LB-Link BL-M8821CS1 Bedienungsanleitung
0
BL-M8821CS1
SPECIFICATION
IEEE 802.11 a/b/g/n/ac 1T1R WLAN with Bluetooth2.1/4.2 with SDIO and
HS-UART MIXED INTERFACE
Version: 1.0
Customer
Date
Model Name BL-M8821CS1
Part NO.
Blink Approve Field
ENGINEER
QC
SALES
Customer Approve Field
ENGINEER
QC
MANUFACTORY
PURCHASING
B-LINK ELECTRONIC CO., LTD in shenzhen
1
Contents
1. General Description .............................................................................................................................. 2
2. The range of applying ........................................................................................................................... 2
3. Product Specification ............................................................................................................................ 2
3.1 Function Block diagram ............................................................................................................................. 2
3.2 Electrical and Performance Specification .................................................................................................. 3
3.3Power Supply DC Characteristics ................................................................................................................ 4
3.4 Product Photo ............................................................................................................................................ 6
3.5 Mechanical Specification ........................................................................................................................... 6
3.6 Product Pin Definition ............................................................................................................................... 7
4. Supported platform .............................................................................................................................. 8
5. Peripheral Schematic Reference Design ................................................................................................ 9
6. Package Information ............................................................................................................................ 9
7. Typical Solder ReflowProfile ................................................................................................................. 9
8. Precautions for use ............................................................................................................................ 10
B-LINK ELECTRONIC CO., LTD in shenzhen
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1. General Description
BL-M8821CS1 is a small size and low profile of WiFi+BT combo module with LGA (Land-Grid Array)
footprint, board size is 12mm*12mm with module height of 2.35mm. It can beeasily manufactured
on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products.
It provides GSPI/SDIO interface for WiFi to connect with host processor and high speed UART
interface for BT. It also has a PCM interface for audio data transmission with direct link to external
audio codec via BT controller. The WiFi data rate can go up to 433.3Mbps in theory by using 1stream
802.11a/b/g/n/ac MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.2.
2. The range of applying
MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP, etc, the device
which need be supported by wireless networking.
3. Product Specification
3.1 Function Block diagram
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3.2 Electrical and Performance Specification
Item Description
BL-M8821CS1Product Name
RTL8821CSMajor Chipset
SDIO 1.1/ 2.0/ 3.0Host Interface
Standard
WiFi: IEEE802.11a, IEEE802.11b, IEEE802.11g, IEEE802.11n, IEEE802.11ac,
BT: BT V2.1 BR+EDR, BT V3.0+HS, BT V4.0 LE+ BR/EDR , BT V4.1, BT V4.2
Frequency Range
Modulation Type
Wifi：802.11b: CCK, DQPSK, DBPSK
802.11a/g: 64-QAM, 16-QAM, QPSK, BPSK
802.11n: 64-QAM, 16-QAM, QPSK, BPSK
802.11ac: 256-QAM, 64-QAM, 16-QAM, QPSK, BPSK
BT: 8DPSK, π /4 DQPSK, GFSK
Working Mode Infrastructure, Ad-Hoc
Data Transfer Rate
Wifi：802.11b: 11, 5.5, 2, 1 Mbps
802.11a/g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps
802.11n: MCS 0 to 7 for HT20/HT40
802.11ac: MCS 0 to 9 for VHT80
BT: 1 Mbps for Basic Rate and LE Mode; 2,3 Mbps for Enhanced Data Rate
Spread Spectrum
IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum)
IEEE 802.11a/g/n/ac:OFDM (Orthogonal Frequency Division Multiplexing)
BT: FHSS(Frequency-Hopping Spread Spectrum)
Sensitivity @PER
WiFi: 11ac: mcs9 VHT80: -58dBm@10%PER
135M:-68dBm@10%PER
54M:-75dBm@10%PER；
11M:-86dBm@10%PER；
6M: -90dBm@10%PER；
1M: -92dBm@10%PER;
BT: -89dBm@1Mbps, -85dBm@2Mbps, -83dBm@3Mbps；
RF Power(Typical)
2.4GWiFi:15.98dBm(Max)
5.2GWiFi:11.98dBm(Max)
5.8GWiFi:9.86dBm(Max)
BT:
4.96dBm(Max)
BLE:3.56dBm(Max)
Connect to the external antenna through the half holeAntenna type
Dimension(L*W*H) 12.0*12.0*2.35mm (LxWxH) ，Tolerance: +-0.15mm
3.3V +/-0.2VPower supply
standby mode 82mA@3.3V ,Power Consumption
TX mode [email protected]
BT:2.402~2.48GHz(BT)
2.4GWIFI:2.412~2.472GHz(USA
11Channels,
Europe
and
others
13 channels)
B5GWIFI:5.18~5.24GHz/5.745~5.825GHz
B-LINK ELECTRONIC CO., LTD in shenzhen
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-10°C to +50°CWorking Temperature
Storage temperature -40°C to +85°C
3.3Power Supply DC Characteristics
Vcc=3.3V，Ta= 25 °C，unit: mA
MaxSupply current Typ.
