Huawei FusionServer Pro XH628 V5 Server Node Kurzanleitung

Huawei FusionServer Pro XH628 V5 Server Node

V100R005

Technical White Paper

Issue 05

Date 2020-09-03

HUAWEI TECHNOLOGIES CO., LTD.

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within the purchase scope or the usage scope. Unless otherwise specied in the contract, all statements,

information, and recommendations in this document are provided "AS IS" without warranties, guarantees

or representations of any kind, either express or implied.

The information in this document is subject to change without notice. Every eort has been made in the

preparation of this document to ensure accuracy of the contents, but all statements, information, and

recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.

Address: Huawei Industrial Base

Bantian, Longgang

Shenzhen 518129

People's Republic of China

Website: https://e.huawei.com

About This Document

Overview

This document describes the XH628 V5 server node in terms of features, structure,

specications, and component compatibility.

Intended Audience

This document is intended for:

● Huawei presales engineers

● Channel partner presales engineers

● Enterprise presales engineers

Symbol Conventions

The symbols that may be found in this document are dened as follows.

Symbol Description

Indicates a hazard with a high level of risk which, if not

avoided, will result in death or serious injury.

Indicates a hazard with a medium level of risk which, if

not avoided, could result in death or serious injury.

Indicates a hazard with a low level of risk which, if not

avoided, could result in minor or moderate injury.

Indicates a potentially hazardous situation which, if not

avoided, could result in equipment damage, data loss,

performance deterioration, or unanticipated results.

NOTICE is used to address practices not related to

personal injury.

Huawei FusionServer Pro XH628 V5 Server Node

Technical White Paper About This Document

Symbol Description

Supplements the important information in the main

text.

NOTE is used to address information not related to

personal injury, equipment damage, and environment

deterioration.

Change History

Issue Date Description

05 2020-09-03 ● This issue is the fth ocial release.

04 2020-07-31 ● This issue is the fourth ocial release.

03 2020-06-05 ● This issue is the third ocial release.

02 2020-04-20 ● This issue is the second ocial release.

01 2018-08-10 ● This issue is the rst ocial release.

Huawei FusionServer Pro XH628 V5 Server Node

Technical White Paper About This Document

Contents

About This Document................................................................................................................ ii

1 Overview....................................................................................................................................1

2 Features..................................................................................................................................... 2

3 Physical Structure....................................................................................................................5

4 Logical Structure .................................................................................................................... 8

5 Hardware Description.......................................................................................................... 10

5.1 Front Panel.............................................................................................................................................................................. 10

5.1.1 Appearance.......................................................................................................................................................................... 10

5.1.2 Indicators and Buttons.....................................................................................................................................................12

5.1.3 Ports....................................................................................................................................................................................... 17

5.1.4 Installation Positions........................................................................................................................................................ 21

5.2 Processor.................................................................................................................................................................................. 22

5.3 Memory.................................................................................................................................................................................... 22

5.3.1 Memory Identier............................................................................................................................................................. 22

5.3.2 Memory Subsystem Architecture................................................................................................................................. 23

5.3.3 Memory Compatibility..................................................................................................................................................... 24

5.3.4 Memory Installation Guidelines................................................................................................................................... 26

5.3.5 Memory Installation Positions...................................................................................................................................... 26

5.3.6 Memory Protection Technologies................................................................................................................................ 27

5.4 Storage..................................................................................................................................................................................... 28

5.4.1 Drive Congurations.........................................................................................................................................................28

5.4.2 Drive Numbering............................................................................................................................................................... 28

5.4.3 Drive Indicators.................................................................................................................................................................. 31

5.4.4 RAID Controller Card........................................................................................................................................................33

5.5 I/O Expansion......................................................................................................................................................................... 33

5.5.1 PCIe Cards............................................................................................................................................................................ 33

5.5.2 PCIe Slots..............................................................................................................................................................................33

5.5.3 PCIe Slot Description........................................................................................................................................................ 35

5.6 Boards....................................................................................................................................................................................... 35

5.6.1 Mainboard............................................................................................................................................................................35

