Intel Celeron 1047UE/847 Bedienungsanleitung

Technical Manual

Intel Celeron 1047UE/847 CPU

& Intel HM65 Chipset

Based

3.5’’ SBC

NO.G03-NF39-F

Revision: 1.0

Release date: June 7, 2013

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

iii

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iv

USER’S NOTICE .......................................................................................................................v

MANUAL REVISION INFORMATION.......................................................................................v

ITEM CHECKLIST.....................................................................................................................v

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING.....................................................................................................9

2-2 CONNECTORS AND HEADERS................................................................................13

2-2-1 CONNECTORS .............................................................................................13

2-2-2 HEADERS .....................................................................................................15

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP.....................................................................................................22

3-2 BIOS MENU SCREEN ................................................................................................23

3-3 FUNCTION KEYS .......................................................................................................23

3-4 GETTING HELP ..........................................................................................................24

3-5 MEMU BARS...............................................................................................................24

3-6 MAIN MENU................................................................................................................25

3-7 ADVANCED MENU.....................................................................................................26

3-8 CHIPSET MENU..........................................................................................................34

3-9 BOOT MENU...............................................................................................................37

3-10 SECURITY MENU.......................................................................................................39

3-11 SAVE & EXIT MENU...................................................................................................40

TABLE OF CONTENT

Environmental Safety Instruction

zAvoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

zGenerally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from

the welding spots’ that connect components and PCB. Computer should go

through an adaptive phase before it boots when it is moved from a cold

environment to a warmer one to avoid condensation phenomenon. These water

drops attached on PCB or the surface of the components can bring about

phenomena as minor as computer instability resulted from corrosion and oxidation

from components and PCB or as major as short circuit that can burn the

components. Suggest starting the computer until the temperature goes up.

zThe increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher

temperature in the inner of the case.

zAttention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

USER’S NOTICE

INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED

OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN

PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE

DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME

WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY

KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL

DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,

INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE

REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE

USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT

INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition June 7, 2013

Item Checklist

5Motherboard

5User’s Manual

5CD for motherboard utilities

5Cable(s)

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

Onboard Intel®Celeron Processor + Intel®HM65 Chipset, with low power

consumption never denies high performance

Support single channel DDRIII 1066/1333/1600 SODIMM, up to 8GB

Support 1 * SATAIII device

Onboard one CFast card slot

Onboard one full-size mSATA/ Mini-PCIE slot

Onboard 2 * RJ-45 gigabit Ethernet LAN ports

Integrated with 1 * 18-bit single channel LVDS header

Support USB 2.0 data transport demands

Support CPU Smart FAN

Compliance with ErP standard

Support Watchdog function

1-2 Specification

Spec Description

Design z3.5”SBC; 6 layers; PCB size: 14.8x 10.2 cm

Chipset zIntel®HM65 Express chipset

Embedded CPU zIntel®Celeron 1047UE/847 CPU

Memory Slot z1 * DDRIII SODIMM Slot for un-buffered Single Channel DDRIII

1066/1333/1600 MHz SDRAM, expandable to 8GB

Expansion Slots zCFAST card slot x1

zFull-size Mini-PCIE/mSATA slot x1

LAN Chip

zIntegrated with dual Realtek RTL8111F PCI-E Gigabit LAN chips

zSupport Fast Ethernet LAN function of providing

10/100/1000Mbps Ethernet data transfer rate

BIOS zAMI 32MB Flash ROM

Rear I/O

zDC12V power-in connector x1

zUSB 2.0 port x 4

zDVI-I port x1

zRJ-45 LAN port x2

zAudio Line Out port x1

Internal I/O

zSATAIII 6Gb/s port x1

zSATA Power connector x1

zCPU FAN header x1

zLVDS inverter x1

zFront panel audio header x1

zSPDIF Out header x1

zSerial port header x4

zGPIO header x1

z9-pin USB 2.0 header x1 (Expansible to 2* USB 2.0 ports)

z4-pin USB 2.0 header x1 (Expansible to 1* USB 2.0 port)

zSM_BUS header x1

zFront panel header x1

zCIR header x1

zLANLED header x2

zLVDS header x1

1-3 Layout Diagram

Rear IO Panel Diagram:

DC12V

Power-in

Connector

Line-Out Port

USB 2.0 Ports

RJ-45 LAN Ports

DVI-I Port

USB 2.0 Ports

Internal Diagram-Front Side:

LANLED Headers

SATA III Port

CPUFAN Heade

Front Panel Heade

SODIMM Slot

Reset Button

Power Switch Button

DC 12V Power-in

Connector

USB 2.0 Ports

DVI-I Port

CFast Slot

SM_BUS

Header

INVERTER

LVDS Header

Mini-PCIE/mSATA Slot

USB 2.0 Ports

Line-Out Port

RJ-45 LAN Port

Serial port Header

(COM1/2/3/4)

GPIO Header

USB 2.0 Heade

Front Panel Audio Header

SATA

Power Connector

CIR Header

SPDIF Header

Internal Diagram-Back Side:

Intel CPU

Intel HM65 Chipset

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