Intel Celeron 1047UE/847 Bedienungsanleitung
Technical Manual
Of
Intel Celeron 1047UE/847 CPU
& Intel HM65 Chipset
Based
3.5’’ SBC
NO.G03-NF39-F
Revision: 1.0
Release date: June 7, 2013
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
iii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iv
USER’S NOTICE .......................................................................................................................v
MANUAL REVISION INFORMATION.......................................................................................v
ITEM CHECKLIST.....................................................................................................................v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................9
2-2 CONNECTORS AND HEADERS................................................................................13
2-2-1 CONNECTORS .............................................................................................13
2-2-2 HEADERS .....................................................................................................15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................22
3-2 BIOS MENU SCREEN ................................................................................................23
3-3 FUNCTION KEYS .......................................................................................................23
3-4 GETTING HELP ..........................................................................................................24
3-5 MEMU BARS...............................................................................................................24
3-6 MAIN MENU................................................................................................................25
3-7 ADVANCED MENU.....................................................................................................26
3-8 CHIPSET MENU..........................................................................................................34
3-9 BOOT MENU...............................................................................................................37
3-10 SECURITY MENU.......................................................................................................39
3-11 SAVE & EXIT MENU...................................................................................................40
TABLE OF CONTENT
iv
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
v
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition June 7, 2013
Item Checklist
5Motherboard
5User’s Manual
5CD for motherboard utilities
5Cable(s)
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel®Celeron Processor + Intel®HM65 Chipset, with low power
consumption never denies high performance
Support single channel DDRIII 1066/1333/1600 SODIMM, up to 8GB
Support 1 * SATAIII device
Onboard one CFast card slot
Onboard one full-size mSATA/ Mini-PCIE slot
Onboard 2 * RJ-45 gigabit Ethernet LAN ports
Integrated with 1 * 18-bit single channel LVDS header
Support USB 2.0 data transport demands
Support CPU Smart FAN
Compliance with ErP standard
Support Watchdog function
2
1-2 Specification
Spec Description
Design z3.5”SBC; 6 layers; PCB size: 14.8x 10.2 cm
Chipset zIntel®HM65 Express chipset
Embedded CPU zIntel®Celeron 1047UE/847 CPU
Memory Slot z1 * DDRIII SODIMM Slot for un-buffered Single Channel DDRIII
1066/1333/1600 MHz SDRAM, expandable to 8GB
Expansion Slots zCFAST card slot x1
zFull-size Mini-PCIE/mSATA slot x1
LAN Chip
zIntegrated with dual Realtek RTL8111F PCI-E Gigabit LAN chips
zSupport Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
BIOS zAMI 32MB Flash ROM
Rear I/O
zDC12V power-in connector x1
zUSB 2.0 port x 4
zDVI-I port x1
zRJ-45 LAN port x2
zAudio Line Out port x1
Internal I/O
zSATAIII 6Gb/s port x1
zSATA Power connector x1
zCPU FAN header x1
zLVDS inverter x1
zFront panel audio header x1
zSPDIF Out header x1
zSerial port header x4
zGPIO header x1
z9-pin USB 2.0 header x1 (Expansible to 2* USB 2.0 ports)
z4-pin USB 2.0 header x1 (Expansible to 1* USB 2.0 port)
3
zSM_BUS header x1
zFront panel header x1
zCIR header x1
zLANLED header x2
zLVDS header x1
1-3 Layout Diagram
Rear IO Panel Diagram:
DC12V
Power-in
Connector
Line-Out Port
USB 2.0 Ports
RJ-45 LAN Ports
DVI-I Port
USB 2.0 Ports
4
Internal Diagram-Front Side:
LANLED Headers
SATA III Port
CPUFAN Heade
r
Front Panel Heade
r
SODIMM Slot
Reset Button
Power Switch Button
DC 12V Power-in
Connector
USB 2.0 Ports
DVI-I Port
CFast Slot
SM_BUS
Header
INVERTER
LVDS Header
Mini-PCIE/mSATA Slot
USB 2.0 Ports
Line-Out Port
RJ-45 LAN Port
RJ-45 LAN Port
Serial port Header
(COM1/2/3/4)
GPIO Header
USB 2.0 Heade
r
USB 2.0 Heade
r
Front Panel Audio Header
SATA
Power Connector
CIR Header
SPDIF Header
5
Internal Diagram-Back Side:
Intel CPU
Intel HM65 Chipset
Dieses Handbuch passt für folgende Modelle
1
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