HP Aruba 4100i Montageanleitung

MF877-00 Page 1

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking

Marketing Name / Model

[List multiple models if applicable.]

HPE Aruba 4100i 12G CL4/6 POE 2SFP+ DIN Sw (JL817A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by

Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment

(WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

1216

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

MF877-00 Page 2

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Item Description

Notes

Quantity

of items

included

in product

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Phillips screwdriver #2

Torx style screwdriver

T10

Flathead screwdriver

1.0

Hexagon screwdriver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove the Plastic Protectors cover, and terminal conn.

1. Using a Phillips screwdriver #2, remove the screws attaching the terminal.

2. Remove the top ground lug.

1. Using a Phillips screwdriver #2, remove the screws attaching the ground lug 2pcs

3. Remove the din kit

1. Using a Phillips screwdriver #2, remove the screws attaching the din kit 4pcs

4. Remove the back logo cover bottom

1. Using a torx style screwdriver T10, remove the screws attaching the logo cover bottom 6pcs

5. Remove the riser bracket

1. Using a Phillips screwdriver #2 remove the screws attaching the riser bracket

6. Remove the logo cover assembly

1. Using a flathead screwdriver r, remove the logo cover

7. 7. Remove the side logo cover bottom

1. Using a torx style screwdriver T10, remove the screws attaching the logo cover bottom 6pcs

MF877-00 Page 3

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

8. Remove the front bezal

1. Using a Phillips screwdriver #2, remove the screws attaching the logo cover bottom 8pcs

9. Remove the base

1. Using a Phillips screwdriver #2, remove the screws attaching the base 6pcs

10. Remove the PHY board

1. Using a Phillips screwdriver #2, remove the screws attaching the PHY board 4pcs

11. Remove the riser bracket

1. Using a Hexagon screwdriver and Phillips screwdriver #2 remove the screws attaching the riser bracket

12. Remove the Asic board

1. Using a Phillips screwdriver #2, remove the screws attaching the Asic board 4pcs

13. 12-Finish

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 4

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 5

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 6

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 7

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 8

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

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