Intel BLKDQ965WCEKR Konfigurationshandbuch

September 2006

Order Number: D56018-001US

The Intel®Desktop Board DQ965WC may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current

characterized errata are documented in the Intel Desktop Board DQ965WC Specification Update.

Intel® Desktop Board

DQ965WC

Technical Product Specification

Revision History

Revision Revision History Date

-001 First release of the Intel®Desktop Board DQ965WC Technical Product

Specification.

September 2006

This product specification applies to only the standard Intel®Desktop Board DQ965WC with

BIOS identifier CO96510J.86A.

Changes to this specification will be published in the Intel Desktop Board DQ965WC Specification

Update before being incorporated into a revision of this document.

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conflicts or incompatibilities arising from future changes to them.

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to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your

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iii

Preface

This Technical Product Specification (TPS) specifies the board layout, components,

connectors, power and environmental requirements, and the BIOS for the Intel®

Desktop Board DQ965WC. It describes the standard product and available

manufacturing options.

Intended Audience

The TPS is intended to provide detailed, technical information about the Desktop Board

DQ965WC and its components to the vendors, system integrators, and other engineers

and technicians who need this level of information. It is specifically not intended for

general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on the board

2 A map of the resources of the board

3 The features supported by the BIOS Setup program

4 A description of the BIOS error messages, beep codes, and POST codes

5 Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not

all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

 NOTE

Notes call attention to important information.

# INTEGRATOR’S NOTES

Integrator’s notes are used to call attention to information that may be useful to

system integrators.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DQ965WC Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#).

GB Gigabyte (1,073,741,824 bytes)

GB/sec Gigabytes per second

Gbit Gigabit (1, 073,741,824 bits)

KB Kilobyte (1024 bytes)

Kbit Kilobit (1024 bits)

kbits/sec 1000 bits per second

MB Megabyte (1,048,576 bytes)

MB/sec Megabytes per second

Mbit Megabit (1,048,576 bits)

Mbit/sec Megabits per second

xxh An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V Volts. Voltages are DC unless otherwise specified.