8982Standby (RF disabled)
802.11b 1Mbps 11Mbps
Max.Typ.Max.Typ.Supply current
335350TX mode 330 320
RX mode 90 969295
802.11g 6Mbps 54Mbps
Max.Typ.Max.Typ.Supply current
TX mode 235250 120 110
RX mode 98959490
802.11n HT20 MCS0 MCS7
Max.Typ.Max.Typ.Supply current
105115230240TX mode
99989490RX mode
802.11n HT40 MCS0 MCS7
Max.Typ.Max.Typ.Supply current
100110225235TX mode
RX mode 90 999895
802.11ac VHT80 MCS0 MCS9
Max.Typ.Max.Typ.Supply current
105115155166TX mode
RX mode 90 95 98 99
B-LINK ELECTRONIC CO., LTD in shenzhen
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3.4 Product Photo
TOP Bottom
3.5 Mechanical Specification
Tolerance: +-0.15mm
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3.6 Product Pin Definition
1 GND Grond
2 WIFI/BT_ANT WIFI/BT_ANT
3 GND Grond
4,5 NC NC
6 BT_WAKE HOST wake-up Bluetooth device
7 BT_HOST_WAKE Bluetooth device to wake-up HOST
8 NC NC
9 VABT Battery LDO input,5.5V-2.8V
10,11 NC NC
12 WL_DSI#
Shared with GPIO9 This Pin Can Externally Shutdown the
RTL8821CS
WLAN function when WL_DIS# is Pulled Low. When this
pin pulled low, SDIO interface will be disabled.
13 WL_HOST_WAKE WLAN to wake-up HOST
14 SD_D2 SDIO data line 2
15 SD_D3 SDIO data line 3
16 SD_CMD SDIO command line
17 SD_CLK SDIO CLK line
18 SD_D0 SDIO data line 0
19 SD_D1 SDIO data line 1
20 GND Grond
21 NC NC
22 VDD_IO supply voltage for SDIO IO/3.3V
Pin No： Function Description
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23 NC NC
24 SUSCLK_IN Shared with EECS. External 32K or RTC clock input
25 PCM_DOUT PCM Data output
26 PCM_CLK PCM Clock
27 PCM_DIN PCM data input
28 PCM_SYNC PCM sync signal
29,30 NC NC
31 GND Grond
32 NC NC
33 GND Grond
34 BT_DIS#
Shared with GPIO11 This Pin Can Externally Shutdown
the RTL8821CS
WLAN function when BT_DIS#is Pulled Low. When this
pin pulled low, UART interface will be also disabled.
35 NC NC
36 GND Grond
37,38,39,40 NC NC
41 UART_RTS UART_RTS
42 UART_OUT HOST Data output
43 UART_IN HOST Data input
44 UART_CTS UART_CTS
4. Supported platform
Operating System CPU Framework Driver
LINUX(kernel2.6.35~3.18.17) ARM, MIPSII Enable
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5. Peripheral Schematic Reference Design
6. Package Information
B-LINK ELECTRONIC CO., LTD in shenzhen
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7. Typical Solder ReflowProfile
8. Precautions for use
1. Pls handle the module under ESD protection.
2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature
245℃.
3.Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity
< 70% RH, over 96 hours.
Baking condition: 125 degree C, 12 hours
Baking times: 1 time
4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The
calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity
indicator cards must be blue, <30%.
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