Lantronix Open-Q 865 Bedienungsanleitung

Open-Q™ 865 Development Kit

Quick Start Guide

Your use of this document is subject to and governed by those terms and conditions in the LICENSE AND PURCHASE TERMS AND CONDITIONS FOR INTRINSYC DEVELOPMENT PLATFORM KITS, which you or the legal entity you represent, as the case may be, accept-

ed and agreed to when purchasing a Development Kit from Intrinsyc Technologies Corporation (“Agreement”). You may use this document, which shall be considered part of the defined term “Documentation” for purposes of the Agreement, solely in support of your permitted use of

the Development Kit under the Agreement. Distribution of this document is strictly prohibited without the express written permission of Intrinsyc Technologies Corporation and its respective licensors, which they can withhold, condition or delay in its sole discretion. Lantronix is a

trademark of Lantronix, Inc., registered in the United States and other countries. Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other countries. Qualcomm® is a trademark of Qualcomm® Incorporated, registered in the United States and other

countries. Other product and brand names used herein may be trademarks or registered trademarks of their respective owners.

Package Contents

1. Open-Q 865 Carrier Board compable with Open-Q 865 family of

System-on-Modules (SOM)

2. AC Power Adapter (not shown)

3. CPU Heatsink (not shown)

4. ST Micro Sensor Board (not shown)

SOM SOLD SEPARATELY

1. 12V DC power jack

2. Power source switch (DC/Ba)

3. Baery connector

4. USB 3.0 Type-A Connector

5. Power buon

6. Volume +

7. Volume - / Reset buon

8. General Purpose Buon

9. Audio Headset Jack

10. USB 3.0 Type-C connector

11. USB debug UART Micro B

12. Debug UART Header

13. WLAN/BT Channel 0 Antenna (PCB

trace)

14. Audio I/O expansion header

15. MIPI Camera 3 Connector

16. Coin Cell Baery Holder

17. Power Header

18. MIPI Camera 2 Connector

19. VPH_PWR current sense header

20. MIPI Camera 1 Connector

21. Sensor expansion header

22. System conguraon switches

23. SOM current sense header

24. Micro SD socket*

25. Open-Q LCD Touch Panel (Sold Sepa-

rately)

26. WLAN Channel 1 Antenna (PCB trace)

27. Digital I/O connector

28. SIM Card connector*

29. Audio Output expansion header

30. M.2 PCIe Socket (B-key) *

31. Audio Input expansion header

32. WLAN Channel 1 U.FL Antenna Con-

nector

33. WLAN/BT Channel 0 U.FL Antenna

Connector

34. Qualcomm System-on-Chip (SoC)

with PoP DDR memory on top

35. Open-Q System on Module (Sold

separately)

* On Boom side

Specifications are subject to change - 895-0047-00 Rev. B

10 11

2125 24

31 15

Open-Q™ 865 Development Kit

Quick Start Guide

Specifications are subject to change - 895-0047-00 Rev. B

SOM Installation and Development Kit Setup

CAUTION: The SOM and Dev Kit are susceptible to damage from

static discharge.

1. At a static-safe workstation, remove the development kit board and the SOM

carefully from their antistatic bags. Do not apply power until after following the

steps below to install the SOM, connect the antenna cables, and install the heatsink.

2. SOM Installation: To prevent damage, be gentle while inserting the SOM onto the

carrier board. Ensure that the three board-to-board connectors are properly aligned

between the SOM and carrier board before applying any force. Then apply vertical

force only along both long edges of the SOM above the board-to-board connectors.

Force should be applied on the indicated locations (see figure below) until the SOM

is fully seated on the carrier board connectors. For further information and removal

instructions refer to the Development Kit User Guide document.

3. Antenna Connection: After the

SOM is installed onto the carrier

board, connect the two WLAN/BT

antenna cables (32/33) to the SOM

as shown on page 1. Gently align

the U.FL cable connectors over top

of the corresponding SOM

connectors and then apply gentle

vertical pressure on top until you feel

them click into place.

4. Heatsink Installation: A stick-on

heatsink for the Qualcomm SoC is included with the development kit. It is safe to

operate the SOM without the heatsink installed but the processor performance may

be limited. For better thermal performance, install the heatsink on top of the SoC by

removing the adhesive covering and sticking the heatsink on top of the SoC (34).

5. Power Up: Connect the AC Power Adapter to the 12V DC Jack (1), connect a PC

with serial console program to the USB debug UART connector (11), and then press

and hold the power button (5) until you see the boot indicator LED light (~3

seconds).

6. Further Information: Refer to the SW release notes and Development Kit User

Guide for your specific SOM and SW package for more information about supported

features, connecting peripherals, and how to log in.

Development Kit Support

Documentation and software

To access the documentation (schematics, user guides, datasheets, programming

guides, tech notes…), platform BSP software and much more, please register at:

Technical Support

Should you require more information or assistance, you can contact us at:

https://www.lantronix.com/support

Lantronix also provides technical information and videos on Qualcomm processors

at:

https://www.lantronix.com/resources

Should you require additional technical support for your Development Kit you can

easily purchase a technical support package from the Lantronix store:

http://lantronix.com/embedded-compute-support-packages

Thank you for purchasing an Open-Q 865 Development Kit

The Lantronix Team

http://tech.intrinsyc.com

PRESS HERE

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