Lex System 2I640DW Bedienungsanleitung

2I640DW

Intel Elkhart Lake ATOM® x6413E / J6412 SoC CPU,

DDR4 SODIMM,

3 x LAN / HDMI / USB / COM / M.2

All-In-One

Intel Elkhart Lake ATOM® x6413E / J6412 SoC CPU

2 x HDMI, eDP, 2 x M.2, 3 x LAN, 1 x Nano SIM

USB, COM, Wide Range DC-IN 9~24V

NO. 2I640DW

Release date: JUNE. 10. 2022

RISK OF EXPLOSION IF BATTERY IS REPLACED

BY AN INCORRECT TYPE.

DISPOSE OF USED BATTERIES ACCORDING

TO THE INSTRUCTIONS

CAUTION

2I640DW

Warning!...........................................................................................................................

Hardware Notice Guide .............................................................................................

CHAPTER 1 GENERAL INFORMATION ........................................................................

1-1 MAJOR FEATURE........................................................................................................

1-2 SPECIFICATION ..........................................................................................................

1-3 INSTALLING THE SO-DIMM ........................................................................................

1-3-1 REMOVING THE SO-DIMM ......................................................................................

1-4 DIRECTIONS FOR INSTALLING THE M.2 B KEY MINI CARD ...................................

CHAPTER 2 HARDWARE INSTALLATION ....................................................................

2-1 DIMENSION-2I640DW ................................................................................................

2-2 LAYOUT-2I640DW-CONNECTOR AND JUMPER .......................................................

2-2-1 LAYOUT-2I640DW-CONNECTOR AND JUMPER BOT ............................................

2-3 LAYOUT-2I640DW-FUNCTION MAP TOP ...................................................................

2-3-1 LAYOUT-2I640DW-FUNCTION MAP BOT ...............................................................

2-4 DIAGRAM-2I640DW TOP ............................................................................................

2-4-1 DIAGRAM-2I640DW BOT .........................................................................................

2-5 FUNCTION MAP-2I640DW TOP ..................................................................................

2-5 FUNCTION MAP-2I640DW BOT ..................................................................................

2-6 LIST OF JUMPERS ......................................................................................................

2-7 JUMPER SETTING DESCRIPTION ............................................................................

2-8 JSB1: CMOS DATA CLEAR .........................................................................................

2-9 JAT1: POWER IN ALWAYS ON FUNCTION ...............................................................

2-10 JVL1: eDP PANEL POWER SELECT ........................................................................

CHAPTER 3 CONNECTION ..........................................................................................

3-1 LIST OF CONNECTORS..............................................................................................

3-2 CMOS BATTERY CONNECTOR .................................................................................

3-3 USB INTERFACE .........................................................................................................

3-4 LAN INTERFACE .........................................................................................................

3-5 COM INTERFACE ........................................................................................................

3-6 FRONT PANEL PIN HEADER ......................................................................................

3-7 DIO INTERFACE ..........................................................................................................

3-7-1 IO DEVICE: F75111 CIO UTILITY .............................................................................

3-7-2 IO DEVICE: F75111 CIO UTILITY CIO116 ................................................................

3-8 CO1: I2C 1x4 PIN (1.25mm) WAFER ...........................................................................

3-9 CPI1: DC POWER INPUT 1x4 PIN (2.0mm) WAFER (RED) .......................................

3-10 DISPLAY INTERFACE ...............................................................................................

3-11 SIM1: NANO SIM CARD PUSH-PUSH ......................................................................

3-12 NGFF1: PCI EXPRESS M.2 B KEY 2242 H=8.5 SOCKETS 75PIN ..........................

Contents

3-13 NGFF2: PCI EXPRESS M.2 B KEY 2242 / 3042 H=8.5 SOCKETS 75PIN ...............

3-14 CRFP1: ANTENNA CONTROL 1x4 PIN (1.25mm) WAFER (OEM) ....................................

CHAPTER 4 INTRODUCTION OF BIOS ........................................................................

4-1 ENTER SETUP ............................................................................................................

4-2 BIOS MENU SCREEN & FUNCTION KEYS ................................................................

4-3 GETTING HELP ...........................................................................................................

4-4 MENU BARS ................................................................................................................

4-5 MAIN ............................................................................................................................

4-6 ADVANCED ..................................................................................................................

4-6-1 BOOT CONFIGURATION .........................................................................................

4-6-2 SOC CONFIG CONFIGURATION .............................................................................

4-6-2-1 ACPI SETTINGS ....................................................................................................

4-6-2-2 SYSTEM AGENT (SA) CONFIGURATION ............................................................

4-6-2-3 PCH-IO CONFIGURATION ...................................................................................

4-6-2-3-1 PCI EXPRESS CONFIGURATION .....................................................................

