IBASE Technology MI811F Series Bedienungsanleitung

MI811F Series

Intel

Pentium

& Celeron

SoC

Mini-ITX Motherboard

User’s Manual

Version 1.4

(July 2020)

ii MI811F Series User’s Manual

No part of this publication may be reproduced, copied, stored in a retrieval

system, translated into any language or transmitted in any form or by any

means, electronic, mechanical, photocopying, or otherwise, without the prior

written consent of IBASE Technology, Inc. (hereinafter referred to as

“IBASE”).

Disclaimer

IBASE reserves the right to make changes and improvements to the

products described in this document without prior notice. Every effort has

been made to ensure the information in the document is correct; however,

IBASE does not guarantee this document is error-free.

IBASE assumes no liability for incidental or consequential damages arising

from misapplication or inability to use the product or the information

contained herein, nor for any infringements of rights of third parties, which

may result from its use.

Trademarks

All the trademarks, registrations and brands mentioned herein are used for

identification purposes only and may be trademarks and/or registered

trademarks of their respective owners.

MI811F Series User’s Manual

iii

Compliance

This product has passed CE tests for environmental specifications and

limits. This product is in accordance with the directives of the European

Union (EU). In a domestic environment, this product may cause radio

interference in which case users may be required to take adequate

measures.

This product has been tested and found to comply with the limits for a Class

B device, pursuant to Part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful interference in a residential

installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with manufacturer’s

instructions, may cause harmful interference to radio communications.

WEEE

This product must not be disposed of as normal household

waste, in accordance with the EU directive of for waste

electrical and electronic equipment (WEEE - 2012/19/EU).

Instead, it should be disposed of by returning it to a

municipal recycling collection point. Check local

regulations for disposal of electronic products.

Green IBASE

This product is compliant with the current RoHS

restrictions and prohibits use of the following substances

in concentrations exceeding 0.1% by weight (1000 ppm)

except for cadmium, limited to 0.01% by weight (100 ppm).

• Lead (Pb)

• Mercury (Hg)

• Cadmium (Cd)

• Hexavalent chromium (Cr6+)

• Polybrominated biphenyls (PBB)

• Polybrominated diphenyl ether (PBDE)

iv MI811F Series User’s Manual

Important Safety Information

Carefully read the precautions before using the board.

Environmental conditions:

•Use this product in environments with ambient temperatures between

0˚C and 60˚C.

•Do not leave this product in an environment where the storage

temperature may be below -20° C or above 80° C. To prevent from

damages, the product must be used in a controlled environment.

Care for your IBASE products:

•Before cleaning the PCB, unplug all cables and remove the battery.

•Clean the PCB with a circuit board cleaner or degreaser, or use cotton

swabs and alcohol.

•Vacuum the dust with a computer vacuum cleaner to prevent the fan

from being clogged.

WARNING

Attention during use:

•Do not use this product near water.

•Do not spill water or any other liquids on this product.

•Do not place heavy objects on the top of this product.

Anti-static precautions

•Wear an anti-static wrist strap to avoid electrostatic discharge.

•Place the PCB on an anti-static kit or mat.

•Hold the edges of PCB when handling.

•Touch the edges of non-metallic components of the product instead of

the surface of the PCB.

•Ground yourself by touching a grounded conductor or a grounded bit of

metal frequently to discharge any static.

CAUTION

Danger of explosion if the internal lithium-ion battery is replaced by an

incorrect type. Replace only with the same or equivalent type recommended

by the manufacturer. Dispose of used batteries according to the

manufacturer’s instructions or recycle them at a local recycling facility or

battery collection point.

MI811F Series User’s Manual

Warranty Policy

•IBASE standard products:

24-month (2-year) warranty from the date of shipment. If the date of

shipment cannot be ascertained, the product serial numbers can be

used to determine the approximate shipping date.

•3

-party parts:

12-month (1-year) warranty from delivery for the 3rd-party parts that are

not manufactured by IBASE, such as CPU, CPU cooler, memory,

storage devices, power adapter, panel and touchscreen.

＊ PRODUCTS, HOWEVER, THAT FAIL DUE TO MISUSE, ACCIDENT,

IMPROPER INSTALLATION OR UNAUTHORIZED REPAIR SHALL BE

TREATED AS OUT OF WARRANTY AND CUSTOMERS SHALL BE

BILLED FOR REPAIR AND SHIPPING CHARGES.

Technical Support & Services

1. Visit the IBASE website at www.ibase.com.tw to find the latest

information about the product.

2. If you need any further assistance from your distributor or sales

representative, prepare the following information of your product and

elaborate upon the problem.

•Product model name

•Product serial number

•Detailed description of the problem

•The error messages in text or in screenshots if there is any

•The arrangement of the peripherals

•Software in use (such as OS and application software, including the

version numbers)

3. If repair service is required, you can download the RMA form at

http://www.ibase.com.tw/english/Supports/RMAService/. Fill out the

form and contact your distributor or sales representative.

vi MI811F Series User’s Manual

Table of Contents

Compliance ..................................................................................... iii

Important Safety Information ........................................................ iv

Warranty Policy ............................................................................... v

Technical Support & Services ....................................................... v

Chapter 1

General Information ............................................. 1

1.1

Introduction .........................................................................................2

1.2

Features..............................................................................................2

1.3

Packing List.........................................................................................3

1.4

Optional Accessories........................................................................... 3

1.5

Specifications ...................................................................................... 4

1.6

Block Diagram..................................................................................... 7

1.7

Overview .............................................................................................8

1.8

Dimensions ....................................................................................... 10

