Intersil ISL8201M Bedienungsanleitung

1CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

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Application Note 1386

ISL8201M, ISL8204M, ISL8206M EVAL1Z

Evaluation Board User’s Guide

Table of Contents

General Description....................................................................................................................................................................... 2

Installation..................................................................................................................................................................................... 2

Typical Application Schematic....................................................................................................................................................... 3

Efficiency and Output Ripple/Noise Measurement........................................................................................................................ 4

Schematic ..................................................................................................................................................................................... 5

Bill of Materials.............................................................................................................................................................................. 6

Printed Circuit Board Layer........................................................................................................................................................... 7

List of Figures

Evaluation Board of POL Module.................................................................................................................................................. 2

Quick Start..................................................................................................................................................................................... 3

Quick Start Schematic................................................................................................................................................................... 3

Wide Input Range Schematic........................................................................................................................................................ 3

Efficiency Measurement Schematic.............................................................................................................................................. 4

Equipment Setup for Efficiency Measurement.............................................................................................................................. 4

Output Ripple/Noise Measurement Method.................................................................................................................................. 4

Schematic ..................................................................................................................................................................................... 5

Top-Over Layer (Component Location)......................................................................................................................................... 7

Top Layer (Component Side) ........................................................................................................................................................ 7

Middle-1 Layer............................................................................................................................................................................... 8

Middle-2 Layer............................................................................................................................................................................... 8

Bottom Layer (Component Side)................................................................................................................................................... 9

Bottom-Over Layer (Component Location)................................................................................................................................... 9

List of Tables

Test Equipment List....................................................................................................................................................................... 2

Recommended Operating Specifications...................................................................................................................................... 2

Typical Output Voltage Setting for each Resistance ..................................................................................................................... 2

Bill of Materials.............................................................................................................................................................................. 6

December 23, 2009

AN1386.1

2AN1386.1

December 23, 2009

General Description

This app note covers the ISL8201MEVAL1Z,

ISL8204MEVAL1Z, ISL8206MEVAL1Z evaluation boards.

Since the modules are a pin for pin drop in with all

necessary unique circuitry integrated in the module, the

only difference in the BOM is the ISL8201M, ISL8206M,

or ISL8204M POL modules. We will refer to a generic

eval board, ISL820xMEVAL1Z to cover all three power

modules.

The ISL820xMEVAL1Z POL module evaluation board is

shown in Figure 1. The user can use it to evaluate the

performance of the Intersil ISL8201M, ISL8206M, or

ISL8204M POL modules. This board consists of power

and load connectors for source and load side, switches

for PVCC bias selection and On/Off option, and other

passive components.

The input voltage range is from 1V to 20V, and the

output voltage range is from 0.6V to 5V 5V for the

ISL8201M or 0.6V to 6V for the ISL8204M and

ISL8206M. Additional PVCC bias source is not required

when using an input voltage of 5V or 12V. It can

connect to the input side directly. However, in wider

input ranges, which are above 14V or below 5V, the

PVCC bias needs to add an external source, which

provides operation bias of the module. The output

voltage is initially set at 1.5V for typical evaluation. The

user can easily set the output voltage by changing the

value of R1(refer to Figure 8).

Installation

Recommended Operating Specification

The recommended operating specification for

input/output and PVCC bias range is shown as Table 2.

Table 3 lists the typical application’s various output

voltages and its corresponding resistance.

