HP 5830AF-96G Series Montageanleitung

Product End-of-Life Disassembly Instructions

Product Category: Calculators

Marketing Name / Model

[List multiple models if applicable.]

HP 5830AF-96G Series Switch Chassis

（

JG374A

）

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Tool Description

Tool Size (if

applicable)

Screw driver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws on Holder 1, and then remove Holder 1.

2. Unscrew all screws 2 and 5, and then remove panel 3 and the mounting angle 4.

3. Remove part 5 from the chassis.

4. Remove top cover 7, and then remove plastic panel 6 from the chassis.

5. Remove all of the inner cables.

6. Unscrew the screws on cover 9, and then remove cover 9 from the chassis.

7. Unscrew all screws of battery 10, and then remove battery 10 from the chassis.

8. Unscrew all s, and then remove panel 10 from base 8.

9. Unscrew all screws on fan 11, and then remove fan 11 from the chassis.

10. Unscrew all screws on part 12, and then remove part 12 from the chassis.

11. Unscrew all screws of PCB 13, and then remove PCB 13 from the chassis.

12. Unscrew all screws on fan rack 14, and then remove fan rack 14 from the chassis.

13. Unscrew all screws on support 15, and then remove support 15 from the chassis.

14. Unscrew all screws on PCB 16, and then remove PCB 16 from the chassis.

15. Remove all of the labels from the chassis.

16. Unscrew all screws 11-2, and then remove part 11-3 from part 11-1.

17. Unscrew all screws on cover 14-5, and then remove cover 14-5 from fan rack 14.

18. Unscrew the screw 14-2, and then remove fan 14-4 from fan rack 14-3.

19. Unscrew the screws on PCB 14-6, and then remove PCB 14-6 from fan rack 14.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Figure 1Remove holder 1 Figure 2 Treatments to the product(I)

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure 3Remove plastic panel 6 and top cover 7 Figure 4 Remove cover 9 and battery 10

Figure 5 Remove part 11 and part 12 Figure 6 Remove PCB 13 and fan 14

Figure 7TRemove Support 15 and PCB 16 Figure 8 Treatments to part 11

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure 9Treatments to fan rack 14

3.3 Material of the facility built

Facility

Components

Material

Weight(g)

Weight

percentage

Selective treatment for materials

and components

Details

7,8

10450

59.27%

Fe recycling

1160

6.58%

Complex PWB

1150

6.52%

The surface of PCB is greater than

10 square centimeters;

1567

8.89%

14-1

1410

8.00%

Fe recycling

14-4

PBT , Cu

110

0.62%

Containing brominated flame

retardants

Pla

recycling Cu

recycling

14-6

Complex PWB

0.23%

The surface of PCB is greater than

10 square centimeters;

Complex PWB

3310

18.74%

The surface of PCB is greater than

10 square centimeters;

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

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