6 Product Specications.......................................................................................................... 37

Huawei FusionServer Pro XH628 V5 Server Node

Technical White Paper Contents

6.1 Technical Specications...................................................................................................................................................... 37

6.2 Environmental Specications............................................................................................................................................41

6.3 Physical Specications.........................................................................................................................................................42

7 Software and Hardware Compatibility............................................................................ 44

8 Safety Instructions................................................................................................................ 45

8.1 Safety Instructions................................................................................................................................................................ 45

8.2 Maintenance and Warranty.............................................................................................................................................. 48

9 System Management............................................................................................................49

10 Certications........................................................................................................................ 51

A Appendix................................................................................................................................. 53

A.1 Product SN.............................................................................................................................................................................. 53

A.2 RAS Features.......................................................................................................................................................................... 54

B Glossary................................................................................................................................... 57

B.1 A-E............................................................................................................................................................................................. 57

B.2 F-J............................................................................................................................................................................................... 58

B.3 K-O.............................................................................................................................................................................................58

B.4 P-T.............................................................................................................................................................................................. 58

B.5 U-Z............................................................................................................................................................................................. 59

C Acronyms and Abbreviations..............................................................................................60

C.1 A-E............................................................................................................................................................................................. 60

C.2 F-J............................................................................................................................................................................................... 61

C.3 K-O.............................................................................................................................................................................................62

C.4 P-T.............................................................................................................................................................................................. 63

C.5 U-Z............................................................................................................................................................................................. 65

Huawei FusionServer Pro XH628 V5 Server Node

Technical White Paper Contents

1 Overview

The XH628 V5 is a server node designed for Huawei X6800 servers. An X6800 can

house up to four XH628 V5 server nodes in a 4U chassis.

The XH628 V5 delivers supreme performance and high storage density in limited

space through innovative design. It is easy to manage and maintain.

The XH628 V5 supports twelve 3.5- or 2.5-inch drives in a drive drawer, up to 16

DDR4 memory modules, and four PCIe cards.

The XH628 V5 is ideal for data center, cloud computing, Big Data, and Internet

applications.

Figure 1-1 XH628 V5

Huawei FusionServer Pro XH628 V5 Server Node

Technical White Paper 1 Overview

2 Features

Performance and Scalability

● Powered by two Intel® Xeon® Scalable Skylake or Cascade Lake processors, the

server provides up to 28 cores, 3.8 GHz frequency, a 38.5 MB L3 cache, and

two 10.4 GT/s UPI links between the processors, which deliver supreme

processing performance.

– It supports two processors with 56 cores and 88 threads to maximize the

concurrent execution of multithreaded applications.

– An L2 cache is added. Each core can exclusively use 1 MB of L2 cache and

at least 1.375 MB of L3 cache.

– Intel Turbo Boost Technology 2.0 allows processor cores to run faster

than the frequency specied in the Thermal Design Power (TDP)

conguration if they are operating below power, current, and

temperature specication limits.

– Intel Hyper-Threading Technology enables each processor core to run up

to two threads, improving parallel computation capability.

– The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows

operating system (OS) vendors to better use hardware to address

virtualization workloads.

– Intel® Advanced Vector Extensions (Intel AVX 2.0 and Intel AVX-512)

signicantly accelerate oating-point performance for computing-

intensive applications.

– The Cascade Lake processors support Intel® Deep Learning Boost vector

neural network instructions (VNNI) to improve the performance of deep

learning applications.

● The 1.2 V DDR4 memory modules consume 20% less power than 1.35 V

DDR3L memory modules used by the previous-generation platform.

● The server node supports double data rate 4 (DDR4) registered dual in-line

memory modules (RDIMMs) and load-reduced DIMMs (LRDIMMs) with error

checking and correcting (ECC). A server node fully congured with sixteen

2933 MT/s memory modules (only available with Cascade Lake processors)

provides 2 TB memory space and the maximum theoretical memory

bandwidth of 274.97 GB/s.