FIGURE 1. EVALUATION BOARD OF POL MODULE

TABLE 1. TEST EQUIPMENT LIST

EQUIPMENT PART NUMBER

An adjustable DC Power Supply 30V, 15A,

with current limit GW GPC–3060D

An electronic load, capable of sinking 20A Chroma 63030/63010

Four channel oscilloscope and probes Tektronix TDS3014

Tektronix P3010

High Precision Digital Voltage Meter ESCORT 3136A

High Precision Digital Current Meter ESCORT 3136A

TABLE 2. RECOMMENDED OPERATING SPECIFICATIONS

PARAMETER TEST

CONDITIONS MIN TYP MAX UNIT

Input Voltage

Range (VIN)1-20V

Supply Voltage

Range (PVCC) Fixed +5V

Supply 4.5 5.0 5.5 V

Fixed +12V

Supply 9.6 12.0 14.4 V

Wide Range

Supply 6.5 - 14.4 V

Output Voltage

Range (VOUT)ISL8201M 0.6 - 5 V

ISL8204M and

ISL8206M 0.6 - 6 V

CurrentSetting for

VOUT

R1 = 6.49kΩ-1.5- V

Output Current

(Load Current) ISL8201M - - 10 A

ISL8206M - - 6 A

ISL8204M - - 4 A

Current Limit

(PVCC = 12V) ISL8201M

RSEN-IN = 3.57kΩ

-17- A

ISL8206M

RSEN-IN = 4.12kΩ

-8.8- A

ISL8204M

RSEN-IN = 2.87kΩ

-6.6- A

TABLE 3. TYPICAL OUTPUT VOLTAGE SETTING FOR

EACH RESISTANCE

VOUT 0.6V 1.05V 1.2V 1.5V 1.8V 2.5V 3.3V 5V

R1Open 13k 9.76k 6.49k 4.87k 3.09k 2.16k 1.33k

Application Note 1386

3AN1386.1

December 23, 2009

Selecting Switches

Switch S1 selects PVCC bias supply from VIN or an

additional supply source. When S1 is pushed up, the

PVCC bias connects to the input power side. When S1 is

pushed down, the PVCC bias connects to the additional

power supply. For typical applications, the PVCC bias

voltage is +5V (+10%) or +12V (+20%). It can also

supply a wider range from +6.5V to +14.4V.

Switch S2 selects module Enable (On) or Disable (Off).

When S2 is pushed up, the COMP/EN pin of the module is

enabled and the module starts initialization and

operation. When S2 is pushed down, the COMP/EN pin of

the module connects to ground and the module will be

shut down.

Quick Start

The evaluation board can be evaluated simply, as shown

in Figure 2. The power connection of the evaluation

board supplies the input voltage from the DC Power

Supply, and the load connection of the evaluation board

delivers power to the Electronic Load. If the input voltage

is +5V or +12V, the PVCC bias does not require

additional supply and it can connect to the input side

directly by pushing switch S1 to the up state.

Figure 3 shows the ISL820xMEVAL1Z application

schematic for +5V or +12V input voltage. The PVCC pin

can connect to the input supply directly.

Typical Application Schematic

Typical Application with Separated Power

Supply

Figure 4 shows the ISL820xMEVAL1Z application

schematic for a wide input voltage from +1V to +20V.

The PVCC supply can source +5V/+12V or +6.5V to

+14.4V.

SWITCH UP DOWN

S1 VIN +5V/+12V or +6.5V to +14.4V

SWITCH UP DOWN

S2 EN Disable

VIN

+5V/+12V

+6.5V TO +14.4V

VIN

+5V/+12V

+6.5V TO +14.4V

ENABLE

DISABLE

FIGURE 2. QUICK START FOR EVALUATION BOARD

FIGURE 3. QUICK START SCHEMATIC

CPVCC

VIN (+5V/+12V)

CIN

COUT

RSEN-EX

RFB VOUT

COMP/EN

ISET PGND VOUT

PHASE

VIN

PVCC

FIGURE 4. WIDE INPUT RANGE SCHEMATIC

CPVCC

VIN

CIN

COUT

RSEN-EX

RFB VOUT

COMP/EN

ISET PGND VOUT

PHASE

VIN

PVCC

(+1V TO +20V)

PVCC(+5V/+12V OR +6.5V TO +14.4V)

Application Note 1386

4AN1386.1

December 23, 2009

Efficiency and Output

Ripple/Noise Measurement

Figure 5 shows the efficiency measurement schematic for

the ISL820xMEVAL1Z POL module. The voltage and

current meter can be used to measure input/output

voltage and current. In order to obtain an accurate

measurement and prevent the voltage drop of PCB or

wire trace, the voltage meter must be close to the

input/output pin of the POL module.

The efficiency equation is shown in Equation 1:

The equipment setup for the efficiency measurement on

the evaluation board is shown in Figure 6. The measuring

point for the input voltage meter is at the C3terminal,

and the measuring point for the output voltage meter is

at the C8terminal (refer to Figure 9).

Output Ripple/Noise Measurement Method

The total noise is equal to the sum of the ripple and

noise components. Simple steps should be taken to

assure that there is minimum pickup noise due to the

high frequency events, which can be magnified by the

large ground loop formed by the oscilloscope probe

ground. This means that even a few inches of ground

wire on the oscilloscope probe may result in hundreds of

millivolts of noise spikes when improperly routed or

terminated. This effect can be overcome by using the

short loop measurement method to minimize the

measurement loop area for reducing the pickup noise.

The short loop measurement method is shown in

Figure 7. For ISL820xMEVAL1Z evaluation board, the

output ripple/noise measurement point is located at the

C8terminal (refer to Figure 9).