4-6-2-3-2 SATA CONFIGURATION ....................................................................................

4-6-2-4 PCH-FW CONFIGURATION .................................................................................

4-6-3 SIO F81804 ...............................................................................................................

4-6-3-1 UART PORT 1 CONFIGURATION .........................................................................

4-6-3-2 UART PORT 2 CONFIGURATION .........................................................................

4-6-3-3 HARWARE MONITOR ...........................................................................................

4-6-3-4 RESTORE ON POWER LOSS ..............................................................................

4-6-4 NVM EXPRESS INFORMATION ..............................................................................

4-7 SECURITY ...................................................................................................................

4-8 POWER .......................................................................................................................

4-9 BOOT ...........................................................................................................................

4-10 SAVE & EXIT .............................................................................................................

4-11 HOW TO UPDATE INSYDE BIOS ..............................................................................

APPENDIX B: RESOLUTION LIST ....................................................................................

This manual is copyrighted and all rights are reserved. It does not allow any non

authorization in copied, photocopied, translated or reproduced to any electronic or machine

readable form in whole or in part without prior written consent from the manufacturer.

In general, the manufacturer will not be liable for any direct, indirect, special, incidental

or consequential damages arising from the use of inability to use the product or

documentation, even if advised of the possibility of such damages.

The manufacturer keeps the rights in the subject to change the contents of this manual

without prior notices in order to improve the function design, performance, quality, and

reliability. The author assumes no responsibility for any errors or omissions, which may

appear in this manual, nor does it make a commitment to update the information contained

herein.

Trademarks

Intel is a registered trademark of Intel Corporation.

Insyde is a registered trademark of Insyde Software, Inc.

All other trademarks, products and or product's name mentioned here are for

identiﬁ cation purposes only, and may be trademarks and / or registered trademarks

of their respective companies or owners.

User Manual edition 0.1, JUNE. 2022

Warning !

1. Battery

Batteries on board are consumables.

The life time of them are not guaranteed.

2. Fanless solution with HDD

The speciﬁ cation & limitation of HDD should be considered carefully when

the fanless solution is implemented.

3. We will not give further notiﬁ cation in case of changes of

product information and manual.

4. SATA interface does not support Hot SWAP function.

5. There might be a 20% inaccuracy of WDT at room temperature.

6. Please make sure the voltage speciﬁ cation meets the requirement

of equipment before plugging in.

8. Caution! Please notice that the heat dissipation problem could cause the MB

system unstable. Please deal with heat dissipation properly when

buying single MB set.

9. Please avoid approaching the heat sink area to prevent users from

being scalded with fanless products.

12. It is important to install a system fan toward the CPU to decrease

the possibility of overheating / system hanging up issues,

or customer is suggested to have a ﬁ ne cooling system to dissipate heat

from CPU.

11. DO NOT apply any other material which may reduce cooling

performance onto the thermal pad.

10. If users repair, modify or destroy any component of product unauthorizedly,

We will not take responsibility or provide warranty anymore.

7. There are two types of SSD, commercial grade and industrial grade, which

provide diﬀ erent read/write speed performance, operation temperature and

life cycle. Please contact sales for further information before making orders.

Hardware Notice Guide

1. Before linking power supply with the motherboard, please attach DC-in adapter to

the motherboard ﬁ rst. Then plug the adapter power to AC outlet.

Always shut down the computer normally before you move the system unit or

remove the power supply from the motherboard. Please unplug the DC-in adapter ﬁ rst

and then unplug the adapter from the AC outlet.

Please refer photo 1 as standard procedures.

2. In case of using DIRECT DC-in (without adapter), please check the allowed range

for voltage & current of cables. And make sure you have the safety protection for

outer issues such as short / broken circuit, overvoltage, surge, lightning strike.

3. In case of using DC-out to an external device, please make sure its voltage and

current comply with the motherboard speciﬁ cation.

4. The total power consumption is determined by various conditions

(CPU / motherboard type, device, application, etc.). Be cautious to the power cable

you use for the system, one with UL standard will be highly recommended.

5. It’s highly possible to burn out the CPU if you change / modify any parts of

the CPU cooler.

6. Please wear wrist strap and attach it to a metal part of the system unit

before handling a component. You can also touch an object which is

ground connected or attached with metal surface if you don't have wrist strap.

7. Please be careful to handle & don't touch the sharp-pointed components on

the bottom of PCBA.

8. Remove or change any components form the motherboard will VOID the warranty of

the motherboard.

9. Before you install / remove any components or even make any jumper setting

on the motherboard, please make sure to disconnect the power supply ﬁ rst.

