Intel D33217GKE Bedienungsanleitung

Intel® Next Unit of Computing

Board D33217GKE

Technical Product Specification

October 2012

Order Number: G67686-002

The Intel Next Unit of Computing Board D33217GKE may contain design defects or errors known as errata that may cause the product to deviate from

published specifications. Current characterized errata are documented in the Intel Next Unit of Computing Board D33217GKE Specification Update.

Revision History

Revision Revision History Date

001 First release of the Intel

Next Unit of Computing Board D33217GKE

Technical Product Specification

October 2012

002 Specification Clarification October 2012

Disclaimer

This product specification applies to only the standard Intel®Next Unit of Computing Board with

BIOS identifier GKPPT10H.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS

GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR

SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR

IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR

WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR

INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS

OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED

FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION

WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel®Next Unit of Computing Boards are evaluated as Information Technology Equipment (I.T.E.) for

use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar

locations. The suitability of this product for other PC or embedded non-PC applications or other

environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported

without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other

intellectual property rights that relate to the presented subject matter. The furnishing of documents and

other materials and information does not provide any license, express or implied, by estoppel or otherwise,

to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”

or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for

conflicts or incompatibilities arising from future changes to them.

Intel Next Unit of Computing Boards may contain design defects or errors known as errata, which may

cause the product to deviate from published specifications. Current characterized errata are available on

request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your

product order.

Intel and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

iii

Board Identification Information

Basic Intel®Next Unit of Computing Board D33217GKE

Identification Information

AA Revision

BIOS Revision

Notes

G69901-200 GKPPT10H.86A.0020 1,2

G69901-201 GKPPT10H.86A.0020 1,2

Notes:

1. The AA number is found on a small label on the component side of the board.

2. The Intel®QS77 PCH and Intel®Core™ i3-3217U processor used on this AA revision consists

of the following components:

Device

Stepping

S-Spec Numbers

Intel Core I3-3217U L1 SR0N9

Intel BD82QS77 C1 SLI8B

Specification Changes or Clarifications

Table 1 indicates the Specification Changes or Specification Clarifications that apply to

the Intel®Desktop Board D33217GKE.

Table 1. Specification Changes or Clarifications

Date Type of Change Description of Changes or Clarifications

October 2012 Spec Change Added Note to Section 1.6.1.3.1 on page 23.

Errata

Current characterized errata, if any, are documented in a separate Specification

Update. See http://developer.intel.com/products/desktop/motherboard/index.htm

for the latest documentation.

Intel Desktop Board D33217GKE Technical Product Specification

Preface

This Technical Product Specification (TPS) specifies the board layout, components,

connectors, power and environmental requirements, and the BIOS for Intel®Next Unit

of Computing Board D33217GKE.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel Next Unit of

Computing Board D33217GKE and its components to the vendors, system integrators,

and other engineers and technicians who need this level of information. It is

specifically not intended for general audiences.

What This Document Contains

Chapter Description

A description of the hardware used on Intel Next Unit of Computing Board

D33217GKE

A map of the resources of the Intel Next Unit of Computing Board

The features supported by the BIOS Setup program

A description of the BIOS error messages, beep codes, and POST codes

Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not

all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board D33217GKE Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)

GB Gigabyte (1,073,741,824 bytes)

GB/s Gigabytes per second

Gb/s Gigabits per second

KB Kilobyte (1024 bytes)

Kb Kilobit (1024 bits)

kb/s 1000 bits per second

MB Megabyte (1,048,576 bytes)

MB/s Megabytes per second

Mb Megabit (1,048,576 bits)

Mb/s Megabits per second

TDP Thermal Design Power

xxh An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V Volts. Voltages are DC unless otherwise specified.

* This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

vii

Contents

Revision History

Disclaimer ................................................................................................ ii

Board Identification Information ..................................................................iii

Errata ......................................................................................................iii

Preface

Intended Audience..................................................................................... v

What This Document Contains..................................................................... v

Typographical Conventions ......................................................................... v

1Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout (Top) ............................................................... 13

