
Batteries All types including standard alkaline and lithium coin
or button style batteries 2
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas
discharge lamps 0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 1
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent
chambers, and service stations. 0
Components and waste containing asbestos 0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Trox Driver T10/T15
Philips Screw Driver #2
Flat Head Screw Driver Medium
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery - Locate the battery on the system board. Use a medium flat head screwdriver or fingers to
remove the battery and dispose of properly
2. Capacitors=>2.5CM - Remove the power supply from the system using a T-15 driver. With #2 Philips screw driver,
remove the screws securing the top cover, then locate the capacitors and pry from the PCB with a medium flat head
screw driver and dipose of properly
3. BBWC Battery – With a medium flat head screw driver remove the BBWC battery and dispose of properly
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1- Expanded view
Attachment 2 – System Battery Location
Attachment 3- Location of BBWC Battery
Attachment 4,5,6,7- Capacitor location by model number of supply
EL-MF877-00 Page 3
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PSG instructions for this template are available at EL-MF877-01
Attachment 1
Attachment 2
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Attachment 3
350W ATX Power supply
EL-MF877-00 Page 5
Template Revision B
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Attachment 4
Attachment 5
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Attachment 6
Attachment 7
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2
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