HPE ProLiant DL20 Gen9 Montageanleitung

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model

[List multiple models if applicable.]

HPE ProLiant DL20 Gen9

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

In power supply (290W or 900W) depening on

Wattage

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

T-10/T-15 Torx screwdriver (included with the server)

Philps screwdriver

Flat Head Screw Driver

Medium

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. System Board Battery -- Remove the top cover and locate the battery on the system board. With a medium flat head

screw driver remove the battery and dispose of properly.

2. System Megacell -- Remove the top cover and locate the megacell on the system board. Remove the megacell and

dispose of properly.

3. Capacitors > 2.5CM -- Remove the power supply(s) from the system. With #2 Philips screw driver remove the screws

securing the top cover and the heatsinks in the P/S then locate the capacitors and pry from the PCB with a medium flat

head screw driver and dispose of properly

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Attachment 1-- System battery location

Attachment 2 -- Location of megacell

Attachment 3-- Capacitor location of power supply

Attachment 1

RTC BATTERY

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Attachment 2

Megacell Holder

Attachement 3

POWER CAPACITOR –290W

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

900W PSU module capacitor location

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