* This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

Contents

1Product Description

1.1 Overview........................................................................................ 10

1.1.1 Feature Summary ................................................................ 10

1.1.2 Board Layout ....................................................................... 12

1.1.3 Block Diagram ..................................................................... 14

1.2 Online Support................................................................................ 15

1.3 Processor ....................................................................................... 15

1.4 System Memory .............................................................................. 16

1.4.1 Memory Configurations ......................................................... 18

1.5 Intel®Virtualization Technology (Intel®VT) ........................................ 23

1.6 Intel®vPro™ Technology Support...................................................... 24

1.7 Intel®Q965 Express Chipset............................................................. 25

1.7.1 Intel Q965 Graphics Subsystem ............................................. 25

1.7.2 USB ................................................................................... 28

1.7.3 Serial ATA Interfaces ............................................................ 28

1.7.4 Real-Time Clock, CMOS SRAM, and Battery.............................. 29

1.8 Audio Subsystem ............................................................................ 30

1.8.1 Audio Subsystem Software .................................................... 30

1.8.2 Audio Connectors and Headers............................................... 31

1.9 LAN Subsystem............................................................................... 32

1.9.1 Intel®82566DM Gigabit Ethernet Controller............................. 32

1.9.2 LAN Subsystem Software ...................................................... 32

1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 33

1.9.4 Intel®Active Management Technology (Intel®AMT)

with System Defense Feature................................................. 33

1.9.5 Alert Standard Format (ASF) 2.0 Support ................................ 34

1.10 Hardware Management Subsystem .................................................... 35

1.10.1 Hardware Monitoring and Fan Control...................................... 35

1.10.2 Fan Monitoring..................................................................... 35

1.10.3 Chassis Intrusion and Detection ............................................. 35

1.10.4 Thermal Monitoring .............................................................. 36

1.11 Power Management ......................................................................... 37

1.11.1 ACPI .................................................................................. 37

1.11.2 Hardware Support ................................................................ 39

1.12 Trusted Platform Module (TPM).......................................................... 44

2Technical Reference

2.1 Memory Map................................................................................... 45

2.1.1 Addressable Memory............................................................. 45

2.2 DMA Channels................................................................................. 47

2.3 Fixed I/O Map ................................................................................. 48

2.4 PCI Configuration Space Map ............................................................ 49

2.5 Interrupts ...................................................................................... 50

Intel Desktop Board DQ965WC Technical Product Specification

2.6 PCI Interrupt Routing Map ................................................................ 51

2.7 Connectors and Headers................................................................... 52

2.7.1 Back Panel Connectors.......................................................... 53

2.7.2 Component-side Connectors and Headers ................................ 54

2.8 Jumper Block.................................................................................. 61

2.9 Mechanical Considerations ................................................................ 62

2.9.1 Form Factor......................................................................... 62

2.9.2 I/O Shield ........................................................................... 63

2.10 Electrical Considerations................................................................... 64

2.10.1 DC Loading.......................................................................... 64

2.10.2 Fan Header Current Capability................................................ 64

2.10.3 Add-in Board Considerations .................................................. 64

2.10.4 Power Supply Considerations ................................................. 65

2.11 Thermal Considerations.................................................................... 66

2.12 Reliability ....................................................................................... 68

2.13 Environmental ................................................................................ 69

3Overview of BIOS Features

3.1 Introduction ................................................................................... 71

3.2 BIOS Flash Memory Organization....................................................... 72

3.3 Resource Configuration .................................................................... 72

3.3.1 PCI Autoconfiguration ........................................................... 72

3.4 System Management BIOS (SMBIOS)................................................. 73

3.5 Legacy USB Support ........................................................................ 73

3.6 BIOS Updates ................................................................................. 74

3.6.1 Language Support ................................................................ 74

3.6.2 Custom Splash Screen .......................................................... 74

3.7 BIOS Recovery................................................................................ 75

3.8 Boot Options................................................................................... 75

3.8.1 CD-ROM Boot ...................................................................... 75

3.8.2 Network Boot....................................................................... 75

3.8.3 Booting Without Attached Devices .......................................... 76

3.8.4 Changing the Default Boot Device During POST ........................ 76

3.9 Adjusting Boot Speed....................................................................... 76

3.9.1 Peripheral Selection and Configuration .................................... 76

3.9.2 BIOS Boot Optimizations ....................................................... 77

3.10 BIOS Security Features .................................................................... 78

4Error Messages and Beep Codes

4.1 Speaker ......................................................................................... 79

4.2 BIOS Beep Codes ............................................................................ 79

4.3 BIOS Error Messages ....................................................................... 79

4.4 Port 80h POST Codes ....................................................................... 80

Contents

vii

5Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance..................................................................... 85