Efficiency Output Power

Input Power

------------------------------------ POUT

----------------VOUT IOUT

•()

VIN IIN

•()

----------------------------------------

=== (EQ. 1)

FIGURE 5. EFFICIENCY MEASUREMENT SCHEMATIC

PVCC

VIN

VOUT

Cin

Cout

RFB RSEN-EX

CPVCC

-DC Source

DC Load

-DC Source

Iin

Vin

Vout

Iout

PGND

COMP/EN VIN

VOUT

PHASE

ISET

PVCC

ELECTRONIC LOAD

Vin

DC POWER SUPPLY

PVCC

DC POWER SUPPLY

Current

Meter

Voltage

Meter

Voltage

Meter

FIGURE 6. EQUIPMENT SETUP FOR EFFICIENCY

MEASUREMENT

SHORT LOOP

MEASUREMENT

METHOD

FIGURE 7. OUTPUT RIPPLE/NOISE

MEASUREMENT METHOD

Application Note 1386

5AN1386.1

December 23, 2009

NOTES:

1. R1is used to set the output voltage of ISL820xMEVAL1Z. Initial setting is 6.49kΩfor 1.5V output voltage.

2. R2and R3, paralleling with R1, are used to adjust the output voltage of ISL820xMEVAL1Z.

3. R4is used to set the overcurrent trip level of ISL820xMEVAL1Z. The ISL8201MEVAL1Z has integrated 3.57kΩ, ISL8206MEVAL1Z has integrated 4.12kΩ, and

ISL8204MEVAL1Z has integrated 2.87kΩ

4. R18, C18 and C19 are the snubber network, which can reduce the stress for internal semiconductor.

5. R13, R14, C12, C13, C14 and C15 are the external compensation network. The ISL820xMEVAL1Z has integrated the type 3 compensation network inside the module

for typical applications.

6. R15, R16, R17, R20, R21, C17, Q2and Q3are the power-up sequence circuit. In case of PVCC bias, power-up first, then input voltage. This circuit has to be implemented.

FIGURE 8. SCHEMATIC

Application Note 1386

6AN1386.1

December 23, 2009

TABLE 4. BILL OF MATERIALS

SYMBOL COMPONENTS DESCRIPTION SUPPLIER

R1 Resistor Chip Resistor 6.49kΩGeneric

R2 Resistor Not installed -

R3 Resistor Not installed -

R4 Resistor Not installed -

R8 Resistor Chip Resistor 10ΩGeneric

R13 Resistor Not installed -

R14 Resistor Not installed -

R15 Resistor Not installed -

R16 Resistor Not installed -

R17 Resistor Not installed -

R18 Resistor Not installed -

R20 Resistor Not installed -

R21 Resistor Not installed -

C1 Capacitor AL Capacitor 220µF/35V SANYO

C1A Capacitor Not installed -

C2 Capacitor Ceramic Capacitor 10µF/25V MURATA/TDK

C3 Capacitor Ceramic Capacitor 10µF/25V MURATA/TDK

C5 Capacitor POS Capacitor 330µF/6.3V SANYO

C5A Capacitor Not installed -

C6 Capacitor Not installed -

C6A Capacitor Ceramic Capacitor 22µF/10V MURATA/TDK

C7 Capacitor Ceramic Capacitor 22µF/10V MURATA/TDK

C7A Capacitor Not installed MURATA/TDK

C8 Capacitor Ceramic Capacitor 22µF/10V MURATA/TDK

C8A Capacitor Not installed -

C9 Capacitor Not installed -

C10 Capacitor Ceramic Capacitor 1µF/25V YAGEO

C11 Capacitor Ceramic Capacitor 1µF/25V YAGEO

C12 Capacitor Not installed -

C13 Capacitor Not installed -

C14 Capacitor Not installed -

C15 Capacitor Not installed -

C17 Capacitor Not installed -

C18 Capacitor Not installed -

C19 Capacitor Not installed -

S1 Switch UT Switch SH

S2 Switch UT Switch SH

Q2 MOSFET Not installed -

Q3 MOSFET Not installed -

U1 Module ISL8201M, ISL8206M, or ISL8204M Intersil

Application Note 1386

7AN1386.1

December 23, 2009

Printed Circuit Board Layers

FIGURE 9. TOP-OVER LAYER (COMPONENT LOCATION)

FIGURE 10. TOP LAYER (COMPONENT SIDE)

Application Note 1386

8AN1386.1

December 23, 2009

FIGURE 11. MIDDLE-1 LAYER

FIGURE 12. ISL820xMEVAL1Z, MIDDLE-2 LAYER

Printed Circuit Board Layers (Continued)

Application Note 1386

Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the

reader is cautioned to verify that the Application Note or Technical Brief is current before proceeding.

For information regarding Intersil Corporation and its products, see www.intersil.com

AN1386.1

December 23, 2009

FIGURE 13. BOTTOM LAYER (COMPONENT SIDE MIRRORED)

FIGURE 14. BOTTOM-OVER LAYER (COMPONENT LOCATION MIRRORED)

Printed Circuit Board Layers (Continued)

Application Note 1386

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