HP ProLiant ML370G4 SAS Montageanleitung

HP-00007-01, Appendix 3 28-Feb-2004

Page 1

Appendix 3 Product End-of-Life Disassembly instructions

Product Identification:

Marketing Name / Model Description

HP ProLiant ML370G4_SAS 2-Way 2 Processor Server

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the

basic instructions for the disassembly of HP products to remove components and materials requiring

selective treatment.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in

the right column, as applicable.

Item Description Notes Quantity of

items included

in product.

Printed Circuit Boards (PCB) or Printed

Circuit Assemblies (PCA) With a surface greater than 10

square cm 11

Batteries All types including standard

alkaline and lithium coin or button

style batteries

Mercury containing components For example, mercury in lamps,

display backlights, scanner lamps,

switches, batteries

Liquid Crystal Displays (LCD) with a

surface greater than 100 square cm Includes background illuminated

displays with gas discharge lamps 0

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing

PCB / PCT) 0

Electrolytic Capacitors / Condensers

measuring greater than 2.5 cm in

diameter or height

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame

Retardants 0

Components and parts containing toner

and ink, including liquids, semi-liquids

(gel/paste) and toner

Include the cartridges, print

heads, tubes, vent chambers, and

service stations.

Components and waste containing

asbestos 0

Components, parts and materials 0

HP-00007-01, Appendix 3 28-Feb-2004

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containing refractory ceramic fibers

Components, parts and materials

containing radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a

point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Philips Screw Driver #2

Flat Head Screw Driver Small

Flat Head Screw Driver Large

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials

requiring selective treatment:

1 System Board Battery – Remove the top cover and locate the battery on the system

board. With a small flat head screw driver remove the battery and discard properly.

2 2.5CM Capacitors – Remove the power supply(s) from the system. With #2 Philips screw

driver remove the screws securing the top cover then locate the capacitors and pry from

the PCB with a large flat head screw driver and discard properly.

3 SAS Controller Battery – Unplug and remove the SAS controller from the system then with

a flat head screw driver remove the battery and discard properly.

3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic

depicting the locations of items contained within the product which require selective

treatment (with descriptions and arrows identifying locations) can be inserted below:

Attachment 1 – Disassembly Diagram

Attachment 2 – System Battery Location

Attachment 3 – Capacitor Locations

Attachment 4 – SAS Battery Location

HP-00007-01, Appendix 3 28-Feb-2004

Page 3

Battery located

on SAS controller

that is plugged

into the system

board Item #15

Battery located

on system

board

Item #15

2 Capacitors

located in P/S

Item #10

Attachment 1

Attachment 2

HP-00007-01, Appendix 3 28-Feb-2004

Page 4

Attachment 3

Attachment 4

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