Chapter 2

Hardware Configuration........................................ 11

2.1

Essential Installations Before You Begin ........................................... 12

2.1.1

Installing the Memory ........................................................... 12

2.2

Setting the Jumpers .......................................................................... 13

2.3

Jumper & Connector Locations ......................................................... 14

2.4

Jumpers Quick Reference ................................................................. 16

2.4.1

LVDS Panel Power Selection (JP1)..................................... 16

2.4.2

Panel Output Selection (JP3) .............................................. 17

2.4.3

Panel Backlight Control Selection (JP4) .............................. 18

2.4.4

ME Register Clearance (JP6).............................................. 19

2.4.5

CMOS Data Clearance (JP7) .............................................. 20

2.4.6

eDP Backlight Power Selection (JP9).................................. 21

2.4.7

eDP Panel Power Selection (JP10) ..................................... 22

2.5

Connectors Quick Reference............................................................. 23

2.5.1

eDP Connector (CN1) ......................................................... 24

2.5.2

COM1 RS-232/422/485 Port & COM2 RS-232 Port (CN2) .. 25

2.5.3

Dual USB 2.0 Port (CN3) .................................................... 26

2.5.4

Dual USB 3.0 Port & LAN Port (CN4, CN5)......................... 26

2.5.5

HDMI Port (CN6, CN7)........................................................ 27

MI811F Series User’s Manual

vii

2.5.6

Audio Jack (CN10) ..............................................................27

2.5.7

DVI-D Connector (J11) ........................................................28

2.5.8

SATA III Port (CN8, CN9)....................................................29

2.5.9

Mini-PCIe Slot for mSATA (J8) ............................................29

2.5.10

Mini-PCIe Slot (J7) ..............................................................30

2.5.11

Panel Inverter Connector (J2)..............................................30

2.5.12

LVDS Connector (J3, J4).....................................................31

2.5.13

DC Power Input Connector (J6) ...........................................32

2.5.14

ATX Power Connector (J5) ..................................................33

2.5.15

Dual USB Port (J9, J23) ......................................................34

2.5.16

SATA Power Connector (J14, J15) ......................................34

2.5.17

Front Panel Setting Connector (J12)....................................35

2.5.18

DDR3L SO-DIMM Slot (J10, J13) ........................................36

2.5.19

Amplifier Connector (J16) ....................................................36

2.5.20

Audio Connector (J17).........................................................37

2.5.21

COM3 & COM4 RS-232 Port (J18, J19) ..............................38

2.5.22

Fan Connector (CPU_FAN1, SYS_FAN1) ...........................38

2.5.23

Digital I/O Connector (J21) ..................................................39

Chapter 3

Drivers Installation ............................................. 41

3.1

Introduction........................................................................................42

3.2

Intel

Chipset Software Installation Utility ..........................................42

3.3

VGA Driver Installation.......................................................................44

3.4

HD Audio Driver Installation ...............................................................46

3.5

Intel

Trusted Execution Engine Drivers Installation ..........................47

3.6

Intel

Serial IO Drivers Installation .....................................................49

3.7

LAN Drivers Installation .....................................................................51

viii MI811F Series User’s Manual

Chapter 4

BIOS Setup.......................................................... 53

4.1

Introduction ....................................................................................... 54

4.2

BIOS Setup ....................................................................................... 54

4.3

Main Settings .................................................................................... 55

4.4

Advanced Settings ............................................................................ 56

4.4.1

ACPI Computing .................................................................. 57

4.4.2

LVDS (eDP/DP) Configuration ............................................. 58

4.4.3

iSmart Controller .................................................................. 59

4.4.4

Fintek Super IO Configuration .............................................. 60

4.4.5

Fintek Super IO Hardware Monitor ....................................... 62

4.4.6

CPU Configuration ............................................................... 63

4.4.7

AMI Graphic Output Protocol Policy ..................................... 64

4.4.8

Network Stack Configuration................................................ 65

4.4.9

CSM Configuration ............................................................... 66

4.4.10

USB Configuration ............................................................... 67

4.5

Chipset Settings ................................................................................ 68

4.5.1

South Cluster Configuration ................................................. 68

4.6

Security Settings ............................................................................... 73

4.7

Boot Settings..................................................................................... 76

4.8

Save & Exit Settings .......................................................................... 77

Appendix ........................................................................................ 79

I/O Port Address Map........................................................................ 80

Interrupt Request Lines (IRQ)............................................................ 83

Watchdog Timer Configuration.......................................................... 85

Chapter 1

General Information

The information provided in this chapter includes:

•Features

•Packing List

•Optional Accessories

•Specifications

•Block Diagram

•Board Overview

•Board Dimensions

2 MI811F Series User’

s Manual

1.1 Introduction

MI811F is a Mini-ITX motherboard based on the platform of Intel® Pentium®

N4200 or Celeron® N3350. This board features HDMI at I/O coastline,

on-board headers for eDP and 24-bit dual channel LVDS interfaces for video

display. You can use either the eDP or LVDS interface. It operates at the

ambient temperature ranging from 0°C to 60°C.

Photo of MI811F

1.2 Features

•Mini-ITX with Intel®Pentium®QC N4200 / Celeron®DC N3350 SoC

•2 x DDR3L-1866 SO-DIMM socket, expandable up to 8GB

•1 x HDMI, 1 x DVI-D (or 2nd HDMI), and eDP / 24-bit dual channel LVDS

•2 x GbE LAN, 4 x USB 3.0, 6 x USB 2.0, 4 x COM, 2 x SATA III,

1 x PCIe (1x), 2 x Mini-PCIe slot

•Configurable watchdog timer and digital I/O

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