(follow the aforementioned instruction guide)

10. "POWERON after PWR-Fail" function must be used carefully as below:

When the DC power adaptor runs out of power, unplug it from the DC current;

Once power returns, plug it back after 5 seconds.

If there is a power outage, unplug it from the AC current, once power returns,

plug it back after 30 seconds. Otherwise it will cause system locked or made

a severe damage.

Remark 1:

Always insert / unplug the DC-in horizontally & directly to / from the motherboard.

DO NOT twist, it is designed to ﬁ t snugly.

Moreover, erratic pull / push action might cause an unpredictable damage to the

component & system unit.

Photo 1 Insert

Unplug

Chapter-1

General Information

The 2I640DW is a 2.5" (110 x 98 mm) motherboard powered with Intel Atom® x6000E

series and Celeron® J (formerly Elkhart Lake) processor & oﬀ ered the ideal platform for

high performance applications. The ultra compact (110 x 98 mm) motherboard with wide

range 9~24V DC power input & embeds multiple Intel GbE LAN, USBs, COM Ports and

HDMI display interface that oﬀ er the ideal platforms for high performance applications in

Networking, Smart Automation, Machine Vision, In-vehicle, Industry 4.0 and any compact

high-performance Internet of Things (IoT) applications.

The 2I640DW supports high-speed data transfer interfaces such as PCIe gen3, USB 3.0,

and SATA 6 Gb/s (SATA III) for SATA-SSD interface M.2 B-Key device, with one-channel

DDR4 3200 MHz memory up to 32GB SODIMM slot and supports two serial ports RS232 /

RS485 / RS422 jumper free auto switch by BIOS. It supports 2 ports of USB 3.0, 3 ports of

USB 2.0. The expandable interfaces include 1 M.2 B-Key for PCIe x 2 or SATA-SSD (auto-

detection) and USB interface, and 1 M.2 B-Key PCIe x 2 and USB 3.0 / 2.0 interface.

The embedded motherboard 2I640DW is specially designed with Wide-Range Voltage DC

in (9~24V) for widely varying input voltage requirement. All wafer IO design oﬀ ers superb

performance and PC speciﬁ cation in the industry using the speciﬁ c housing. It supports

with three 10 / 100 / 1000 Mbps Ethernet for seamless broadband connectivity. With

Wake-On LAN function and the PXE function in BIOS, these are perfect control boards for

networking devices.

1. Intel® Atom x6413E Processor 1.5GHz / 2.7GHz (Quad Core),

Intel® Celeron Processor J6412 2.0GHz / 2.6GHz (Quad Core)

2. Intel® UHD Graphics for 10th Gen Intel® Atom x6413E 500MHz /

750MHz, Intel® Celeron J6412 400MHz / 800MHz

3. DDR4 SODIMM slot x 1, up to 32GB

4. Support 3 x 10 / 100 / 1000 Mbps Intel LAN ports.

5. Support 2 x RS232 selectable to RS485 / RS422 by BIOS

6. 2 x USB 3.0 and 3 x USB 2.0

7. Support extended 1 x M.2 B-Key for PCIe x 2 / SATA-SSD (auto-detect) and USB

interface, 1 x M.2 B-Key for PCI2 x 2 and USB 3.0 / 2.0 interface with Nano SIM.

8. Hardware digital Input & Output, 4 x DI / 4 x DO, Hardware Watch Dog Timer,

0~255 sec programmable

9. Wide Range DC IN +9V~24V

1-1 Major Feature

1. SOC: Intel® Atom x6413E Processor 1.5GHz / 2.7GHz (Quad Core),

Intel® Celeron Processor J6412 2.0GHz / 2.6GHz (Quad Core)

2. Memory: DDR4 SODIMM slot x 1, up to 32GB

3. Graphics: Intel® UHD Graphics for 10th Gen Intel® Atom x6413E 500MHz / 750MHz,

Intel® Celeron J6412 400MHz / 800MHz

4. LAN: 3 Intel I211-IT LAN chipset with 10 / 100 / 1000 Mbps for PCIe x 1 V2.1

5. l/O Chip: Switch chipset for 2 ports RS232 / RS422 / RS485 selected by BIOS

6. USB: 2 type A USB 3.0, 3 USB 2.0

7. WDT / DIO: Hardware digital Input & Output, 4 x DI / 4 x DO (Option) /

Hardware Watch Dog Timer, 0~255 sec programmable

8. Expansion interface: one M.2 B-Key for PCIe x 2 / SATA-SSD (auto-detect) and

USB interface, one M.2 B-key for PCIe x 2 and USB 3.0 / 2.0 interface with Nano SIM

9. BIOS: Insyde UEFI BIOS

10. Dimension: 110 x 98 mm

11. Power: On board DC +9~24V

1-2 Speciﬁ cation

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