5.1.1 Safety Regulations ............................................................... 85

5.1.2 European Union Declaration of Conformity Statement................ 86

5.1.3 Product Ecology Statements .................................................. 88

5.1.4 EMC Regulations .................................................................. 91

5.1.5 Product Certification Markings (Board Level) ............................ 92

5.2 Battery Disposal Information............................................................. 93

Figures

1. Major Board Components ................................................................. 12

2. Block Diagram ................................................................................ 14

3. Memory Channel Configuration and DIMM Configuration ....................... 18

4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ 19

5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 19

6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs ........... 20

7. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 21

8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 21

9. Flex Mode Configuration with Two DIMMs ........................................... 22

10. Front/Back Panel Audio Connector Options.......................................... 31

11. LAN Connector LED Locations............................................................ 33

12. Thermal Sensors and Fan Headers ..................................................... 36

13. Location of the Onboard Power Indicator LEDs..................................... 43

14. Detailed System Memory Address Map ............................................... 46

15. Back Panel Connectors ..................................................................... 53

16. Component-side Connectors and Headers ........................................... 54

17. Connection Diagram for Front Panel Header ........................................ 58

18. Connection Diagram for Front Panel USB Headers ................................ 60

19. Connection Diagram for IEEE 1394a Header ........................................ 60

20. Location of the Jumper Block ............................................................ 61

21. Board Dimensions ........................................................................... 62

22. I/O Shield Dimensions...................................................................... 63

23. Localized High Temperature Zones..................................................... 67

Tables

1. Feature Summary............................................................................ 10

2. Board Components Shown in Figure 1 ................................................ 13

3. Supported Memory Configurations ..................................................... 16

4. Memory Operating Frequencies ......................................................... 17

5. DVI Port Status Conditions................................................................ 27

6. Audio Jack Retasking Support ........................................................... 30

7. LAN Connector LED States ................................................................ 33

8. Effects of Pressing the Power Switch .................................................. 37

9. Power States and Targeted System Power .......................................... 38

Intel Desktop Board DQ965WC Technical Product Specification

viii

10. Wake-up Devices and Events ............................................................ 39

11. System Memory Map ....................................................................... 47

12. DMA Channels................................................................................. 47

13. I/O Map ......................................................................................... 48

14. PCI Configuration Space Map ............................................................ 49

15. Interrupts ...................................................................................... 50

16. PCI Interrupt Routing Map ................................................................ 51

17. Component-side Connectors and Headers Shown in Figure 16................ 55

18. Front and Rear Chassis Fan Headers .................................................. 55

19. Processor Fan Header ...................................................................... 55

20. Chassis Intrusion Header.................................................................. 55

21. Serial ATA Connectors...................................................................... 56

22. High Definition Audio Link Header...................................................... 56

23. Front Panel Audio Header ................................................................. 56

24. Processor Core Power Connector........................................................ 57

25. Main Power Connector...................................................................... 57

26. Front Panel Header .......................................................................... 58

27. States for a One-Color Power LED...................................................... 59

28. States for a Two-Color Power LED...................................................... 59

29. Auxiliary Front Panel Power LED Header ............................................. 59

30. BIOS Setup Configuration Jumper Settings.......................................... 61

31. DC Loading Characteristics ............................................................... 64

32. Fan Header Current Capability........................................................... 64

33. Thermal Considerations for Components............................................. 68

34. Desktop Board DQ965WC Environmental Specifications ........................ 69

35. BIOS Setup Program Menu Bar.......................................................... 72

36. BIOS Setup Program Function Keys ................................................... 72

37. Acceptable Drives/Media Types for BIOS Recovery ............................... 75

38. Boot Device Menu Options ................................................................ 76

39. Supervisor and User Password Functions ............................................ 78

40. Beep Codes .................................................................................... 79

41. BIOS Error Messages ....................................................................... 79

42. Port 80h POST Code Ranges ............................................................. 80

43. Port 80h POST Codes ....................................................................... 81

44. Typical Port 80h POST Sequence ....................................................... 84

45. Safety Regulations........................................................................... 85

46. Lead-Free Board Markings ................................................................ 90

47. EMC Regulations ............................................................................. 91

48. Product Certification Markings ........................................................... 92

1Product Description

What This Chapter Contains

1.1 Overview........................................................................................ 10

1.2 Online Support................................................................................ 15

1.3 Processor ....................................................................................... 15

1.4 System Memory .............................................................................. 16

1.5 Intel®Virtualization Technology ........................................................ 23

1.6 Intel®vPro™ Technology Support...................................................... 24

1.7 Intel®Q965 Express Chipset............................................................. 25

1.8 Audio Subsystem ............................................................................ 30

1.9 LAN Subsystem............................................................................... 32

1.10 Hardware Management Subsystem .................................................... 35

1.11 Power Management ......................................................................... 37

1.12 Trusted Platform Module (TPM).......................................................... 44

Intel Desktop Board DQ965WC Technical Product Specification

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the Desktop Board DQ965WC.

Table 1. Feature Summary

Form Factor picoBTX Form Factor (8.00 inches by 10.50 inches [203.20 millimeters by

266.70 millimeters])

Processor Support for the following:

•Intel®Core™2 Duo processor in an LGA775 socket with a 1066 or 800 MHz

system bus

•Intel®Pentium®D processor in an LGA775 socket with an 800 or 533 MHz

system bus

•Intel®Pentium®4 processor in an LGA775 socket with an 800 or 533 MHz

system bus

•Intel®Celeron®D processor in an LGA775 socket with a 533 MHz system bus

Memory •Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets

•Support for DDR2 800, DDR2 667, or DDR2 533 MHz DIMMs

•Support for up to 8 GB of system memory using DDR2 667 or DDR2 533

DIMMs

•Support for up to 4 GB of system memory using DDR2 800 DIMMs

Chipset Intel®Q965 Express Chipset, consisting of:

•Intel®82Q965 Graphics Memory Controller Hub (GMCH)

•Intel®82801HO I/O Controller Hub (ICH8DO)

Video Intel® GMA 3000 onboard graphics subsystem

Audio 6-channel (5.1) audio subsystem using the SigmaTel* STAC9227 audio codec

USB Support for USB 2.0 devices

Peripheral

Interfaces

•10 USB ports

•Two IEEE-1394a interfaces: one back panel connector and one front-panel

header

•Four Serial ATA interfaces

LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82566DM

Gigabit Ethernet Controller

BIOS •Intel®BIOS (resident in the SPI Flash device)

•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,

and SMBIOS

Trusted Platform

Module (TPM),

revision 1.2

A component that enhances platform security

continued

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