Huawei FusionServer Pro XH628 V5 Server Node

Technical White Paper 2 Features

● With Intel integrated I/O, the Intel® Xeon® Scalable processors integrate the

PCIe 3.0 controller to shortens I/O latency and improve overall system

performance.

● It supports 12 SATA/SAS HDDs or SSDs. The SSDs deliver higher I/O

performance than HDDs. An SSD supports approximately 100 times more I/O

operations per second (IOPS) than a typical HDD.

● Four ES3000 half-height half-length (HHHL) PCIe SSD cards can be

congured to support high-bandwidth low-delay data access.

Availability and Serviceability

● Carrier-class components with process expertise ensure high system reliability

and availability.

● The server node supports twelve 2.5-inch or 3.5-inch hot-swappable drives. It

supports RAID 0, 1, 1E, 5, 6, 10, 50, and 60, depending on the RAID controller

card used. It also uses a supercapacitor to protect the RAID cache data

against power failures.

● The server provides simplied O&M and ecient troubleshooting through the

UID/HLY indicators on the front panel, fault diagnosis LED, and iBMC web

interface.

● The SSDs oer better reliability than HDDs, ensuring continued system

performance.

● The built-in iBMC monitors system parameters in real time, triggers alarms,

and performs recovery actions to minimize the system downtime.

● Huawei provides a three-year warranty for parts replacement and onsite

repair for the servers used in China. Huawei provides a 10-hour-a-day, 7-day-

a-week support program. Service requests will be handled the next business

day. Optional service upgrades are available.

● Huawei provides a three-year warranty for parts replacement and repair for

the servers used outside China. Huawei provides a 9-hour-a-day, 5-day-a-

week support program. Service requests will be handled the next business day.

Huawei delivers the repaired or new parts within 45 calendar days after

receiving the defective parts.

Manageability and Security

● The built-in iBMC monitors server operating status and provides remote

management.

● The integrated Unied Extensible Firmware Interface (UEFI) improves setup,

conguration, and update eciency and simplies fault handling.

● The Advanced Encryption Standard–New Instruction (AES NI) algorithm

allows faster and stronger encryption.

● Intel Execute Disable Bit (EDB) function prevents certain types of malicious

buer overow attacks when working with a supported OS.

● The Network Controller Sideband Interface (NC-SI) allows a network port to

serve as a management port and a service port for maximized return on

investment (ROI) for customers. The NC-SI feature is disabled by default and

can be enabled through the iBMC or BIOS.

● The trusted platform module (TPM) 2.0 provides advanced encryption

functions, such as digital signatures and remote authentication.

Huawei FusionServer Pro XH628 V5 Server Node

Technical White Paper 2 Features

NO TE

The service port with NC-SI enabled supports the following conguration:

●Conguring the LOM port (NIC Mezz) of the server as the service port with NC-SI

enabled. LOM port 1 is congured by default.

● Enabling, disabling, and setting a virtual local area network (VLAN) ID for this port. The

VLAN ID is 0 and disabled by default.

●Conguring IPv4 addresses (IPv4 address, subnet mask, and gateway) and IPv6

addresses (IPv6 address, prex length, and gateway) for this port.

Energy Eciency

● The Intel® Xeon® Scalable processors outperform the previous-generation

processors while tting into the same TDP.

●Ecient voltage regulator-down (VRD) power supplies for boards minimize

the energy loss from DC/DC power conversion.

● Intel® Intelligent Power Capability allows a processor to be powered on or o

based on requirements.

● Low-voltage Intel® Xeon® Scalable processors consume less energy, ideally

suited for data centers and telecommunications environments constrained by

power and thermal limitations.

● Staggered spin-up for drives reduces the server boot power consumption.

● The 1.2 V DDR4 RDIMMs consume 20% less energy than 1.5 V DDR3

RDIMMs.

● SSDs consume 80% less power than HDDs.

● The server supports intelligent frequency scaling of processors for energy

conservation and consumption reduction.

● The quadrilateral ventilation holes on the node panel provide higher

ventilation density than round holes, increasing the system cooling eciency.

Huawei FusionServer Pro XH628 V5 Server Node

Technical White Paper 2 Features

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