1.1.3 Board Layout (Bottom) .......................................................... 15

1.1.4 Block Diagram ...................................................................... 17

1.2 Online Support ................................................................................. 18

1.3 Processor ........................................................................................ 18

1.4 System Memory ............................................................................... 19

1.4.1 Memory Configurations .......................................................... 20

1.5 Intel®QS77 Express Chipset .............................................................. 22

1.5.1 Direct Media Interface (DMI) .................................................. 22

1.5.2 Display Interfaces ................................................................. 22

1.6 Graphics Subsystem ......................................................................... 22

1.6.1 Integrated Graphics............................................................... 22

1.6.2 USB..................................................................................... 24

1.7 SATA Interface................................................................................. 24

1.7.1 AHCI Mode ........................................................................... 24

1.8 Real-Time Clock Subsystem ............................................................... 25

1.9 LAN Subsystem ................................................................................ 25

1.9.1 Intel®82579V Gigabit Ethernet Controller ................................ 26

1.9.2 LAN Subsystem Software ....................................................... 26

1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27

1.10 Hardware Management Subsystem ..................................................... 28

1.10.1 Hardware Monitoring ............................................................. 28

1.10.2 Fan Monitoring ...................................................................... 28

1.10.3 Thermal Solution ................................................................... 29

1.11 Power Management .......................................................................... 30

1.11.1 ACPI .................................................................................... 30

1.11.2 Hardware Support ................................................................. 32

Intel Desktop Board D33217GKE Technical Product Specification

viii

2Technical Reference

2.1 Memory Resources ........................................................................... 35

2.1.1 Addressable Memory ............................................................. 35

2.1.2 Memory Map......................................................................... 37

2.2 Connectors and Headers.................................................................... 37

2.2.1 Back Panel Connectors........................................................... 38

2.2.2 Connectors and Headers (Bottom)........................................... 39

2.3 BIOS Setup Configuration Jumper....................................................... 46

2.4 Mechanical Considerations ................................................................. 48

2.4.1 Form Factor.......................................................................... 48

2.5 Electrical Considerations .................................................................... 49

2.5.1 Power Supply Considerations .................................................. 49

2.5.2 Fan Header Current Capability ................................................ 50

2.6 Thermal Considerations ..................................................................... 50

2.7 Reliability......................................................................................... 53

2.8 Environmental.................................................................................. 53

3Overview of BIOS Features

3.1 Introduction..................................................................................... 55

3.2 BIOS Flash Memory Organization........................................................ 56

3.3 System Management BIOS (SMBIOS) ................................................. 56

3.4 Legacy USB Support ......................................................................... 56

3.5 BIOS Updates .................................................................................. 57

3.5.1 Language Support ................................................................. 57

3.5.2 Custom Splash Screen ........................................................... 58

3.6 BIOS Recovery................................................................................. 58

3.7 Boot Options .................................................................................... 59

3.7.1 Network Boot........................................................................ 59

3.7.2 Booting Without Attached Devices ........................................... 59

3.7.3 Changing the Default Boot Device During POST......................... 59

3.8 Hard Disk Drive Password Security Feature.......................................... 60

3.9 BIOS Security Features ..................................................................... 61

4Error Messages and Blink Codes

4.1 Front-panel Power LED Blink Codes..................................................... 63

4.2 BIOS Error Messages ........................................................................ 63

4.3 Port 80h POST Codes ........................................................................ 64

5Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance...................................................................... 71

5.1.1 Safety Standards................................................................... 71

5.1.2 European Union Declaration of Conformity Statement ................ 72

5.1.3 Product Ecology Statements ................................................... 73

5.1.4 EMC Regulations ................................................................... 75

Contents

5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance ................. 78

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 79

5.2 Battery Disposal Information.............................................................. 80

Figures

1. Major Board Components (Top).......................................................... 13

2. Major Board Components (Bottom)..................................................... 15

3. Block Diagram.................................................................................. 17

4. Memory Channel and SO-DIMM Configuration ...................................... 21

5. LAN Connector LED Locations............................................................. 27

6. Thermal Solution and Fan Header ....................................................... 29

7. Location of the Standby Power LED..................................................... 34

8. Detailed System Memory Address Map ................................................ 36

9. Back Panel Connectors ...................................................................... 38

10. Connectors and Headers (Bottom) ...................................................... 39

11. Connection Diagram for Front Panel Header ......................................... 44

12. Connection Diagram for Front Panel USB 2.0 Dual-Port Header............... 45

13. Location of the BIOS Configuration Setup Jumper ................................. 46

14. Board Dimensions............................................................................. 48

15. Localized High Temperature Zones ..................................................... 51

Intel Desktop Board D33217GKE Technical Product Specification

Tables

1. Feature Summary............................................................................. 11

2. Components Shown in Figure 1 .......................................................... 14

3. Components Shown in Figure 2 .......................................................... 16

4. Supported Memory Configurations ...................................................... 19

5. LAN Connector LED States ................................................................. 27

6. Effects of Pressing the Power Switch ................................................... 30

7. Power States and Targeted System Power ........................................... 31

8. Wake-up Devices and Events ............................................................. 32

9. System Memory Map ........................................................................ 37

10. Connectors and Headers Shown in Figure 10........................................ 40

11. PCI Express Full-Mini Card Connector .................................................. 41

12. Dual-Port Front Panel USB 2.0 Header................................................. 42

13. 19 V Internal Power Supply Connector ................................................ 43

14. Front Panel Header ........................................................................... 43

15. States for a One-Color Power LED....................................................... 44

16. BIOS Setup Configuration Jumper Settings .......................................... 47

17. Fan Header Current Capability............................................................ 50

18. Thermal Considerations for Components.............................................. 52

19. Tcontrol Values for Components ......................................................... 52

20. Environmental Specifications.............................................................. 53

21. AccepDrives/Media Types for BIOS Recovery ....................................... 58

22. Boot Device Menu Options ................................................................. 59

23. Master Key and User Hard Drive Password Functions ............................ 60

24. Supervisor and User Password Functions ............................................. 61

25. Front-panel Power LED Blink Codes..................................................... 63

26. BIOS Error Messages ........................................................................ 63

27. Port 80h POST Code Ranges .............................................................. 64

28. Port 80h POST Codes ........................................................................ 65

29. Typical Port 80h POST Sequence ........................................................ 69

30. Safety Standards.............................................................................. 71

31. EMC Regulations............................................................................... 75

32. Regulatory Compliance Marks ............................................................ 79

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